Ngk Spark Plug Company, Limited

Niterra Co., Ltd.

Ngk Spark Plus Co., Ltd.

Takahiro Hayashi

Seiji Mori

Tatsuya Ito

Makoto Wakazono

Yoshiaki Matsubara

Yasuhiro Fujita

Makoto Nagai

Masataka Taguchi

Tomohiro Nishida

Hitoshi Iimi

Hajime Saiki

Takuya Hando

Makoto Origuchi

Masahiro Iba

Satoru Watanabe

Koji Sakuma

Tomoaki Mizutani

Takeshi Toyoshima

Hajime Sakai

Disclosed is a wiring substrate whose orientation can be easily recognized and which can prevent occurrence of a failure which would otherwise occur after a semiconductor device is mounted on the wiring substrate, or after an electronic component composed of the wiring substrate and the semiconductor device mounted thereon is mounted on a base substrate or the like. The wiring substrate includes a base substrate, and a metallic member disposed on a first face of the base substrate. The metallic member has a shape which is plane symmetric with respect to a plane which extends through a center of the first face and is perpendicular to the first face. A recess is formed, as a partial dent, on one of outer surfaces of the metallic member.

Wiring substrate

A wiring substrate has a substrate body formed by a single or a plurality of insulating layers and having front and back surfaces located at opposite sides of the substrate body; a plurality of pads formed on at least one of the front surface, the back surface and an inner layer surface that is located between the front and back surfaces, and having a staggered arrangement in plan view; and a plurality of via conductors formed at each of the pads, extending in a thickness direction of the substrate body with the plurality of via conductors being parallel to each other and connecting the pads located on different surfaces. Arrangement, in plan view, of the plurality of via conductors connecting to the pad and arrangement, in plan view, of the plurality of via conductors connecting to an adjacent pad located on the same surface are different from each other.

A wiring board includes: a wiring-board body including a first surface and a second surface opposite to the first surface, and including at least one insulator layer; pads formed at at least one of an internal layer boundary plane and the first surface and the second surface defining a first plane; and via conductors connected to corresponding ones of the pads, and arranged in parallel to extend in a thickness direction of the wiring-board body. Each of first and second ones of the pads adjacent to each other in planar view at the first plane is connected to corresponding ones of the via conductors. The via conductors corresponding to the first pad are arranged differently from the via conductors corresponding to the second pad, in planar view.

Wiring board

Disclosed is a wiring board including: an insulating substrate; a plurality of connection terminals arranged on the insulating substrate; and a plurality of non-conductive protruding parts respectively arranged on areas of the insulating substrate except areas on which the plurality of connection terminals are arranged. The non-conductive protruding parts has a height greater than that of the connection terminals.

Wiring board and manufacturing method thereof

A wiring substrate includes a surface layer having electrical insulation properties and a connection terminal having electrical conduction properties and protruding from the surface layer. The connection terminal includes a base portion, a covering portion and a filling portion. The base portion of the connection terminal is made of an electrically conductive first metal and located adjacent to the surface layer so as to extend through the surface layer and protrude from the surface layer. The covering portion of the connection terminal is made of an electrically conductive second metal having a melting point lower than that of the first metal and located so as to cover the base portion. The filling portion of the connection terminal is made of at least one of the second metal and an alloy containing the first and second metals and located so as to fill a hollow in the base portion.

Wiring substrate and production method therefor

A method of manufacturing a wiring substrate according to the present invention includes a step of forming a wiring layer including connection terminals on a first insulating layer; a step of forming a second insulating layer on the wiring layer and on the first insulating layer; a step of forming electrically insulative dummy portions separated from the wiring layer on the first insulating layer through patterning of the second insulating layer; a step of forming a third insulating layer on the wiring layer, on the dummy portions, and on the first insulating layer; and a step of forming openings in the third insulating layer for exposing the connection terminals in such a manner that upper end portions of the connection terminals protrude from the third insulating layer, and lower end portions of the connection terminals are embedded in the third insulating layer.

Method of manufacturing wiring substrate, and wiring substrate

A wiring board includes a base layer, a plurality of connection terminals and a surface layer. The base layer is electrically insulative. The plurality of connection terminals are conductive and formed on the base layer. The surface layer is electrically insulative, and fills gaps between the plurality of connection terminals on the base layer. The connection terminals include a base portion made of a conductive first metal and a coating portion made of a conductive second metal that is different from the first metal. The coating portion penetrates the surface layer, and coats the base portion to the base layer.

To provide a wiring board excellent in connection reliability with a semiconductor chip. A first buildup layerwhere resin insulating layersandand a conductor layerare laminated is formed at a substrate main surfaceside of an organic wiring board. The conductor layerfor an outermost layer in the first buildup layerincludes a plurality of connecting terminal portionsfor flip-chip mounting a semiconductor chip. The plurality of connecting terminal portionsis exposed through an opening portionof a solder resist layer. Each connecting terminal portionincludes a connection regionfor a semiconductor chip and a wiring regiondisposed to extend from the connection regionalong the planar direction. The solder resist layerincludes, within the opening portion, a side-surface covering portionthat covers the side surface of the connecting terminal portionand a projecting wall portionthat is integrally formed with the side-surface covering portionand disposed to project so as to intersect with the connection region

Wiring board and method for manufacturing same

A wiring substrate according to the present invention includes a laminate of one or more insulation layers and one or more conductive layers and further includes a plurality of connection terminals formed on the laminate and spaced apart from one another, each having a step formed at the outer periphery of a first main surface opposite a contact surface in contact with the laminate, and a filling member provided in a filling manner between the connection terminals.

Wiring substrate having a plurality of connection terminals and a filling member provided therebetween

To provide a wiring board in which wiring conductors are securely protected by a precise and rigid dam portion formed on an outermost layer of a laminate and that is excellent in connection reliability with a semiconductor chip. A laminate that configures this wiring board includes multiple connection terminal portions and wiring conductors as a conductor layer of the outermost layer. The wiring conductors are arranged at predetermined positions, passing through between multiple connection terminal portions for flip-chip mounting a semiconductor chip. A resin insulating layer of the outermost layer of the laminate has a dam portion and a reinforcement portion. The dam portion covers the wiring conductors. The reinforcement portion is formed, between the wiring conductor and the connection terminal portion that is adjacent to the wiring conductor, lower than a height of the dam portion. The reinforcement portion is concatenated with a side surface of the dam portion.

Wiring board and manufacturing method of the same

A wiring substrate includes a layered structure including one or more insulating layers and one or more conductor layers; a plurality of connection terminals formed on the layered structure; a first resin layer formed on the layered structure and having (defining) a plurality of first openings through which the connection terminals are respectively exposed; and a second resin layer formed on the first resin layer and having (defining) a plurality of second openings through which the connection terminals are respectively exposed and which are smaller in opening diameter than the first openings, wherein the second resin layer has, around each of the second openings, an inclined surface which is formed such that the distance between the inclined surface and the layered structure decreases toward the second opening.

Wiring substrate and method for producing wiring substrate

A wiring substrate manufacturing method includes: preparing a wiring substrate including a core layer having a principal surface, a resin insulating layer and a conductor layer alternately laminated to form at least one laminated layer on the one principal surface of the core layer, a solder resist layer including opening portions and formed on an outermost surface of the at least one laminated layer such that respective portions of an outermost conductor layer are exposed from the opening portions; forming a Sn-containing underlying layer on the respective portions of the outermost conductor layer by a plating process; and fusing the Sn-containing underlying layer to the respective portions of the outermost conductor layer by a heating process, then mounting solder balls directly on respective portions of the Sn-containing underlying layer, and then connecting the solder balls to the respective portions of the Sn-containing underlying layers.

Wiring substrate manufacturing method

A gas sensor comprises a cylindrical metallic housing, a sensor element having at a front end thereof a sensing portion and disposed axially in the housing with the sensing portion protruded from a front end of the housing, a sensor terminal fitted to a rear end of the sensor element to produce a signal output from the sensing portion, a first protective cover attached to a front end portion of the housing to cover the sensing portion and a second protective cover attached to a rear end portion of the housing to cover the sensor terminal. The first and second protective covers includes attachment portions attached around the front and rear end portions of the housing, respectively. At least one of the attachment portions of the first and second protective covers has a lower hardness than a remaining portion of the protective cover.

Protective covers for gas sensor, gas sensor and gas sensor manufacturing method

It is an object of the invention to provide a sensor which is highly reliable, and a method or producing a sensor which is highly reliable, and which can be easily produced. A method of producing a sensor in which bending of a heater and the like hardly occur is provided. In the invention, an oxygen sensor () has: an oxygen sensor element (); a metal shell (); first and second sensor terminal metal parts (), (); a heater (); heater terminal metal parts (), (); a metal outer tube (); and a separator () which is housed inside the metal outer tube (), in which the terminal metal part () and the like and the heater () are held, and which provides insulation between the terminal metal part () and the like. An outer-tube butting face () is formed in a flange portion () of the separator (). In the metal outer tube (), a flange butting face () which butts against the outer-tube butting face () is formed. Both of the outer-tube butting face () and the flange butting face () form an inclined face which is more radially outward positioned as further advancing toward the tip end. The separator () is pressed toward the rear end. The pressing is conducted by deforming the metal outer tube (), and deforming a pressing metal part () which is placed around a tip end side portion () of the separator ().

Growing community of inventors

Komaki, Japan

Takahiro Hayashi