Yamaha Corporation

Toppan Printing Co., Ltd.

Toyota Tsusho Corporation

Takahiro Hayashi

Yuma Horio

Toshiharu Hoshi

Takashi Nakamura

Kenzaburou Iijima

Tomoaki Taniguchi

Yuki Muroi

Tetsutsugu Hamano

Kazushi Sakurauchi

A thermoelectric conversion module includes: a substrate; a plurality of thermoelectric elements including an N-type element and a P-type element; a bonding layer including silver and disposed between the substrate and the plurality of thermoelectric elements; a first electrode that connects the N-type element with the bonding layer, the first electrode including a first nickel layer and an aluminum layer that is disposed between the first nickel layer and the N-type element; and a second electrode that connects the P-type element with the bonding layer, the second electrode including a second nickel layer.

Thermoelectric conversion module

Provided is a thermoelectric conversion module having a high heat resistance. The thermoelectric conversion module includes a first substrate, a second substrate, a thermoelectric element, and a bonding layer. The first substrate includes a first metalized layer. The second substrate includes a second metalized layer which faces the first metalized layer. The thermoelectric element includes a chip formed from a thermoelectric material and is arranged between the first metalized layer and the second metalized layer. The bonding layer is composed of a sintered body of a metallic material of which the average crystal particle diameter is no greater than 20 &#x3bc;m and bonds the first metalized layer and the second metalized layer with the thermoelectric element.

Thermoelectric conversion module and manufacturing method thereof

A thermoelectric conversion module package includes: a thermoelectric conversion module including a first and a second substrate opposed to each other, a plurality of thermoelectric elements arranged between the first and second substrates, and a first and a second lead wire drawn out from one of the first and second substrates; and a package including a first metal foil covering the first substrate of the thermoelectric conversion module, a second metal foil covering the second substrate of the thermoelectric conversion module, a resin portion hermetically connecting the first metal foil and the second metal foil along an outer edge portion of the thermoelectric conversion module, and an insertion portion for hermetically passing the first and second lead wires through the resin portion.

Thermoelectric conversion module package

A thermoelectric conversion module includes a pair of substrates, electrodes formed on the facing surfaces of a pair of the electrodes, a thermoelectric element disposed between the electrodes, and a joining layer that joins the electrodes and the thermoelectric element, in which the thickness of the joining layer is 30 &#x3bc;m or more, and is formed by sintering paste including metal particles smaller than 100 nm.

Thermoelectric conversion module and method for manufacturing thermoelectric conversion module

A method of preparing a thermoelectric material includes the following steps. A thermoelectric raw material can be filled into a cavity of a first mold so that the thermoelectric raw material filled in the cavity has first and second dimensions. The first dimension can be defined in a first direction. The second dimension can be defined in a second direction. The second direction can be perpendicular to the first direction. The first dimension can be equal to or greater than the second dimension. The thermoelectric raw material filled in the cavity can be cooled in a uniaxial direction that is parallel to the second direction at a cooling rate of at least 600&#xb0; C./min.

Method of preparing a thermoelectric material, method of forming a thermoelectric device, and method of fabricating a thermoelectric module

A Peltier module is appropriate to a cooler incorporated in an optical communication module, and includes a series of Peltier junctions sandwiched between two substrates and power supply electrodes respectively connected to the outermost Peltier junctions, wherein the power supply electrodes pass through hollow spaces formed in one of the substrates so that conductive wires approach the contact areas in the upper surfaces of the power supply electrodes through the hollow space without a sharp bend.

Peltier module with durable power supply lines and exothermic module with built-in cooler

Thermoelectric material of (Bi, Sb)(Te, Se) system is produced through a liquid quenching method and an extrusion from a die unit having an inlet portion and an outlet portion crossing each other at 30-150 degrees so that the crystal grains have an average grain size equal to or less than 30 microns and (001) planes mostly oriented in parallel to a direction in which electric current to flow, thereby achieving the figure of merit equal to or greater than 3.0&times;10 /K.

Growing community of inventors

Hamamatsu, Japan

Takahiro Hayashi