C.uyemura Co., Ltd.

Takahiro Ishizaki

Teruyuki Hotta

Hisamitsu Yamamoto

Masayuki Utsumi

Tomohiro Kawase

Masaharu Takeuchi

Yoshikazu Saijo

Shigeo Hashimoto

Takuya Okamachi

Junji Mizumoto

Syunsaku Hoshi

Fujio Asa

Shushi Morimoto

An tank such as an electroless copper plating tank, includes a liquid squirting parthaving a squirt portfor squirting the processing solution Q from the squirt porttoward the treatment object obliquely upward to a horizontal plane, and hitting the processing solution Q on the upper area of the plate-like workso that the processing solution Q runs down the plate-like work

Surface treating apparatus

A tank bodyincludes a liquid receiving partfor receiving processing solution Q applied to a plate-like workand a liquid retaining partfor retaining liquids to be applied to the plate-like workand a liquid outflowing partfor causing a flow of the processing solution Q which is spilled out of the liquid retaining partand traveled down toward the plate-like work, wherein a tipof the liquid outflowing partis projected from a connecting partconnecting to the liquid retaining part(or the liquid receiving part).

The regeneration unit includes a tubular portion having the inner circumferential surface functioning as an anode, and a cathode provided inside the tubular portion and extending along the extension direction of the tubular portion in a state of separation from the inner circumferential surface. The treatment liquid used for desmearing treatment is fed through a gap between the inner circumferential surface of the tubular portion and the cathode. A feed-side conduit is connected by a downstream end portion thereof to the tubular portion and guides the treatment liquid discharged from a desmearing treatment tank into a regeneration unit. A return-side conduit is connected by an upstream end portion thereof to the tubular portion and guides the treatment liquid discharged from the regeneration unit into the desmearing treatment tank.

Electrolytic regeneration device

The present invention is directed to a method for manufacturing a printed circuit board in which a plurality of conductive layers forming a wiring pattern are laminated in the state where they are put between insulating layers, and a printed circuit board formed thereby. The printed circuit board manufacturing method for the present invention includes a step of forming a via fill () to allow electroless plating liquid to be in contact with the surface of the wiring pattern exposed to a bottom part of a via hole () formed at a insulating layer to laminate plating metallic film from the bottom part to a opening part of the via hole (), to form the via fill (), and a step of forming a wiring pattern to form electroless plating metallic film () serving as the wiring pattern onto a substrate where the via fill () is formed.

Method for manufacturing printed circuit board

A method for forming a circuit pattern is disclosed. A circuit pattern that forms an electrically conductive layer (L) is formed on an insulating resin () that forms a first insulating layer (L). An insulating resin () that forms a second insulating layer (L) is laminated on the insulating resin () on which the circuit pattern has been formed. A trench () is formed in the laminated insulating resin () to expose the circuit pattern. An electroless plating metal () is buried by electroless plating in the trench () formed.

Method for forming a circuit pattern

Disclosed is an electroless plating solution exhibiting a good plating metal filling performance even for larger trenches or vias of several to one hundred and tens of &#x3bc;m, in a manner free from voids or seams, and allowing maintenance of stabilized performance for prolonged time. The electroless plating solution contains at least a water-soluble metal salt, a reducing agent for reducing metal ions derived from the water-soluble metal salt, and a chelating agent. In addition, the electroless plating solution contains a sulfur-based organic compound as a leveler having at least one aliphatic cyclic group or aromatic cyclic group to which may be linked at least one optional substituent. The aliphatic cyclic group or the aromatic cyclic group contains optional numbers of carbon atoms, oxygen atoms, phosphorus atoms, sulfur atoms and nitrogen atoms.

Growing community of inventors

Osaka, Japan

Takahiro Ishizaki