Fujitsu Corporation

Fujitsu Limied

Takahiro Ooi

Tetsuro Yamada

Akiko Matsui

Kohei Choraku

Yoshiyuki Hiroshima

Takahide Mukoyama

Mitsuhiko Sugane

Yoshihiro Morita

Naoki Nakamura

Masahiro Iwama

Michihiro Takamatsu

Daisuke Usui

Yoshinori Mesaki

Mitsuo Suehiro

Takahide Mukouyama

Misuhiko Sugane

An inter-lens adjusting method includes: fitting a plurality of fitting portions to a plurality of fitted portions, wherein each of the plurality of fitting portions is provided on the side of a first lens for collimating light emitted from a light emitting device and includes at least one of a convex portion and a concave portion and each of the plurality of fitted portions is provided on the side of a second lens for aggregating the light collimated by the first lens and has a shape to be fitted to a corresponding one of the plurality of fitting portions; and adjusting a position between the first lens and the second lens such that the light emitted from the light emitting device is aggregated into an optical fiber ferrule via the first lens and the second lens.

Inter-lens adjusting method and photoelectric hybrid substrate

A placement apparatus for an optical component includes: a suction nozzle that includes a nozzle main body having a suction surface having a suction port, an optical component being sucked to the suction port, a plurality of nozzle electrodes disposed on the suction surface, each of the nozzle electrodes being brought into contact with a corresponding one of a plurality of component electrodes provided on the optical component so as to establish electrical conduction between each of the plurality of nozzle electrodes and a corresponding one of the plurality of component electrodes.

Placement apparatus and a suction nozzle for an optical component

A method of manufacturing a photoelectric composite substrate, includes: aligning and fixing an optical element having a solder terminal to an optical waveguide for forming a path of an optical signal on a printed circuit board; mounting the optical waveguide, to which the optical element is fixed, on the printed circuit board; and welding the solder terminal to an electrode of a package installed on the printed circuit board or an electrode of the printed circuit board.

Method of manufacturing photoelectric composite substrate

A photoelectric hybrid board includes: a first board on which a circuit is formed; an optical waveguide layer stacked with the first board; a first optical waveguide section formed in a direction of stacking in the first board and the optical waveguide layer; and a concave part formed, from the optical waveguide layer side, in the optical waveguide layer in an intersection part of the optical waveguide layer and the first optical waveguide section.

Photoelectric hybrid board, information processor, and method for manufacturing photoelectric hybrid board

An electronic device includes a board including an electronic component, a plurality of optical interface units that include an optical element which input or output light and that are provided on the board, and a plurality of individual positioning units that position a plurality of respective optical waveguides which are separate from each other at least at tip portions on a side of the optical interface units and which are optically aligned with the optical element with respect to the optical interface units independently from each other.

Electronic device and optical connector

A method for manufacturing an optical transmission device, includes: arranging a plurality of optical waveguides including waveguide mirrors, a transmission-side optical module and a reception-side optical module on one side of a substrate; photographing, with a photographic device, at least one waveguide mirror, and the transmission-side optical module or the reception-side optical module corresponding to the waveguide mirror, from another side of the substrate via an opening formed in the substrate; detecting optical-axis centers of the transmission-side optical module or optical-axis centers of the reception-side optical module, and central positions of reflective surfaces of the waveguide mirrors corresponding to the detected optical-axis centers, from a result of the photographing; and aligning and fixing a position relationship between the optical waveguides and the transmission-side optical module or the reception-side optical module based on a result of the detecting.

Method and device for manufacturing optical transmission device, and optical transmission device

An optical coupling structure includes a light source that emits light; and an optical waveguide that has on a given end, a mirror surface that reflects the light emitted from the light source, the optical waveguide guiding the light reflected by the mirror surface to another end. In the optical coupling structure, a traveling direction of the light emitted from the light source is inclined toward the given end of the optical waveguide and is, with respect to a normal line of the mirror surface, at an angle that is greater than 45 degrees and that satisfies a condition for complete reflection of light on the mirror surface and a condition for complete reflection of light in the optical waveguide.

Optical coupling structure and optical transmission apparatus

An electronic device includes an electronic component including a plurality of terminals and a circuit board on which the electronic component is mounted. The circuit board includes a board body, a plurality of electrode pads arranged on the board body, each of the electrode pads being connected to each of the terminals by solder, a first solder resist formed on the board body and having a plurality of first openings, each of the first openings accommodating each of the electrode pads, and a second solder resist formed on the first solder resist and having a plurality of second openings, each of the second openings being larger than each of the first openings and communicating with each of the first openings.

Circuit board and electronic device

A wiring substrate includes an insulation layer including a thermosetting resin and a reinforcement member having plural first fiber bundles and plural second fiber bundles woven together, the second fiber bundles being intersected with the first fiber bundles, and a pair of differential wirings arranged alongside each other on the insulation layer. The first fiber bundles and the second fiber bundles have a curved portion relative to a plan direction of the insulation layer in a region on which the pair of differential wirings is arranged.

Wiring substrate and method for manufacturing the wiring substrate

A light emitting member mounting method includes: causing a friction material to contact a substrate including at least an optical waveguide member mounted on a base and to contact a light emitting member that is to be mounted to the substrate and that is equipped with a light emitting component, so as to suppress relative movement between the substrate and the light emitting member using frictional force exerted on the substrate and the light emitting member, and positionally aligning the light emitting member to the substrate by employing light emitted from the light emitting component; and bonding the substrate and the light emitting member together by melting a bonding material interposed between the substrate and the light emitting member.

Light emitting member mounting method and apparatus

A wiring substrate includes differential wirings; a first insulating layer adjacent to one side of the differential wirings, including first fiber bundles parallel to the differential wirings; a second insulating layer adjacent to another side of the differential wirings, including second fiber bundles parallel to the differential wirings and disposed by the same pitch as the first fiber bundles; a third insulating layer on the first insulating layer on a side opposite to the differential wirings, including third fiber bundles in parallel to the differential wirings; and a fourth insulating layer on the second insulating layer on a side opposite to the differential wirings, including fourth fiber bundles in parallel to the differential wirings. Intervals of the third and fourth fiber bundles are respectively narrower than intervals of the first and second fiber bundles. The differential wirings are disposed between adjacent first fiber bundles, and between adjacent second fiber bundles.

Wiring substrate

A printed wiring board manufacturing method includes weaving a glass fiber cloth with warp and weft yarns such that the warp and weft yarns are visually distinguishable at least a region. The glass fiber cloth is impregnated with a resin to fabricate a substrate. A copper foil is formed on at least one surface of the substrate to fabricate a core substrate. The copper foil is removed within the region on the core substrate to form an opening. A pitch between the warp yarns or between the weft yarns which are presented in the opening is detected. A pitch between a pair of differential wirings to be patterned is determined based on the detected pitch between the warp yarns or between the weft yarns. The pair of differential wirings is patterned on the core substrate in accordance with the determined pitch between the pair of differential wirings.

Printed wiring board manufacturing method

A printed board includes an insulating body that has a flat surface and includes insulating cloth including first fibers and second fibers that cross the first fibers at right angles on the flat surface, and printed wiring including a plurality of signal lines that run parallel to each other and are laid out on the flat surface of the insulating body so that a direction of the signal lines is tilted to a direction of the first or second fibers at an angle which is determined based on board-cutting efficiency of the insulating body and a predetermined delay-time difference between the signal lines.

Growing community of inventors

Kawasaki, Japan

Takahiro Ooi