Ckd Corporation

Utsunomiya University

Takahiro Mamiya

Hiroyuki Ishigaki

Tsuyoshi Ohyama

Norihiko Sakaida

Ikuo Futamura

Nobuyuki Umemura

Tomoru Okada

Yoshio Hayasaki

A three-dimensional measurement device includes: an optical system including an optical device that splits an incident light, irradiates a measurement object with a measurement light, irradiates a reference plane with a reference light, and combines at least part of the reflected measurement light with at least part of the reflected reference light to emit a combined light; a first light emitter that emits a first light that has a first wavelength; a second light emitter that emits a second light that has a second wavelength; a first imaging device that takes an image of an output light output from the optical device in which the first light enters; a second imaging device that takes an image of an output light output from the optical device in which the second light enters; and a control device that executes three-dimensional measurement of the measurement object.

Three-dimensional measurement device

A three-dimensional measurement device includes: an optical system that splits incident light into two lights, radiates one of the two lights as measurement light to a measured object and the other of the two lights as reference light to a reference surface, and recombines the two lights into combined light to emit the combined light; a light emitter that emits predetermined light entering the predetermined optical system; an imaging system that takes an image of output light emitted from the optical system; and an image processor that performs three-dimensional measurement of a predetermined measurement area of the measured object based on an interference fringe image obtained by the imaging system. The image processor obtains intensity image data at a predetermined position along an optical axis direction at each coordinate position in the measurement area by reconstruction based on an interference fringe image of the measurement area.

A three-dimensional measurement device includes: an optical system that splits incident light into two lights and radiates lights to a measurement object and to a reference surface, and recombines the two lights to emit combined light; a first irradiator that emits first light including first polarized light and entering a first surface; a second irradiator that emits second light including second polarized light and entering a second surface; a first imaging system to which the first output light enters wherein the first output light is emitted from the first surface when the first light enters the first surface; a second imaging system to which the second output light enters wherein the second output light is emitted from the second surface when the second light enters the second surface; and an image processor that performs three-dimensional measurement based on interference fringe images obtained by the first and second imaging systems.

A three-dimensional measurement device includes: an optical system that splits incident light into two lights, radiates one of the two lights as measurement light to a measurement object and the other as reference light to a reference surface, and recombines the two lights to emit combined light; a first irradiation unit that emits first light entering the optical system; a second irradiation unit that emits second light entering the optical system; a first imaging unit into which output light that is obtained from the first light and is emitted from the optical system enters; a second imaging unit into which output light that is obtained from the second light and is emitted from the optical system enters; and an image processor that executes three-dimensional measurement of the measurement object, based on interference fringe images taken by the first imaging unit and the second imaging unit.

A three-dimensional measurement device includes an optical system that: splits an incident light into two lights; radiates one light to a measurement object and the other light to a reference surface; and emits the combined light; a first irradiator that emits a first light that comprises a polarized light of a first wavelength and enters a first element of the optical system; a second irradiator that emits a second light that comprises a polarized light of a second wavelength and enters a second element of the optical system; a first camera that takes an image of the first light emitted from the second element when the first light enters the first element; a second camera that takes an image of the second light emitted from the first element when the second light enters the second element; and an image processor that performs measurement based on the images.

A measurement apparatus includes an illumination device irradiating an object with a first and a second pattern, a camera taking image data of the object, a motor displacing the object, and a processor measuring the object, obtaining a first value of the object based on a first number of image data taken with the first pattern at a first number of phases at a first position, obtaining a gain and/or offset based on the first number of image data, obtaining a second value of the object based on the gain and/or offset and a second number of image data taken with the second pattern at a second number of phases at a second position, obtaining height data of the object based on the first and the second value, and obtaining the second value with an average of the gain and/or offset of pixels adjacent to each pixel.

Three-dimensional measurement apparatus

A measurement device includes: an optical system that splits incident light into two lights to emit one light as measurement light to a measurement object and the other light as reference light to a reference surface, and recombines the two lights to emit combined light; a light emitter that emits light entering the optical system; an imaging system that takes an image of output light emitted from the optical system; and a processor that executes measurement with regard to a predetermined measurement area of the measurement object, based on an interference fringe image taken by the imaging system, wherein the processor: obtains complex amplitude data at a predetermined position in an optical axis direction at predetermined intervals in at least a predetermined range in the optical axis direction, with regard to a specific area set in advance in the measurement area based on the interference fringe image.

Measurement device

A three-dimensional measuring apparatus includes a first irradiating unit, a second irradiating unit, imaging unit that can image a measured object, a first image data acquiring unit that acquires a plurality of image data imaged by the imaging unit under the light pattern irradiated from the first irradiating unit for each predetermined amount of conveyance by the measured object, a three-dimensional measuring unit that three dimensionally measures based on a plurality of image data acquired by the first image data acquiring unit, and a second image data acquiring unit that acquires image data imaged by the imaging unit under the second light irradiated from the second irradiating unit between after predetermined image data from among the plurality of image data acquired by the first image data acquiring unit is imaged and until the next image data is imaged.

Three-dimensional measuring apparatus

A three-dimensional measurement device includes a light source and grid that irradiate a measurement object; a luminance controller that changes luminance levels of the light; a phase controller that changes phase levels of the light pattern; a camera that takes an image of the measurement object; and a processor that three-dimensionally measures a first measurement object area based on different image data taken by radiating a first light pattern in different phases; determines a relationship between a gain and offset determined according to an imaging condition based on the different image data; and three-dimensionally measures a second measurement object area based on two different image data taken by radiating a second light pattern in two different phases by using a gain and offset regarding each pixel determined according to a luminance value of each pixel in the two different image data and the determined relationship.

A three-dimensional measurement device includes: a first irradiator that radiates a first light pattern from a first position toward an object; a first grid controller that controls a first grid to change phases of the first light pattern; a second irradiator that radiates a second light pattern from a second position toward the object; a second grid controller that controls the second grid to change phases of the second light pattern; a camera that takes an image of reflected light from the object; and a processor that: performs one of a first imaging process of imaging processes performed by radiation of the first light pattern and a second imaging process of imaging processes performed by radiation of the second light pattern; and subsequently performs the other imaging process without waiting for completion of the transfer or changeover of the first or the second grid involved in the one imaging process.

A three-dimensional measuring device includes an extraction unit that extracts an image data set with a brightness value of each of pixels in image data within an effective range from among a plurality of image data sets at each of coordinate positions of an object to be measured, and a three-dimensional measurement unit that performs three-dimensional measurement relating to each of the coordinate positions of the object to be measured based on the extracted image data set. The extraction unit extracts the image data set imaged under a pattern light with the highest irradiation brightness among a plurality of types of pattern lights when there is a plurality of sets of the image data sets with the brightness value of each of the pixels in the image data within the effective range from among the plurality of the image data sets.

Three-dimensional measuring device

A device for measuring three dimensional shape is configured to perform one of a first imaging operation as imaging processing of a single operation among a multiplicity of imaging operations performed by irradiation of a first light pattern of multiply varied phases, and a second imaging operation as imaging processing of a single operation among a multiplicity of imaging operations performed by irradiation of a second light pattern of multiply varied phases. The device is configured to, simultaneous with completion of the first or second imaging operation, start shifting or switching operation of said first grating or a second grating relating to said first imaging operation. The device is configured to, without waiting for completion of the shifting or switching operation, perform the other imaging operation from among the first and second imaging operations.

Device for measuring three dimensional shape

A three-dimensional measuring device includes an irradiation means capable of irradiating a striped light pattern used for a spatial encoding method and a striped light pattern used for a phase shift method on a measurement object part on a board main body, an imaging means capable of imaging a measurement object part irradiated by the light pattern, an image control means for controlling imaging by the imaging means, a first calculation means for calculating a height of the measurement object part according to the phase shift method based on a multiplicity of image data imaged by the imaging means, and a second calculation means capable of using the spatial encoding method to identify a line corresponding to the measurement object part from among the image data at a time of calculation by the first calculation means by the phase shift method based on the image data.

Three-dimensional measuring device and board inspection device

A component mounting system includes a solder printing inspection apparatus and a component mounting apparatus. The solder printing inspection apparatus includes an ideal solder position generation unit, an ideal loading position generation unit, an image processing unit, and an ideal solder inspection standard generation unit. The ideal solder position generation unit generates ideal solder position information, and the ideal loading position generation unit generates ideal loading position information. The image processing unit generates actual solder position information and loading estimate position information. The ideal solder inspection standard generation unit generates ideal solder inspection position information. A calculation apparatus inspects a solder included in a solder group based on actual inspection standard information obtained by shifting of the ideal solder inspection standard information by just the actual position adjustment information, and the calculation apparatus outputs mounting position adjustment information to the component mounting apparatus.

Solder printing inspection apparatus and component mounting system

An apparatus for inspecting solder printing includes a memory medium, an ideal solder information generation unit, and an image processing unit. Design data are stored in the memory medium. The ideal solder information generation unit generates 'ideal solder position information' and 'ideal solder sizes' from the ideal solder regions in the design data. The image processing means extracts the actual solder regions of solder on the printed board K from image data imaged by the CCD camera and generates &#x201c;actual solder position information&#x201d; from the actual solder regions. The image processing unit generates &#x201c;position misalignment amounts&#x201d; between the &#x201c;ideal solder position information&#x201d; and &#x201c;actual solder position information,&#x201d; generates &#x201c;print misalignment rates&#x201d; indicating the extents of the &#x201c;position misalignment amounts&#x201d; relative to the &#x201c;ideal solder sizes,&#x201d; calculates a correction value relating to print position based on the &#x201c;print misalignment rates,&#x201d; and outputs a correction value signal to the solder printing machine.

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Aichi, Japan

Takahiro Mamiya