Other

Sulfur Chemical Laboratory Inc.

Meiko Electronics Co., Ltd.

Sulfur Chemical Institute Inc.

Mori, Kunio

Takahiro Kudo

Kunio Mori

Katsuhito Mori

Yusuke Matsuno

Shigeru Michiwaki

Manabu Miyawaki

Shuukichi Takii

Masanori Yanai

Kouichi Kamiyama

Hitomi Chiba

Yasuyuki Masuda

A surface treatment agent including a compound (&#x3b1;) is provided. The compound (&#x3b1;) has one or more M-OH groups and/or groups capable of forming M-OH (wherein M represents a metal atom), an amino group and a triazine ring; wherein said amino group is bonded to a terminal; one or more said amino groups bonded to the terminal are present; and one or more said triazine rings are present.

Surface treatment agent and novel compound

A surface treatment technique having excellent adhering function, excellent reacting function and rich diversity is provided. The surface treatment includes applying a solution containing compound (&#x3b1;) to a substrate and thus providing compound (&#x3b1;) thereon, wherein: the compound (&#x3b1;) is at least one of Formula [IV] and Formula [V]: 

Surface treatment method, surface treatment agent, and novel compound

The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an agent containing a compound (&#x3b1;) onto the surface of a base and a step (Y) of forming a metal film on the surface of the compound (&#x3b1;) by a wet-mode plating technique, wherein the compound (&#x3b1;) is a compound having either an OH group or an OH-generating group, an azide group and a triazine ring per molecule, and the base comprises a polymer.

Process for forming metal film, and product equipped with metal film

To provide a technique by which an &#x2014;OH group can be effectively formed on a material surface for the purpose of making the material suitable for bonding (for example, for molecular bonding) that utilizes a chemical reaction (chemical binding). [Solution] A bonding method for bonding a substrate A and a substrate B, which comprises: a step for applying an agent that contains the compound (&#x3b1;) described below on the surface of the substrate A; a step for arranging the substrate B so as to face the compound (&#x3b1;) that is present on the surface of the substrate A; and a step for integrally bonding the substrate A and the substrate B by applying a force onto the substrate A and/or the substrate B. The compound (&#x3b1;) is a compound that has an OH group or an OH-forming group, an azide group and a triazine ring in each molecule, and the substrate A is configured using a polymer.

Bonding method, bondability improving agent, surface modification method, surface modifying agent, and novel compound

Growing community of inventors

Morioka, Japan

Takahiro Kudo