Kabushiki Kaisha Nippon Conlux

Hitachi, Ltd.

Renesas Electronics Corporation

Nippon Conlux Co., Ltd.

Mitsubishi Chemical Corporation

Tdk Corporation

Renesas Technology Corp.

Konica Corporation

Mistubishi Chemical Corporation

Ntt Docomo, Inc.

Takahiro Hayashi

Kazuo Tanaka

Naozumi Morino

Kenji Nakajima

Kazuo Sakamoto

Shunsuke Toyoshima

Mitsugu Mikami

Yasuyuki Kodama

Masato Yagi

Masashi Kondo

Takeshi Ishikawa

Yoshikazu Mori

Masao Tomioka

Hiroshi Morishima

Shinichi Kosugi

Osamu Kohama

Makoto Aoki

Atsushi Takahashi

Takayuki Kobayashi

Takuya Teranishi

Masayasu Hasuike

Akinobu Sasaki

Hiroshi Tategaki

Morio Katagiri

Masahiro Oosuka

Takahiro Mori

Yukio Ito

Takeshi Ishida

Akihiro Fujiwara

Akihito Hanaki

Kunihiro Ueda

Hiroyuki Hosono

Yoshikazu Goto

Junichiro Kawamoto

Keigo Yoshida

Kazuya Tanaka

Yukiko Takagi

Saki Fujita

Kenichi Watanabe

Kunitsuna Sasaki

Naoki Sugiura

Kenji Koyama

Tsunehiro Aso

Takeshi Terayama

Hisato Kato

Kenji Shirasuna

Akihiro Nobuhara

Yukichi Konami

Kazuyoshi Imai

Fumio Yuzawa

Nobutaka Takefuta

Masahiro Osuka

Yuuji Fujita

Kouichiro Taniguchi

A fiber-reinforced resin prepreg and a molded article obtained by molding a molding material including the fiber-reinforced resin prepreg are described. The fiber-reinforced resin prepreg contains a carbon fiber bundle and a matrix resin composition. The ipa value of the carbon fiber bundle measured by an electrochemical measurement method is 0.14 μA/cmor more. The impact strength of a film obtained by solidifying the matrix resin composition under particular molding conditions is 12.0 kJ/m or more.

Fiber-reinforced resin prepreg, molded article, and fiber-reinforced thermoplastic resin prepreg

Provided is a fiber-reinforced thermoplastic resin prepreg which exhibits high interfacial adhesion between reinforcement fibers and a matrix resin, while having excellent interlaminar fracture resistance. The fiber-reinforced thermoplastic resin prepreg of the present invention comprises: a matrix resin comprising a polyarylketone resin and a polyetherimide resin; and a carbon fiber, wherein the polyetherimide resin in the matrix resin comprises a polyetherimide resin having a structural unit represented by Formula (1), an amount of the polyetherimide resin in the matrix resin (100% by mass) is 3% by mass to 25% by mass, and an amount of the polyarylketone resin in the matrix resin (100% by mass) is 75% by mass or more.

Fiber-reinforced thermoplastic resin prepreg and shaped article

Provided are a carbon fiber thermoplastic resin prepreg which is a carbon fiber prepreg obtained by impregnating a PAN-based carbon fiber in which the average fiber fineness of a single fiber is 1.0 dtex to 2.4 dtex with a thermoplastic resin, wherein the thermoplastic resin satisfies 20&#x2264;(FM/FS)&#x2264;40 (where FM: flexural modulus (MPa) of a resin sheet comprising only the thermoplastic resin, and FS: flexural strength (MPa) of the resin sheet), a method for manufacturing the same, and a carbon fiber composite material employing the carbon fiber prepreg.

Carbon fiber thermoplastic resin prepreg, carbon fiber composite material and producing method

Provided is a coin storage cassette capable of preventing a coin payout failure without requiring a change in the structure of conventional coin handling apparatuses, even when an adapter tube for changing the apparent inner diameter of a coin tube is mounted. 1: An upper rear notchis formed on the back face side of the adapter tube, projection-shaped attachment portionsare formed on opposing outside portions of the adapter tube, and groove-shaped attachment reception portionsare formed in the coin tube, each attachment portionbeing engaged into a respective one of the attachment reception portions, and the attachment reception portionsrestricting top-to-bottom and front-to-rear movement of the adapter tube; and the adapter tubeis detachable from the rear side of the coin storage cassette, while a coveris widely opened. 2: The upper rear notchis formed on the back face side of the adapter tubeso as to communicate with the upper edge, and a lower front notchis formed on the front face side of the adapter tubeso as to communicate with the lower edge, so that the +coins are guided backward in the upper edge and guided forward in the lower edge.

Coin storage cassette

A coin tube in which coins falling from an upper side are loaded and stored, the coin tube includes: a coin posture conversion unit, configured to convert a falling posture of a coin, at a coin entry port. The coin posture conversion unit has a shape asymmetric to a center line cl in a progressing direction of the coin on the coin posture conversion unit. The coin tube can suppress generation of coin erection.

Coin tube

Provided are a layered substrate that has excellent mechanical properties such as a flexural strength or a flexural modulus applicable to a structural material, the variations in those mechanical properties are small, exhibits excellent formability into a complicated shape, and is able to be molded in a short time, and a method for manufacturing the same. A layered substrate fabricated by layering plural sheets of sheet-shaped prepregs containing a reinforcing fiber oriented in one direction and a thermoplastic matrix resin, wherein the prepreg has a slit penetrating from the front surface to the back surface, each slit is provided so as to intersect with each reinforcing fiber only one time.

Layered substrate and method for manufacturing same

A coin dispensing device includes a plurality of coin tubes storing coins, a coin withdrawing and discharging part, a change part which locates a change lever at a dispensing preventing position, in which the coin withdrawing and discharging part is prevented from discharging coins, by energizing a change lever solenoid and locates the change lever at a dispensing allowing position, in which the coin withdrawing and discharging part is allowed to discharge the coins, by a biasing force of a return spring when the energizing of the change lever solenoid is stopped, and a keeping means which keeps a state of the change lever. The coin withdrawing and discharging part withdraws and discharges the coins when the keeping means keeps the state of the change lever and the energizing of the change lever solenoid is stopped.

Coin dispensing device

A coin delivering device includes plural coin tubes, a coin base, a payout slide, a payout link, and a change slide. At least one of the coin tubes is a multiple-coin delivering coin tube from which plural coins are pulled out in one time of pulling out the payout slide. A recess portion sized for housing a coin is provided at a position corresponding to the multiple-coin delivering coin tube, on the coin base. A vertical wall portion is provided around a coin housing hole corresponding to the multiple-coin delivering coin tube, on the payout slide, protrudes to the side of the coin base, and, in a standby mode, is positioned in the recess portion of the coin base. An upper surface of the change slide corresponding to the multiple-coin delivering coin tube is positioned similar to a bottom surface of the recess portion of the coin base in height.

Coin delivering device

The present invention has for its purpose to provide a technique capable of reducing planar dimension of the semiconductor device. An input/output circuit is formed over the semiconductor substrate, a grounding wiring and a power supply wiring pass over the input/output circuit, and a conductive layer for a bonding pad is formed thereover. The input/output circuit is formed of MISFET elements in the nMISFET forming region and the pMISFET forming region, resistance elements in the resistance element forming regions and diode elements in the diode element forming regions functioning as protective elements. A wiring connected to the protective elements and positioned under the grounding wiring and the power supply wiring is pulled out in a pulling-out region between the nMISFET forming region and the pMISFET forming region and between the grounding wiring and the power supply wiring to be connected to the conductive layer.

Growing community of inventors

Tokyo, Japan

Takahiro Hayashi