Sony Corporation

Renesas Electronics Corporation

Hitachi, Ltd.

Renesas Technology Corp.

Sony Semiconductor Solutions Corporation

Tessera Advanced Technologies, Inc.

Hitachi Microcomputer System, Ltd.

Hitachi Ulsi Systems Co., Ltd.

Takahiro Naito

Naotaka Tanaka

Yasuhiro Yoshimura

Takashi Akazawa

Yoshiyuki Kado

Toshihiko Sato

Michihiro Kawashita

Takafumi Kikuchi

Hikaru Ikegami

Ikuo Yoshida

Satoshi Imasu

Yasuhiro Naka

Hiromichi Suzuki

Kunihiro Tsubosaki

Kazunari Suzuki

Sueo Kawai

Yoshinori Miyaki

Hiroyuki Watanabe

Hiroaki Yokota

Kirio Masui

Nobuhiko Shigyo

Koichi Maruta

Daisuke Ide

Yujiro Kajihara

Hajime Sato

Hideo Miura

Masachika Masuda

Gen Murakami

Hiroshi Kuroda

Osamu Ozawa

Yasushi Katayama

Hitoshi Takahashi

Takuro Hibino

Tatsuki Nishino

Toshihiko Akiba

Wahei Kitamura

Kenzo Nakajima

Tatsuo Kuroiwa

Yusuke Tsujita

Miho Yamada

Kenichi Tayu

Yoshinari Hayashi

Toshikazu Ishikawa

Kazuyuki Taguchi

Norio Kishikawa

Keita Komagata

Provided is a low voltage and compact digital control regulator that achieves enhanced stability and reduced variations in ripple voltage and droop characteristics. The digital control regulator includes a first A/D converter configured to generate a first digital signal according to a differential voltage between an output voltage and a first reference voltage, an output stage circuit configured to generate the output voltage, a replica circuit having the same circuit configuration as the output stage circuit and configured to output a replica voltage related to the output voltage, a second A/D converter configured to generate a second digital signal according to a differential voltage between the replica voltage and a second reference voltage, and a control circuit configured to generate a control signal for controlling a gain of the output stage circuit, according to the first digital signal and the second digital signal.

Digital control regulator

To provide a voltage control device that includes a power supply circuit that supplies electric power to an input terminal of a controlled circuit, a power supply voltage control circuit that controls the power supply voltage to be supplied from the power supply circuit to the controlled circuit, on the basis of the clock signal to be supplied to the controlled circuit, and a clock generation circuit that receives a power supply that is the internal voltage to be applied to a second internal circuit region at a second wiring distance from the input terminal, and generates the clock signal on the basis of the internal voltage, the second wiring distance being longer than a first wiring distance at which a first internal circuit region is located in the controlled circuit, the first wiring distance and the second wiring distance being wiring distances in the controlled circuit from the input terminal.

Voltage control device

To provide a digitally controlled LDO regulator that can control an output voltage even during an auto-zero processing period. A digitally controlled low dropout regulator is provided that includes a plurality of AD converters and an impedance variable circuit, each of the plurality of AD converters including a comparator, in which a first signal from each of the plurality of AD converters is input to the impedance variable circuit; a second signal output from the impedance variable circuit is input to one of two terminals of each of the plurality of AD converters; when one of the plurality of AD converters is in operation, another of the plurality of AD converters performs auto-zero processing to set a voltage value used as a reference; and the comparator compares a voltage value of the second signal input to the one of the two terminals with the set voltage value.

Digitally controlled low dropout regulator

An electric circuit according to one embodiment of the present technology includes a target circuit and an auxiliary circuit. The target circuit includes an output portion from which predetermined output power is output, and an application point to which a voltage corresponding to the output power is applied to output the output power. The auxiliary circuit has impedance lower than impedance of the target circuit, and outputs the voltage corresponding to the output power to the application point as an auxiliary voltage.

Electric circuit and electronic apparatus

An electronic circuit according to one aspect of the present technology includes an MOS circuit portion and a stabilizing element portion. The MOS circuit portion includes a deep well. The stabilizing element portion includes a first element portion arranged between a power supply source and the deep well, and stabilizes a potential of the deep well.

Electronic circuit and electronic device

Television receiver

[Object] To reduce power consumption of a DC-DC converter. [Solution] A voltage conversion circuit includes a voltage generation unit, a stop control unit, a current supply unit, and an intermittent control unit. The voltage generation unit generates an output voltage on the basis of a current when the current is supplied. The stop control unit outputs a signal for stopping the supply of the current. The current supply unit supplies the current to the voltage generation unit until the signal is output. The intermittent control unit operates the stop control unit during a supply period of the current and stops the stop control unit when the signal is output.

Voltage conversion circuit, electronic device, and method of controlling voltage conversion circuit

In a semiconductor device in which a plurality of semiconductor chips are stacked, performance is enhanced without deteriorating productivity. The semiconductor device has a first semiconductor substrate having a first surface and a second surface opposite the first surface, a first insulating film formed on the first surface, a first hole formed in the first insulating film and partially extending into the first semiconductor substrate, a second hole formed in the second surface, a first electrode entirely filling the first hole, and a conductive film conformally formed in the second hole. The conductive film is electrically connected to a bottom surface of the first electrode and leaves a third hole in the first semiconductor substrate open. The third hole is configured to receive a second electrode of a second semiconductor substrate.

Semiconductor device and method of manufacturing same

Of three chips (A), (B), and (C) mounted on a main surface of a package substrate () in a multi-chip module (MCM), a chip (A) with a DRAM formed thereon and a chip (B) with a flash memory formed thereon are electrically connected to wiring lines () of the package substrate () through Au bumps (), and a gap formed between main surfaces (lower surfaces) of the chips (A), (B) and a main surface of the package substrate () is filled with an under-fill resin (). A chip (C) with a high-speed microprocessor formed thereon is mounted over the two chips (A) and (B) and is electrically connected to bonding pads () of the package substrate () through Au wires ().

Semiconductor device and manufacturing method thereof

In a semiconductor device in which a plurality of semiconductor chips are stacked, performance is enhanced without deteriorating productivity. The semiconductor device has a plurality of elements, an interlayer insulating film, a pad, and a bump electrode electrically connected with the pad sequentially formed on a main surface of a silicon substrate and has a back-surface electrode formed on a back surface of the silicon substrate and electrically connected with the bump electrode. The bump electrode has a protruding portion penetrating through the pad and protruding toward the silicon substrate side. The back-surface electrode is formed so as to reach the protruding portion of the bump electrode from the back surface side of the silicon substrate toward the main surface side and to cover the inside of a back-surface electrode hole portion which does not reach the pad, so that the back-surface electrode is electrically connected with the bump electrode.

Speaker

Semiconductor device and method of manufacturing the same

Growing community of inventors

Kodaira, Japan

Takahiro Naito