Jsw Aktina System Co., Ltd.

Takahiro Mikami

Yuki Suzuki

Yoshihiro Yamaguchi

Takahiro Fuji

Daisuke Hayashi

Ryo Shimizu

A substrate-floatation-type laser processing apparatus and a method for measuring a floating height, capable of improving performance of laser processing are provided. A substrate-floatation-type laser processing apparatus according to an embodiment includes a stage configured to float and convey a substrate, and a floating-height measurement apparatus configured to measure a floating height H of the substrate. Note that a distance between the floating-height measurement apparatus and the substrate can be automatically adjusted according to the measured floating height H. The floating height H of the substrate is measured by applying laser light to the substrate and the stage. The distance between the floating-height measurement apparatus and the substrate is adjusted by using a feedback mechanism in which the measured floating height of the substrate is used as an input.

Substrate-floatation-type laser processing apparatus and method for measuring floating height

A laser processing apparatus according to an embodiment includes a laser light irradiation unit and a conveying stage capable of allowing a substrate to float and convey. The conveying stage includes: a laser light irradiation region; and a substrate conveying region separated from the laser light irradiation region, a surface of the laser light irradiation region facing the substrate is configured by a first member from which a first gas is capable of jetting out to float the substrate, a surface of the substrate conveying region facing the substrate is configured by a plurality of second members from which a second gas is capable of jetting out to float the substrate, and the plurality of second members in the substrate conveying region are disposed to be separated from each other.

Laser processing apparatus and method of manufacturing semiconductor device

A laser irradiation apparatus () according to one embodiment irradiates a workpiece () with a laser beam () while conveying the workpiece () caused to float with the use of a flotation unit (). The flotation unit () includes precision float regions () and rough float regions (to). The precision float regions () are configured to cause the workpiece () to float by utilizing ejection and suction of a gas, and the rough float regions are configured to cause the workpiece () to float by utilizing ejection of a gas without suction of a gas.

Laser irradiation apparatus, laser irradiation method, and method of manufacturing semiconductor device

A laser irradiation apparatus () according to one embodiment includes a laser generating device () that generates a laser beam, a flotation unit () that causes a workpiece () that is to be irradiated with the laser beam to float, and a conveying unit () that conveys the floating workpiece (). The conveying unit () conveys the workpiece () with the conveying unit () holding the workpiece () at a position where the conveying unit () does not overlap an irradiation position () of the laser beam. The laser irradiation apparatus () according to one embodiment makes it possible to suppress uneven irradiation with a laser beam.

A laser irradiation apparatus () according to an embodiment includes a laser generation device () configured to generate laser light, and a levitation unit () configured to levitate an object to be processed () to which the laser light is applied. The levitation unit () includes a first area and a second area, and the first and second areas are arranged so that, in a plane view, a focal point of the laser light overlaps the first area and the focal point of the laser light does not overlap the second area. A surface part of the second area is formed of a metal member.

Growing community of inventors

Yokohama, Japan

Takahiro Mikami