Tokyo Electron Limited

Other

Kabushiki Kaisha Toshiba

Ibiden Company Limited

Octec, Inc.

Toyko Electron Limited

Toyota Electron Limited

Takahiro Kitano

Masateru Morikawa

Masami Akimoto

Yukihiko Esaki

Norihisa Koga

Kazuhiro Takeshita

Nobukazu Ishizaka

Shinji Kobayashi

Makoto Muramatsu

Tadatoshi Tomita

Shinichi Sugimoto

Tomohide Minami

Hirofumi Ookuma

Yuji Matsuyama

Junichi Kitano

Tetsuo Fukuoka

Katsuya Okumura

Takanori Nishi

Hiroshi Shinya

Keiji Tanouchi

Shoichi Terada

Naoya Hirakawa

Nobuhiro Ogata

Hiroichi Inada

Gen You

Jun Ookura

Hisashi Genjima

Koichi Obata

Yoshiyuki Kawafuchi

Hiroaki Kurishima

Shinichi Ito

Yoshio Kimura

Shuuichi Nishikido

Toshichika Takei

Kazuo Terada

Akira Fukutomi

Dai Kumagai

Taro Yamamoto

Hidetami Yaegashi

Akihiro Fujimoto

Yasushi Takiguchi

Muneo Harada

Yoshihiro Hirota

Naoto Yoshitaka

Koukichi Hiroshiro

Shuichi Kawano

Yoichi Tokunaga

Tomotaka Shinoda

Manabu Hama

Yoshiki Yamanishi

Tatsuzo Kawaguchi

Kinji Yamada

Kousuke Yoshihara

Shinichi Hayashi

Naruaki Iida

Nobuaki Matsuoka

Rempei Nakata

Toshiyuki Matsumoto

Masami Yamashita

Satoru Shimura

Hikaru Ito

Masatoshi Deguchi

Shinichiro Kawakami

Nobuhide Yamada

Hidefumi Matsui

Nobuyuki Sata

Takayuki Ishii

Takayuki Katano

Takashi Yamauchi

Satoshi Shimmura

Hiroyuki Iwaki

Soichiro Okada

Yasutaka Souma

Yo Suzuki

Toru Aoyama

Takahiro Sakamoto

Hiroyuki Hara

Mutsuhiko Yoshioka

Makoto Sugiura

Takafumi Toshimitsu

A substrate treatment method of treating a substrate using a block copolymer containing a hydrophilic polymer and a hydrophobic polymer, includes: a resist pattern formation step of forming a predetermined resist pattern by a resist film on the substrate; a thin film formation step of forming a thin film for suppressing deformation of the resist pattern on a surface of the resist pattern; a block copolymer coating step of applying a block copolymer to the substrate after the formation of the thin film; and a polymer separation step of phase-separating the block copolymer into the hydrophilic polymer and the hydrophobic polymer.

Computer storage medium to perform a substrate treatment method using a block copolymer containing a hydrophilic and hydrophobic copolymers

A substrate processing method of processing a substrate using a block copolymer containing a hydrophilic polymer and a hydrophobic polymer, the substrate processing method includes: a block copolymer coating step of applying the block copolymer onto the substrate on which a predetermined projecting and recessed pattern is formed, to form a coating film of the block copolymer; a polymer separation step of phase-separating the block copolymer into the hydrophilic polymer and the hydrophobic polymer; a polymer removal step of selectively removing the hydrophilic polymer from the phase-separated block copolymer; and after the block copolymer coating step and before the polymer removal step, a film thickness reduction step of reducing a film thickness of the coating film of the block copolymer.

Substrate processing method and computer storage medium

Substrate treatment method using a block copolymer containing a hydrophilic and a hydrophobic polymers

A substrate treatment method using a block copolymer containing a hydrophilic polymer and a hydrophobic polymer includes a polymer separating step, wherein a ratio of a molecular weight of the hydrophilic polymer in the block copolymer is adjusted to 20% to 40% so that the hydrophilic polymers align at positions corresponding to a hexagonal close-packed structure in a plan view after the polymer separating step, and at the polymer separating step, a columnar first hydrophilic polymer is phase-separated on each of circular patterns of hydrophobic coating films and a columnar second hydrophilic polymer is phase-separated between the first hydrophilic polymers, and a diameter of the circular pattern is set so that the first hydrophilic polymers and the second hydrophilic polymers align at positions corresponding to the hexagonal close-packed structure in a plan view.

Substrate treatment method, computer storage medium and substrate treatment system

The present invention, when forming a pattern on a substrate, forms a film of a block copolymer containing at least two polymers on the substrate, heats the film of the block copolymer under a solvent vapor atmosphere to subject the block copolymer to phase separation, and removes one of the polymers in the film of the phase-separated block copolymer, thereby accelerating fluidization of the polymers of the block copolymer to enable acceleration of the phase separation.

Pattern forming method and heating apparatus

A substrate treatment method includes: a polymer separation step of phase-separating a block copolymer into a hydrophilic polymer and a hydrophobic polymer; and a polymer removal step of selectively removing the hydrophilic polymer from the phase-separated block copolymer, wherein in the polymer removal step, the hydrophilic polymer is removed by: irradiating the phase-separated block copolymer with an energy ray; then supplying a first polar organic solvent having a first degree of dissolving the hydrophilic polymer, being lower in boiling point than water and capable of dissolving water, and not dissolving the hydrophobic polymer, to the block copolymer; and then supplying a second polar organic solvent having a second dissolving degree lower than the first dissolving degree, being higher in boiling point than water, and not dissolving the hydrophobic polymer, to the block copolymer.

Disclosed is a coating apparatus capable of enhancing the film thickness uniformity. The coating apparatus includes a nozzle and a moving mechanism. The nozzle includes a storage chamber that stores a coating liquid and a slit-like flow path that is in communication with the storage chamber, and discharges the coating liquid through a discharge port formed at a front end of the flow path. The moving mechanism moves the nozzle and the substrate relatively to each other along a surface of the substrate. Also, in the flow path provided in the nozzle, flow resistance at the central portion in the longitudinal direction is larger than that at both end portions in the longitudinal direction.

Coating apparatus and nozzle

The present invention is configured to: form, on a substrate, a neutral layer having an intermediate affinity to a hydrophilic polymer and a hydrophobic polymer; form a resist pattern by performing exposure processing on a resist film formed on the neutral layer and then developing the resist film after the exposure processing; perform a surface treatment on the resist pattern by supplying an organic solvent having a polarity to the resist pattern; apply the block copolymer onto the neutral layer; and phase-separate the block copolymer on the neutral layer into the hydrophilic polymer and the hydrophobic polymer.

Substrate treatment method, computer storage medium, and substrate treatment system

A substrate treatment method includes: forming a plurality of circular patterns of a resist film on a substrate; thereafter applying a first block copolymer; then phase-separating the first block copolymer into a hydrophilic polymer and a hydrophobic polymer; thereafter selectively removing the hydrophilic polymer; then selectively removing the resist film from a top of the substrate; thereafter applying a second block copolymer to the substrate; then phase-separating the second block copolymer into a hydrophilic polymer and a hydrophobic polymer; and thereafter selectively removing the hydrophilic polymer from the phase-separated second block copolymer. A ratio of a molecular weight of the hydrophilic polymer in the first block copolymer and the second block copolymer is 20% to 40%.

Substrate treatment method, computer readable storage medium and substrate treatment system

A disclosed substrate cleaning apparatus for cleaning a back surface of a substrate includes a first substrate supporting portion configured to support the substrate at a first area of a back surface of the substrate, the back surface facing down; a second substrate supporting portion configured to support the substrate at a second area of the back surface of the substrate, the second area being separated from the first area; a cleaning liquid supplying portion configured to supply cleaning liquid to the back surface of the substrate; a drying portion configured to dry the second area of the back surface of the substrate; and a cleaning portion configured to clean a third area of the back surface of the substrate when the substrate is supported by the first substrate supporting portion, the third area including the second area, and a fourth area of the back surface of the substrate when the substrate is supported by the second substrate supporting portion, the fourth area excluding the second area of the back surface.

Substrate cleaning method

The present invention is a pattern forming method of forming a pattern on a substrate using a block copolymer, the pattern forming method including the steps of: forming a film of a block copolymer containing at least two kinds of polymers on the substrate; heating the film of the block copolymer; irradiating the heated film of the block copolymer with ultraviolet light in an atmosphere of an inert gas; and supplying an organic solvent to the film of the block copolymer irradiated with the ultraviolet light.

Pattern forming method, pattern forming apparatus, and computer readable storage medium

A photoresist pattern used for forming a pattern of a block copolymer is formed on a substrate, and then an acid solution is supplied and an alkaline solution is further supplied to the photoresist pattern so as to slim and smooth the photoresist pattern. A block copolymer solution is applied to the substrate on which the smoothed photoresist pattern has been formed, to form a film of the block copolymer, and the film is heated.

Pattern forming method, pattern forming apparatus, and non-transitory computer-readable storage medium

A heating device has a heating chamber. An initial temperature distribution is created in a surface of a substrate (wafer W) when the substrate is carried into the heating chamber. . . Temperature distribution creating means (heating lamps) creates a preheating temperature distribution in the substrate supported on a cooling plateat a waiting position before the substrate is carried into the heating chamberso as to level out the initial temperature distribution.

Heating device, coating and developing system, heating method and storage medium

The present invention is an imprint system including an imprint unit transferring a transfer pattern to a coating film formed on a substrate using a template having the transfer pattern formed on a front surface thereof to form a predetermined pattern in the coating film, the imprint system including: a substrate carry-in/out station connected to the imprint unit, capable of keeping a plurality of the substrates, and carrying the substrate into/out of the imprint unit side; and a template carry-in/out station connected to the imprint unit, capable of keeping a plurality of the templates, and carrying the template into/out of the imprint unit side at a predetermined timing.

Imprint system, imprint method, and non-transitory computer storage medium

Growing community of inventors

Koshi, Japan

Takahiro Kitano