Senju Metal Industry Co., Ltd.

Senju System Technology Co., Ltd.

Takahiro Kasama

Noboru Hashimoto

A soldering apparatusincluding: a chamberconfigured to contain solder and include an openingconfigured to discharge the solder in a bottom surface or a side surface; a pumpconfigured to transport the solder to the chamber; and an inner bathconfigured to communicate with the openingand perform soldering using the solder fed through the opening

Soldering apparatus and soldering method

To provide a soldering method and a soldering apparatus which are capable of preheating a mask without degrading throughput. Provided is a soldering method including preheating a mask on which a substrate is not placed, placing the substrate on the preheated mask, and bringing at least a part of the substrate placed on the preheated mask into contact with molten solder and thus soldering the substrate.

Soldering method and soldering apparatus

Provided is a jet nozzle that varies a width of a flow of jetted molten solder. The jet nozzle contains a nozzle main body having a channel section at its part and a molten solder flow width varying member that varies a width of the upper opening end of the nozzle main body by a slide of the molten solder flow width varying member within the channel section of the nozzle main body to vary a width of the molten solder flow jetted from the upper opening end of the nozzle main body. The molten solder flow width varying member includes a molten solder flow width varying plate that varies the width of the molten solder flow, a rectangular rectifying piece that extends along a slide direction of the molten solder flow width varying member, and a sliding shaft that slides the rectifying piece.

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Toyama, Japan

Takahiro Kasama