Hitachi Chemical Company, Ltd.

Mitsubishi Heavy Industries Limited

Showa Denko Materials Co., Ltd.

Takahiro Hidaka

Tomohiro Iwano

Hideyuki Uechi

Hisataka Minami

Keita Arakawa

Norito Katsuki

Tatsuo Ishiguro

Makoto Kaji

Shigeki Senoo

Yasuharu Murakami

Yuichi Otani

Michiko Natori

Yuichiro Hirano

Taichi Yoshii

Fumito Kajitani

Takahiro Yamana

Teppei Hata

Kanako Nagayama

Yasuhara Murakami

A steam generation apparatus includes: a heat medium flow passage through which a heat medium flows; a primary economizer disposed in the heat medium flow passage; a secondary economizer disposed in the heat medium flow passage at an upstream side of the primary economizer with respect to a flow direction of the heat medium; a primary evaporator disposed in the heat medium flow passage at an upstream side of the secondary economizer with respect to the flow direction of the heat medium; a first flash tank for generating flash steam; a first feed water line configured to supply water heated by the primary economizer to the secondary economizer; and a second feed water line disposed so as to branch from the first feed water line and configured to supply the water heated by the primary economizer to the first flash tank.

Steam generation apparatus and exhaust gas heat recovery plant

A polishing liquid comprises: abrasive grains; a compound having an aromatic heterocycle; an additive (excluding the compound having an aromatic heterocycle); and water, wherein: the abrasive grains include a hydroxide of a tetravalent metal element; the aromatic heterocycle has an endocyclic nitrogen atom not bound to a hydrogen atom; and a charge of the endocyclic nitrogen atom obtained by using the Merz-Kollman method is &#x2212;0.45 or less.

Slurry, polishing-liquid set, polishing liquid, and polishing method for base

A non-positive displacement type pressurizing device for pressurizing a fluid includes a rotor including a rotary blade row including a plurality of rotary blades provided at intervals in a circumferential direction; a casing that accommodates the rotor; a stationary blade row supported by the casing and including a plurality of stationary blades provided at intervals in the circumferential direction; and a plurality of heat exchanging units for cooling the fluid, wherein the heat exchanging units are configured to divide a flow path formed between stationary blades, of the plurality of stationary blades, adjacent to one another in the circumferential direction in a height direction of the stationary blades.

Pressurizing device, carbon dioxide cycle plant, and combined cycle plant

Slurry, polishing-liquid set, polishing liquid, method for polishing substrate, and substrate

A resist pattern having a film thickness of 1 to 100 &#x3bc;m and an aspect ratio (ratio of the line width to the film thickness of the resist pattern) of 3.5 or higher is provided in accordance with the present invention, the resist pattern being useful for increasing the density of a semiconductor package substrate circuit, and use of the resist pattern enabling a low conductor resistance to be maintained in fine wiring. This resist pattern can be produced using, for example, a photosensitive resin composition that includes (A) a binder polymer, (B1) a photopolymerizable compound having three ethylenically unsaturated bonds per molecule, (C) a photopolymerization initiator, and (D) either or both of a compound represented by general formula (I): (in the formula, m is an integer of 2 to 6) or a compound represented by general formula (II). 

Resist pattern, process for producing same, and utilization thereof

The present invention provides a photosensitive resin composition for laser scanning exposure, which satisfies the following formula (1): wherein Erepresents an exposure amount in mJ/cmat which the photosensitive resin composition is cured at the 21st step of the density 1.00 of a 41-step step tablet having a density range from 0.00 to 2.00, a density step of 0.05, a tablet size of 20 mm&#xd7;187 mm and a step size of 3 mm&#xd7;12 mm, by irradiation with a full wavelength active light of a high pressure mercury lamp and Erepresents an exposure amount in mJ/cmat which the photosensitive resin composition after being left for 2 hours under 40 W non-ultraviolet white lamp is cured at the 21st step of the 41-step step tablet by irradiation with a full wavelength active light from a high pressure mercury lamp.

Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern and method for producing printed wiring board

Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern, and method for producing printed wiring board

Hexaaryl biimidazole compounds as photoinitiators, photosensitive composition and method of manufacturing patterns using the compounds

Growing community of inventors

Tokyo, Japan

Takahiro Hidaka