Fuji Electric Co., Ltd.

Sony Group Corporation

Sony Corporation

Elpida Memory, Inc.

Ps4 Luxco S.a.r.l.

Canon Denshi Kabushiki Kaisha

Uacj Corporation

Takahiro Koyama

Hiromichi Gohara

Shin Soyano

Keiichi Higuchi

Toyoharu Oohata

Kensuke Matsuzawa

Sadayuki Okuma

Yoshikazu Takamiya

Yoshihiro Tateishi

Masahiro Kando

Masaaki Ishibashi

Takafumi Yamada

Yusuke Suzuki

Noriho Terasawa

Yuta Tamai

Tatsuhiko Asai

Hiroyuki Miyahara

Hisayoshi Motobayashi

Daiki Yoshida

Tatsuya Mimura

Tatsuhiro Yaegashi

Yoshikazu Takayima

Tsubasa Nakamura

A first semiconductor device according to an embodiment of the present disclosure includes: a semiconductor element; a first housing member and a second housing member that house the semiconductor element; a first base layer formed on a bonded surface of the first housing member to the second housing member; a second base layer formed on a bonded surface of the second housing member to the first housing member; a solder bonding section that bonds the first housing member and the second housing member with the first base layer and the second base layer interposed in between; and a solder adsorption layer provided on at least one of the bonded surface of the first housing member or the bonded surface of the second housing member to be apart from the first base layer and the second base layer.

Semiconductor device

A cooling apparatus for a semiconductor module including a semiconductor chip includes a top plate having a lower surface a bottom plate disposed to have a refrigerant circulation portion between the bottom plate and the lower surface of the top plate and a side wall configured to surround the refrigerant circulation portion. The side wall includes a fixed portion fixed to the top plate or the bottom plate with a fixing material. The fixed portion includes an edge portion disposed to face the top plate or the bottom plate and a separated portion disposed to be adjacent to the edge portion in a first direction in which the refrigerant circulation portion and the side wall are aligned, the separated portion being disposed farther from the top plate or the bottom plate disposed to face the edge portion than the edge portion.

Cooling apparatus and semiconductor module

A cooler includes a top plate, one surface of which serves as a heat dissipation surface, a bottom plate disposed so as to face the top plate and having a larger thickness than that of the top plate, a plurality of fins provided between the top plate and the bottom plate, and a circumferential wall part provided so as to surround the plurality of fins along outer circumferential edges of the bottom plate. The plurality of fins and the outer circumferential wall part are provided between the top plate and the bottom plate and bonded to the heat dissipation surface of the top plate. A flow path for a coolant is formed by a space enclosed by the top plate, the bottom plate, the plurality of fins, and the circumferential wall part. The top plate has an electric potential higher than that of the bottom plate.

Cooler and semiconductor apparatus

An imaging device according to an embodiment of the present disclosure includes an imaging unit, an encoding section, and a sending section. The imaging unit acquires captured image data by imaging. The encoding section encodes a plurality of pieces of image data as one piece of image data for transmission. The plurality of pieces of image data is based on one or more pieces of captured image data acquired by the imaging unit. The sending section sends the image data for transmission to an external device. The image data for transmission is generated by the encoding section.

Imaging device, processing device, data transmission system, and data transmission method for transmission of image data

A semiconductor module includes a cooling device that includes: a ceiling plate; a side wall; a bottom plate; a plurality of pin fins having a polygonal shape and arranged in a matrix form in which one end of the respective pin fins is connected to a fin region having a rectangular shape; an inlet for a coolant at a first position adjacent to a part of one of long sides of the fin region, and an outlet for the coolant at a second position adjacent to a part of the other long side of the fin region. The matrix directions of the respective pin fins make an angle with a straight line connecting the first position and the second position, and a length of a segment of the straight line passing across the fin region is longer than a length of short sides of the fin region.

Semiconductor module with cooling fins in a matrix form

A semiconductor device includes an insulating substrate, semiconductor elements mounted on the insulating substrate, and a cooler for cooling the semiconductor elements. The cooler includes a heat dissipating substrate having bonding and heat dissipating surfaces opposite to each other, the bonding surface being bonded to the second surface of the insulating substrate, a plurality of fins on the heat dissipating surface, a reinforcing plate having first and second surfaces opposite to each other and covering the fins, the first surface being bonded to tips of the fins, and a cooling case including a recessed part to house the fins and reinforcing plate. A first gap between two adjacent fins, measured in a direction parallel to the heat dissipating substrate, is larger than a second gap between the reinforcing plate and a bottom of the first recessed part, measured in a thickness direction.

Semiconductor device with cooler including heat dissipating substrate having a plurality of fins bonded to reinforcing plate

A light-emitting device according to one embodiment of the present disclosure includes: a reflective structure having a first surface and a second surface and having, on the first surface, an opening whose side surface is provided with a first reflective film; a semiconductor light-emitting element including a first conductivity-type layer, an active layer, and a second conductivity-type layer that are stacked, the opening of the reflective structure and the active layer being disposed to be opposed to each other; and a support member having a light-transmitting property and having a first surface and a second surface, the semiconductor light-emitting element being disposed on the first surface side, the reflective structure being disposed on the second surface side, the second surface being at least partially in contact with the first surface of the reflective structure.

Light-emitting device and image display apparatus

Semiconductor module

Provided is a light-emitting device that includes a solid-state light source emitting excitation light and a phosphor layer having a first refractive index, provided on a light-emitting surface side of the solid-state light source, and having a first reflection film on its side surface. The light-emitting device further includes a low refractive layer provided on the phosphor layer and having a second refractive index less than the first refractive index, and a sealing member encapsulating the phosphor layer and the low refractive layer and having a third refractive index greater than or equal to the second refractive index.

Light-emitting device and image display apparatus with reflection film on side surface and layers having different refractive indices

A cooler includes a top plate having a plurality of fins provided on a surface thereof, and a circumferential wall part provided so as to surround outer circumferences of the plurality of fins along outer circumferential edges of the top plate, and a bottom plate bonded to distal ends of the circumferential wall part and the plurality of fins. A flow path for a coolant is formed by a space enclosed by the top plate, the circumferential wall part and the bottom plate. The bottom plate has inlet and discharge portions for the coolant. The inlet and discharge portions are disposed so as to face each other diagonally with the plurality fins interposed therebetween. An inner surface of the circumferential wall part has a step part that tilts from the inner surface of the circumferential wall part toward the discharge portion at a position neighboring to the discharge portion.

Provided is a semiconductor module including semiconductor devices and a cooling apparatus, wherein the semiconductor device has semiconductor chips and a circuit board with the semiconductor chips implemented thereon; the cooling apparatus has a top plate, a side wall, a bottom plate, a coolant flow portion, an inlet, an outlet and a plurality of fins; the top plate and the bottom plate have three through holes that are through holes for inserting fastening members that fasten the semiconductor module to an external apparatus, penetrating the top plate and the bottom plate in one direction respectively; and a geometric center of gravity of a aperture of at least one of the inlet and the outlet may also be positioned inside a virtual triangle with the three through holes being vertexes in planar view.

Semiconductor module and vehicle

The flow speed distribution of a refrigerant in a cooling apparatus is made uniform. A cooling apparatus provided includes: a top plate; a casing portion having a base plate facing the top plate, and a refrigerant delivery portion arranged between the top plate and the base plate, the casing portion provided with two opening portions to function as an inlet port through which a refrigerant is let into the refrigerant delivery portion and an outlet port through which the refrigerant is let out; a cooling fin portion arranged in the refrigerant delivery portion of the casing portion and between the two opening portions; and a loss adding portion arranged in the refrigerant delivery portion of the casing portion and between the cooling fin portion and at least one of the two opening portions, the loss adding portion generating pressure loss in the refrigerant passing therethrough.

Cooling apparatus, semiconductor module, and vehicle

There are provided: a surface-treated aluminum material including an aluminum base material and an alkali alternating current electrolytic oxide coating film formed on at least a part of a surface of the aluminum base material, wherein the alkali alternating current electrolytic oxide coating film includes a porous-type aluminum oxide coating film layer formed on a surface side and a barrier-type aluminum oxide coating film layer formed on a base material side, and plural working grooves perpendicular to the direction of plastic working are formed; a method of producing the surface-treated aluminum material; a bonded body of the surface-treated aluminum material and a member to be bonded, including the surface-treated aluminum material and the member to be bonded, such as resin; and a method of producing the bonded body.

Surface-treated aluminum material and method for manufacturing same; and bonded body of surface-treated aluminum material and bonding member comprising said surface-treated aluminum material, and bonding member such as resin, and method for manufacturing said bonded body

Machining tool

The invention is provided with a metal base plate including a first surface and a second surface and a cooling case including a bottom wall and a side wall formed around the bottom wall, in which one end of the side wall being joined to a second surface side of the metal base plate, and a coolant can be circulated in a space enclosed by the metal base plate, the bottom wall, and the side wall, in which the cooling case has an inlet portion and an outlet portion for the coolant which are connected to either the bottom wall or the side wall and disposed along a peripheral edge of the second surface of the metal base plate, and includes a first flange disposed at an inlet opening side of the inlet portion and a second flange disposed at an outlet opening side of the outlet portion.

Growing community of inventors

Tokyo, Japan

Takahiro Koyama