Panasonic Intellectual Property Management Co., Ltd.

Takahiro Miyai

Shogo Okita

Toshihiro Wada

Naoaki Takeda

Yoshiyuki Wada

Toshiyuki Takasaki

Seiya Nagano

A disclosed plasma processing apparatusincludes: a chamberhaving an opening; a stagedisposed in the chamber, the stage for placing an object to be processed; a dielectric memberclosing the opening; and a plasma generation unitdisposed on the opposite side to the chamberwith reference to the dielectric member, and configured to, when applied with a high-frequency power, generate a plasma in the chamber. The plasma generation unithas a first coilincluding one or a plurality of first conductorsconnected in parallel with each other, and a second coildisposed so as to surround the first coiland including a plurality of second conductorsconnected in parallel with each other. The number of the second conductorsis greater than the number of the first conductors

Plasma processing apparatus

Disclosed is a plasma processing apparatusincluding a chamber, a stage, a dielectric member, a cover, a gas introduction path, and an induction coil. The induction coilincludes a first induction coilinstalled so as to overlap a central region Rof the dielectric member, and a second induction coilinstalled so as to overlap a peripheral region Routside the central region Rof the dielectric member. The coverhas a first gas holeformed at a position overlapping the central region Rand a second gas holeformed at a position overlapping the peripheral region R. The gas introduction pathhas a first gas introduction pathcommunicating with the first gas holeand a second gas introduction pathcommunicating with the second gas hole

Plasma processing apparatus and method for using plasma processing apparatus

Provided is a plasma processing apparatus which comprises a chamber, a stage configured to set a holding sheet and a substrate held thereon, a securing mechanism configured to secure the holding sheet on the stage, a plasma generator including a first electrode and a first high-frequency power supply, and a determiner for determining a contact status between the holding sheet and the stage, wherein a gas through-hole is arranged on a surface of the stage in an annular region defined between an inner edge of a frame set on the stage and an outer edge of the substrate, and wherein the determiner is configured to determine the contact status in accordance with a pressure of a gas in the gas introduction conduit and/or a regulation data for regulating the pressure of the gas, the gas being introduced between the stage and the holding sheet from the gas through-hole.

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Tokyo, Japan

Takahiro Miyai