Fuji Electric Co., Ltd.

Takahiro Mitsumoto

Motohito Hori

Akira Iso

Akira Hirao

A semiconductor device includes a wiring board that includes a first insulating layer, a first conductive layer arranged over the first insulating layer, a second conductive layer arranged under the first insulating layer, the wiring board further including a magnetic layer that is arranged between the first insulating layer and the first or second conductive layer and that has a higher specific magnetic permeability than the first and second conductive layers, and a carbon layer that is arranged between the first insulating layer and the first or second conductive layer and that has a higher thermal conductivity in a planary direction than the first and second conductive layers; a semiconductor chip electrically connected to the first and second conductive layers; and an insulating circuit board arranged separately from the wiring board and that has the semiconductor chip mounted thereon.

Semiconductor device

In order to prevent breakage of a nut holder that holds a nut, a semiconductor apparatus includes a main terminal connected to an external conductor by a screw, a nut into which a tip of the screw is screwed, and a nut holder. The nut holder includes a recess holding the nut therein, and a peripheral wall surrounding the recess and having an opening. The peripheral wall is discontinuous at a position at which the opening is formed.

Semiconductor apparatus

A semiconductor device is provided comprising a semiconductor element, a case portion housing the semiconductor element and having an opening end on at least some of wall portion, a lid portion covering the opening end of the case portion, and a sealing material sealing the semiconductor element inside the case portion, where a projection portion or a dent portion is provided on a surface of the wall portion close to the sealing material between the opening end and the sealing material. The Purpose is to prevent an oil leakage from a semiconductor device. Also, instead of the projection portion or the dent portion, a semiconductor device is provided with a liquid receiving portion that receives a liquid dripping from the opening end on a surface facing away from the sealing material.

Growing community of inventors

Kawasaki, Japan

Takahiro Mitsumoto