Murata Manufacturing Co., Ltd.

Murata Manufacturing Co., Ltd. Murata Manufacturing

Takahiro Hirao

Tomohiro Kageyama

Tetsuo Kawakami

Takashi Ohara

Manabu Sakai

Tsutomu Tanaka

Ryuki Kakuta

Masanori Nakamura

Yohei Mukobata

Shingo Ito

Haruhiko Ueno

Kenji Ueno

Seiji Goto

Ken Takakura

Shu Hamada

Syuichi Nabekura

Koichi Ikeda

Fumio Naruse

Satoshi Yoshida

Kyosuke Uno

An electronic component includes a main body including first and second end surfaces opposed to each other in a length direction, first and second side surfaces opposed to each other in a width direction, and first and second main surfaces opposed to each other in a thickness direction and that has a rectangular substantially rectangular parallelepiped shape, a first outer electrode provided at a first end side in the length direction of the main body, and a second outer electrode provided a second end side in the length direction of the main body. Each of the first and second outer electrodes includes first through fourth protrusions.

Electronic component

A three-terminal capacitor includes a main body having a cylindrical or substantially cylindrical shape extending in a first direction and including first and second inner electrodes alternately laminated together with dielectric layers interposed therebetween, a pair of first outer electrodes on two end surfaces of the main body in the first direction and electrically connected to the first inner electrodes, and a second outer electrode electrically connected to the second inner electrodes. The main body includes a projecting portion projecting in a direction perpendicular or substantially perpendicular to the first direction at a position between the pair of first outer electrodes. The second outer electrode is provided on one surface of the projecting portion viewable when viewed in the first direction.

Three-terminal capacitor with cylindrical main body and electronic component including the same

A multilayer ceramic capacitor includes a multilayer body including first inner electrodes and second inner electrodes stacked in layers and dielectric layers, the multilayer body including a first outer electrode receiving portion at one end thereof in one direction, a second outer electrode receiving portion at the other end thereof in the one direction, and a main portion between the first and second outer electrode receiving portions, a first outer electrode over the first outer electrode receiving portion, and a second outer electrode over the second outer electrode receiving portion. A level difference exists at a boundary between the main portion and the first outer electrode receiving portion and at a boundary between the main portion and the second outer electrode receiving portion. An area of a cross section at a central position of the main portion in the one direction is greater than areas of cross sections at a position of the first outer electrode and at a position the second outer electrode.

Multilayer ceramic capacitor

A multilayer ceramic capacitor includes a multilayer body including dielectric layers, first inner electrodes, and second inner electrodes stacked on one another, a first outer electrode electrically connected to the first inner electrodes, and a second outer electrode electrically connected to the second inner electrodes. The multilayer body includes first and second side surfaces respectively including first and second recesses where a midsection of each of the first and second side surfaces in a length direction is recessed inward in a width direction. When the multilayer ceramic capacitor is viewed in a stacking direction, a dimension of each of the first and second recesses in the length direction is smaller on an inner side than on an outer side in the width direction.

Multilayer ceramic capacitor and semiconductor device

A multilayer ceramic capacitor includes a multilayer body and outer electrodes. The multilayer body includes first and second multilayer ceramic structures and an intermediate body between the first and second multilayer ceramic structures, first to fourth connection electrodes electrically connecting first inner electrodes, second inner electrodes, third inner electrodes, and fourth inner electrodes, respectively, a first connection wire electrically connecting the first connection electrode and one of the third connection electrode and the fourth connection electrode, and a second connection wire electrically connecting the second connection electrode and the other connection electrode. A current route from the first connection electrode via the first connection wire to the one connection electrode and a current route from the second connection electrode via the second connection wire to the other connection electrode have different lengths.

An electronic component includes a first external electrode disposed on a first end surface and a second external electrode disposed on a second end surface. The first external electrode includes a first conductive layer including ceramic particles. The second external electrode includes a second conductive layer including ceramic particles. An end portion of a first internal electrode is located inside the first conductive layer. The electronic component includes little or no cracks and has a low equivalent series resistance (ESR).

Electronic component and method for manufacturing same

A ceramic electronic component includes a stack including ceramic layers and internal electrodes stacked alternately, and external electrodes provided on a surface of the stack and electrically connected to the internal electrodes. The internal electrodes include a melting trigger portion that melts earlier than any other portion. The ceramic layer adjacent to the internal electrode including the melting trigger portion includes a cavity. The cavity is provided at a position at which the cavity overlaps the melting trigger portion at least partially in a stacking direction of the internal electrodes. The cavity is open on a melting trigger portion side. A surface of at least one of the stack and the external electrodes is provided with an identifier that serves as a marker indicating use of the ceramic electronic component with the cavity vertically below the melting trigger portion.

Ceramic electronic component and method of manufacturing ceramic electronic component

A multilayer electronic component includes first, second, and third ceramic layers, first and second inner electrodes, and a via-electrode. The first, second and third ceramic layers are sequentially stacked on each other. The first inner electrode is sandwiched between the first and second ceramic layers. The second inner electrode is sandwiched between the second and third ceramic layers. The via-electrode electrically connects the first and second inner electrodes. A projection is integrally provided with the via-electrode. The projection projects from the via-electrode towards an outer peripheral direction and is inserted into the second ceramic layer in a layered arrangement.

Multilayer electronic component

In an electronic component, a first outer electrode includes a first conductive layer provided on a first end surface. A second outer electrode includes a second conductive layer provided on a second end surface. A first inner electrode passes through the first conductive layer. A second inner electrode passes through the second conductive layer.

Electronic component and manufacturing method for the same

A method for manufacturing an electronic component, and a device for manufacturing the electronic component, which can easily achieve alignment by inserting multilayer chips into cavities formed in a pallet, and form external electrodes with a high degree of dimensional accuracy. A plurality of multilayer chips each composed of a laminated body with a plurality of ceramic layers and a plurality of internal electrode layers is inserted into each of a plurality of cavities formed in a pallet, and the plurality of multilayer chips is aligned by moving each of the plurality of multilayer chips to one of inner wall surfaces forming the cavity. A conductive ink is applied onto ends of the plurality of aligned multilayer chips, including the upper surface of the pallet, and the conductive ink applied is dried to form external electrodes on the plurality of multilayer chips.

Method for manufacturing electronic component

A ceramic electronic component which is easily downsized, has reduced difficulty in handling, and is hardly chipped in a chip; and a method for producing the ceramic electronic component. The method includes the steps of: forming an uncured ceramic pattern which forms a ceramic layer after firing and has a circular plane shape by applying a ceramic slurry, which contains a ceramic material, to a predetermined location one time or a plurality of times repeatedly using a non-contact-type printing device such as an ink-jet printer; and forming uncured internal electrode patterns which form internal electrodes after firing and each have a circular plane shape by applying an electrode paste, which contains an internal electrode material, to a predetermined location one time or a plurality of times repeatedly using an ink-jet printer.

Ceramic electronic component and method for producing same

A multilayer electronic component includes outer electrodes each including an outer electrode main body electrically conducted to an internal electrode and entering portions that project from the outer electrode main body as a base end and enter into the electronic component element through an end surface of the electronic component element. The entering portions each include a slope relative to a principal surface in a flat region including a major portion of the internal electrode.

Multilayer electronic component and manufacturing method therefor

A ceramic electronic component includes an electronic component ceramic main body and internal electrodes disposed within the electronic component main body. The internal electrodes include through holes passing through the internal electrodes in the thickness direction. Ceramic columns are disposed in the through holes and connect the ceramic on one side of the internal electrodes and the ceramic on the other side thereof. An area ratio of the ceramic columns to ends of the internal electrodes located within the electronic component main body is greater than an area ratio of ceramic columns to central portions of the internal electrodes.

Ceramic electronic component and manufacturing method therefor

A multilayer ceramic electronic component includes a multilayer body including ceramic layers and inner electrode layers, the inner electrode layers being disposed on interfaces between the ceramic layers, and an outer electrode on an external surface of the multilayer body and electrically connected to first end portions of the inner electrode layers exposed to the external surface of the multilayer body. Each of the ceramic layers includes a thin portion with a continuously reducing thickness near the first end portion. Each inner electrode layer includes a thick portion near a connection with the outer electrode, the thick portion having a thickness continuously increasing toward the connection on a first side in accordance with a shape of the thin portion in the ceramic layer. A distance between a second end portion in the inner electrode layer not joined to the outer electrode, and the thick portion adjacent to the second end portion is equal to or longer than an interlayer distance between the inner electrode layers.

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Nagaokakyo, Japan

Takahiro Hirao