Murata Manufacturing Co., Ltd.

Takahiro Kitazume

Yoshihito Otsubo

Takanori Uejima

Jun Adachi

Takahiro Sumi

Jun Urakawa

Daisuke Miyazaki

An electronic component includes a main body including a first surface, a first electrode and a second electrode arranged on the first surface, and a resist film arranged to isolate the first electrode from the second electrode. The first electrode and the second electrode are mainly composed of a first material. The first electrode includes a first portion including a central portion and having a first thickness and a second portion having a second thickness smaller than the first thickness in at least a part of a peripheral portion. The first portion is covered with a plated film where a film made of a second material higher in affinity for solder than the first material is exposed at an outermost surface. At least a part of the second portion is covered with the resist film. The first portion is distant from the resist film.

Electronic component

A module comprises: a substrate having a first surface; a first component that is mounted on the first surface; a first sealing resin that covers the first surface and at least a portion of the first component that is connected to the first surface; a first conductor pattern that is disposed on a surface of the first sealing resin that is farther from the first surface; and a wire that serves as a plurality of connecting conductors each electrically interconnecting the first surface and the first conductor pattern, wherein when viewed in a direction perpendicular to the first surface, the plurality of connecting conductors are disposed so as to surround the first component, and the first conductor pattern includes a frame-shaped portion that electrically interconnects the plurality of connecting conductors outside the first component successively.

Module

A module is provided with a substrate having a main surface, and each of one or more inductors that are disposed on the main surface of the substrate. A resin sealing portion seals the one or more inductors and covers the main surface of the substrate. A ground conductor is disposed on an outer peripheral side of the substrate with respect to entirety of the one or more inductors in a plan view. A plurality of linear conductors are disposed on the resin sealing portion. The plurality of linear conductors are disposed with gaps therebetween, such that the one or more inductors underlie at least one of the plurality of linear conductors in the plan view.

An electronic component module includes a substrate, an inductor element, a plurality of mounting type electronic components, and a shield film. The substrate has a first main surface and a second main surface, and the second main surface side is a side to be mounted on another circuit board. A first mounting type electronic component and a second mounting type electronic component are mounted on the first main surface. The shield film covers the first mounting type electronic component and the second mounting type electronic component and the first main surface side. The inductor element is disposed inside the substrate.

Electronic component module

A module includes: a board having a first main surface; a first component mounted on the first main surface; a first conductor column group including a plurality of conductor columns arranged on the first main surface along at least a part of an outer periphery of the first component; a first ground conductor disposed inside the board; a first conductor via group including a plurality of via conductors that connect the first ground conductor and an end of each of the conductor columns, the end of each of the conductor columns being located close to the first main surface; and a shield film disposed to cover over the first component. When viewed in a cross section taken along a plane perpendicular to the first main surface, the first component is at least partially surrounded by the first conductor column group, the first conductor via group, and the first ground conductor.

An electronic component module includes a substrate including a first main surface and a second main surface, and using a side near the second main surface as a mounting side, an external terminal by a solder ball made of first solder, on the second main surface, and a first electronic component mounted by using second solder, on the first main surface, and a melting point of the first solder is higher than a melting point of the second solder.

Electronic component module, and method of manufacturing electronic component module

A module includes: a board having a first main surface; a first component mounted on the first main surface; a first wire group including a plurality of wires disposed to extend across the first component; a first ground conductor disposed inside the board; and a first conductor via group including a plurality of via conductors that connect each of the wires belonging to the first wire group and the first ground conductor. The first component is surrounded by the first wire group, the first conductor via group, and the first ground conductor.

An ESD protection device has a structure that allows ESD characteristics to be easily adjusted and stabilized. The ESD protection device includes a ceramic multilayer substrate, at least a pair of discharge electrodes located in the ceramic multilayer substrate and facing each other with a space disposed therebetween, and external electrodes located on a surface of the ceramic multilayer substrate and connected to the discharge electrodes. The ESD protection device includes a supporting electrode disposed in a region that connects the pair of discharge electrodes. The supporting electrode is made of a conductive material coated with an inorganic material having no conductivity.

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Nagaokakyo, Japan

Takahiro Kitazume