Toyota Jidosha Kabushiki Kaisha

Denso Corporation

Mazda Motor Corporation

Kabushiki Kaisha Toyota Chuo Kenkyusho

Sumida Corporation

Takahiro Hirano

Tomomi Okumura

Takuya Kadoguchi

Masayoshi Nishihata

Jun Muto

Masanori Ishigaki

Tetsuhiro Yamashita

Yoshimasa Kurokawa

Kenichi Takagi

Kenichiro Nagashita

Katsuya Kobayashi

Keita Fukutani

Ryunosuke Yamashita

Daiki Yokoyama

Toshiya Hashimoto

Takaji Umeno

Masaki Ito

Yasuharu Terada

Midori Sugiyama

Arata Harada

Yuki Takahashi

Takanori Kawashima

Shogo Tsuge

Ryosuke Ikemura

Masanori Ooshima

Yohei Arino

Hiroshi Kawashima

Tatsuya Miyoshi

Keiichi Minamiura

Takahide Sugiyama

Wataru Kobayashi

Daisuke Sato

Akihiro Kusumoto

Toshihiro Nakamura

Shuichi Nagata

Kengo Oka

Takumi Nomura

Daisuke Fukuoka

Yasuhiro Morita

Hitoshi Ochimizu

Shun Sugiura

Shigeru Hayashida

Yuuji Hanaki

Daiki Tajima

Yuuji Ootani

Tomoaki Mitsunaga

Takamichi Sakai

Mao Hosoda

A semiconductor device includes a semiconductor element, a sealing body, and a plurality of terminals. The sealing body seals the semiconductor element therein. The terminals are electrically connected to the semiconductor element inside of the sealing body, and project from the sealing body. Each of the terminals has a rough surface area having a larger surface roughness than a peripheral area in a section in a longitudinal direction of the terminal.

Semiconductor device

In a semiconductor device, a semiconductor element has a front electrode and a back electrode. The back electrode is connected to a wiring member through a bonding member. Wire pieces are disposed in the bonding member, and bonded to a bonding surface of the wiring member to protrude toward the semiconductor element. The bonding member has, in a plan view, a central region that overlaps with a central portion of the semiconductor element including an element center, and an outer peripheral region that includes a portion overlapping with an outer peripheral portion of the semiconductor element surrounding the central portion and surrounds the central region. At least four wire pieces are disposed in the outer peripheral region at positions corresponding to at least four respective corners of the semiconductor element. At least one wire piece is disposed to extend toward the element center in the plan view.

Semiconductor device having wire pieces in bonding member

A processor obtains power reception information including information on a power reception form of a power reception apparatus of each of a plurality of vehicles. The processor obtains power transmission information including information on a power transmission form of a power transmission apparatus available on a travel path through which each of the plurality of vehicles can travel. The processor selects as a vehicle to be dispatched from among the plurality of vehicles, a vehicle that can receive electric power from the power transmission apparatus on the travel path, based on the power reception information and the power transmission information.

Vehicle allocation apparatus and vehicle allocation method

A server includes a communication device and a processor. From a user terminal, the communication device acquires a vehicle dispatch request including information indicating a vehicle dispatch location and a destination of a vehicle. When the communication device acquires the vehicle dispatch request, the processor determines a traveling route of the vehicle from a current location of the vehicle to the destination via the vehicle dispatch location in accordance with the vehicle dispatch request. The processor determines a route from the current location to the vehicle dispatch location such that an amount of power storage in a power storage device at the vehicle dispatch location is larger than an amount of electric power with which the vehicle can travel from the vehicle dispatch location to the destination.

Route determination device and vehicle dispatch system

An in-vehicle network system includes a central ECU, which generates a control signal for a plurality of devices, and a plurality of zone ECUs, which relay a control signal from the central ECU. The plurality of devices include a first specific device (power window device, etc.), which is a device unrelated to drive control or the like of a vehicle, and which includes a sub controller (third signal processing unit, etc.) capable of activating an actuator based on an ON signal from at least one or some of the sensors. The first specific device is configured to control the actuator by using the sub controller in occurrence of abnormality of communication between the central ECU and the first specific device.

In-vehicle network system

A power supply system includes a plurality of power transmission coils, a display layer, and a controller. The power transmission coils are arranged in a predetermined direction on a road and configured to transmit electric power in a non-contact manner to a power receiving coil mounted on a vehicle. The display layer is provided above the power transmission coils. The controller controls a display mode of the display layer so as to guide the vehicle in accordance with a traveling state of the vehicle.

Power transmission device, non-contact power transmission system, and method for controlling power transmission device

A management system is configured to manage a power feed mat that wirelessly feeds power to a movable body. The power feed mat is configured to communicate while it is placed at a prescribed location. This management system includes a monitoring apparatus that monitors communication by the power feed mat and a processing apparatus that performs prescribed processing when the monitoring apparatus senses loss of the communication.

Management system and method of managing power feed mat

A power feed system includes a computer that evaluates benefit obtained when a power feed mat is placed, for each of a plurality of locations within a subject region where the power feed mat can be placed, the power feed mat being configured to wirelessly feed power to a movable body. In a power feed method using such a computer, a display shows a result of evaluation of the benefit for each location within the subject region evaluated by the computer.

Power feed system for evaluating placement benefits of power feed mat

A semiconductor device incudes: a semiconductor chip that includes an active area and an outer peripheral area surrounding the active area; a metal member that includes one face including a mounting portion on which the semiconductor chip is mounted and a peripheral member surrounding the mounting portion; a joining member that connects the semiconductor chip and the metal member; and a sealing resin body. The metal member includes, as the peripheral portion, an adhesive portion that surrounds the mounting portion and adheres to the sealing resin body, and a non-adhesive portion that is placed between the mounting portion and the adhesive portion. An entire width is placed in an area overlapping the semiconductor chip in a projection view in a thickness direction of the semiconductor chip.

A power feed system includes a power feed mat and a computer. The power feed mat includes a plurality of power transmission coils. The power feed mat is configured to feed power to at least one movable body on the power feed mat by using at least one of the plurality of power transmission coils. The computer is configured to determine whether or not to permit power feed to a movable body that requests power feed. In the power feed system, when the computer determines not to permit power feed, the power feed mat does not feed power to the movable body that requests power feed.

Power feed system and power feed method

A central control device and a plurality of relay devices constitute a backbone network. Each of the relay device includes: a backbone-side communication port connected to a backbone network; a plurality of device-side communication ports configured to input and output a signal to/from an onboard device; and a first interface conversion device configured to perform interface conversion between the backbone-side communication port and the device-side communication ports. The device-side communication ports include a plurality of general-purpose communication ports to which a common input circuit and/or output circuit is connected. A predetermined first onboard device is directly connected to the general-purpose communication ports, whereas a predetermined second onboard device is connected to the general-purpose communication ports via a predetermined first onboard device.

Vehicle onboard network system

An in-vehicle network system includes a power supply, an upper electronic control unit (ECU), an intermediate ECU configured to communicate with the upper ECU, and a plurality of lower ECUs configured to communicate with the intermediate ECU. The intermediate ECU is configured to receive power supplied from the power supply and supply the power supplied from the power supply to the lower ECUs. The lower ECUs are configured to transition, when the power is supplied from the intermediate ECU, from a power-off state to a standby state to wait for an instruction. The power supply is connected to the intermediate ECU via a power line and is not connected via the same power line to the upper ECU.

An in-vehicle network system includes an upper device, a first intermediate device, and a first lower device. The first intermediate device includes a first communication unit and a second communication unit that are arranged redundantly and that have a communication function. The first intermediate device is configured to communicate with the upper device via a plurality of communication paths. The first lower device is connected to the first communication unit and the second communication unit of the first intermediate device.

A semiconductor device includes a first switching element; a second switching element; a first metal member; a second metal member; a first terminal that has a potential on a high potential side; a second terminal that has a potential on a low potential side; a third terminal that has a midpoint potential; and a resin part. A first potential part has potential equal to potential of the first terminal. A second potential part has potential equal to potential of the second terminal. A third potential part has potential equal to potential of the third terminal. A first creepage distance between the first potential part and the second potential part is longer than a minimum value of a second creepage distance between the first potential part and the third potential part and a third creepage distance between the second potential part and the third potential part.

Semiconductor package having an additional material with a comparative tracking index (CTI) higher than that of encapsulant resin material formed between two terminals

An in-vehicle network system includes a power source, an upper electronic control unit (ECU), a first intermediate ECU and a second intermediate ECU, at least one first lower ECU and at least one second lower ECU, a power source relay, and a communication relay provided between the first communication path and the second communication path. When the upper ECU detects that an anomaly occurs in the first intermediate ECU, the power source relay and the communication relay are controlled such that a first power source path and a second power source path are connected to each other and a first communication path and a second communication path are connected to each other, and the second intermediate ECU performs electric power supply to and communication management of the first lower ECU.

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Toyota, Japan

Takahiro Hirano