Senju Metal Industry Co., Ltd.

Other

Nec Corporation

Chisso Corporation

Takahiro Hattori

Isamu Sato

Daisuke Soma

Takahiro Roppongi

Hiroyoshi Kawasaki

Hiroshi Okada

Ken Tachibana

Hiroki Sudo

Hiroshi Takei

Takashi Hagiwara

Yuji Kawamata

Kazuhiro Yamada

Shigeki Kondo

Daisuke Souma

Atsumi Takahashi

Daisuke Maruko

Takashi Kuroda

Tomoaki Nishino

A method includes applying a first flux onto an electrode provided on a substrate and placing a solder material on the electrode, heating the substrate to form a solder bump on the electrode, deforming the solder bump to provide a flat surface or a depressed portion on the solder bump, applying a second flux to the solder bump; placing a core material on the solder bump, the core material including a core portion and a solder layer that covers a surface of the core portion, and heating the substrate to join the core material to the electrode by the solder bump and the solder layer.

Method for forming bump electrode substrate

A solder alloy that contains 0.005 mass % or more and 0.1 mass % or less of Mn, 0.001 mass % or more and 0.1 mass % or less of Ge, and a balance of Sn. A plurality of Ge oxides is distributed on an outermost surface side of an oxide film including Sn oxide, Mn oxide and Ge oxide by adding 0.005 mass % or more and 0.1 mass % or less of Mn, 0.001 mass % or more and 0.1 mass % or less of Ge to the solder alloy having a principal ingredient of Sn, so that it is possible to obtain the discolor-inhibiting effect even under the high-temperature and high-humidity environment.

Solder alloy, solder ball, chip solder, solder paste and solder joint

Provided is a solder alloy, a solder ball, a chip solder, a solder paste and a solder joint in which discoloration is suppressed and a growth of an oxide film is suppressed under a high temperature and high humidity environment. The solder alloy contains 0.005% by mass or more and 0.1% by mass or less of Mn, 0.001% by mass or more and 0.1% by mass or less of Ge and more than 0% by mass and 4% by mass or less of Ag, and a principal ingredient of remainder is Sn.

Solder alloy, solder ball, chip solder, solder paste, and solder joint

Provided is a solder material having oxidation resistance at the time of melting solder or after melting it, as well as managing a thickness of oxide film at a fixed value or less before melting the solder. A Cu core ballA is provided with a Cu ballA for keeping a space between a semiconductor package and a printed circuit board and a solder layerA that covers the Cu ballA. The solder layerA is composed of Sn or a solder alloy whose main component is Sn. For the Cu core ballA, lightness is equal to or more than 65 in the L*a*b* color space and yellowness is equal to or less than 7.0 in the L*a*b* color space, and more preferably, the lightness is equal to or more than 70 and the yellowness thereof is equal to or less than 5.1.

Solder material, solder paste, solder preform, solder joint and method of managing the solder material

Provided is a flux containing not less than 11.0 degrees and not more than 17.0 of a contact angle between the flux and a resist substrate on which the flux has been printed to have 1.0 mm of a diameter and 0.15 mm of a thickness when heating the resist substrate at 150 degrees C. for 30 seconds and cooling the resist substrate to a room temperature. The flux also contains more than zero seconds and not more than 2.0 seconds of a zero-cross time when heating a Cu plate at 150 degrees C. in a thermostat oven for 12 hours, applying the flux onto the baked Cu plate, and dipping the baked Cu plate onto which the flux is applied into a Sn-3.0Ag-0.5Cu alloy at a dipping speed of 15 mm/sec and by 2.0 mm of a dipped depth.

Flux composition for solder applications

A core material including a core and a solder plating layer of a (Sn&#x2014;Bi)-based solder alloy made of Sn and Bi on a surface of the core. Bi in the solder plating layer is distributed in the solder plating layer at a concentration ratio in a predetermined range of, for example, 91.7% to 106.7%. Bi in the solder plating layer is homogeneous, and thus, a Bi concentration ratio is in a predetermined range over the entire solder plating layer including an inner circumference side and an outer circumference side in the solder plating layer.

Core material, semiconductor package, and forming method of bump electrode

Provided are a Cu core ball and a cu core column, which achieve dropping strength and strength against heat cycle. The Cu core ball () contains a Cu ball () made of Cu or a Cu alloy and a solder layer () which is made of a solder alloy composed of Sn and Cu and covers the Cu ball (). The solder layer () contains not less than 0.1% through not more than 3.0% of Cu and the remainder is composed of Sn and impurities.

Cu core ball, solder paste, formed solder, Cu core column, and solder joint

A bump electrode is formed on an electrode pad using a Cu core ball in which a core material is covered with solder plating, and a board which has bump electrodes such as semiconductor chip or printed circuit board mounts such a bump electrode. Flux is coated on a substrate and the bump electrodes are then mounted on the electrode pad. In a step of heating the electrode pad and the Cu core ball to melt the solder plating, a heating rate of the substrate is set to have not less than 0.01&#xb0; C./sec and less than 0.3.

Bump electrode, board which has bump electrodes, and method for manufacturing the board

A Cu ball that has low &#x3b1; dose and high sphericity even when containing at least a certain amount of impurity elements other than Cu. Even when the purity thereof is 99.995% or less and U and Th contents are 5 ppb or less in order to suppress any software errors and decrease connection failure, &#x3b1; dose is 0.0200 cph/cmor less. Further, the sphericity of the Cu ball is unexpectedly improved by making the purity not more than 99.995%.

Cu ball

A signboard device is configured by combining a dynamic-image block for displaying a dynamic image and a plurality of light-source blocks each provided with a light source emitting light forward. The signboard device is configured so that, when seen along a front-rear direction, the length from the top edge to the bottom edge of each of the light-source blocks is the same as or n times or 1/n times (n being an integer) the length from the top edge to the bottom edge of the dynamic-image block, and the length from the left edge to the right edge of each of the light-source blocks is the same as or m times or 1/m times (m being an integer) the length from the left edge to the right edge of the dynamic-image block.

Signboard device

A production process for a long fiber-filled thermoplastic resin composition using an apparatus having an extruder with at least two raw material feeding ports and a resin impregnating bath at the tip of the extruder, comprising the steps of feeding a resin mixture to a first feeding port provided at an upstream position of the extruder, feeding alkaline earth metals to a second feeding port provided at a downstream position of the extruder, melt-kneading to a mixture, allowing the obtained molten resin mixture to flow into the resin impregnating bath, passing a continuous fiber bundle through the molten resin mixture in the resin impregnating bath to impregnate the continuous fiber bundle with the resin mixture.

Process for the preparation of fiber-filled thermoplastic resin composition

Provided is a heat-sensitive recording material which uses a polyolefin resin as a base for a support but brings about less inferior appearance such as curling and irregularities and which has an excellent resolution and can provide a vivid recorded image in a high density. The heat-sensitive recording material comprises a void-containing stretched film comprising a crystalline polypropylene resin and dicyclopentadiene petroleum resin as essential components and a heat-sensitive recording layer formed on a surface thereof.

Heat-sensitive recording material

A method for producing a reinforced thermoplastic resin composition in a stable manner for long periods of time, comprising providing a melt-kneading apparatus with a plurality of supply ports arranged in line with the direction, along which a molten resin flows, supplying a polyolefin resin, a solid modifier and a solid radical generator through a first supply port positioned on the most upstream side of the extruder; supplying a flake inorganic filler through a second supply port arranged at a position on the downstream side of the first supply port; supplying a fibrous reinforcing material through a third supply port arranged at a position on the downstream side of the second supply port; and supplying an unsaturated silane compound through a liquid-introducing port arranged at a position on the immediately downstream side of the first supply port and on the upstream side of the second supply port, to thus melt and knead these components. Also provided is a production apparatus for practicing the production method.

Method for producing reinforced thermoplastic resin composition and melt-kneading apparatus

A buffer amplifier is inserted out the input of a D/A converter circuit having an R/2R ladder circuit configuration to provide a D/A converter which, when the D/A output is in an unused state, has reduced current consumption and, at the same time, can stabilize the reference voltage. When the buffer amplifier is placed in a stand-by state, it sets the output of the D/A converter at a high impedance value.

D/A converter

The present invention provides an operational amplifier circuit which comprises an input circuit for outputting a difference between first and second input voltages, an amplifier circuit for amplifying the difference, a drive circuit for driving a latter stage in response to output from the amplifier circuit and an output circuit which constitutes the latter stage, wherein the amplifying circuit has a serial circuit composed of a first constant current source and a first transistor and a serial circuit composed of a second constant current source and a second transistor, the emitter of the first transistor is connected to the base of the second transistor, and the difference is applied to the base of the first transistor; the drive circuit has a serial circuit composed of third and fourth transistors whose collectors and emitters are interconnected and a third constant current source, the base and collector of the fourth transistor are interconnected, and the base of the third transistor is connected to the emitter of the second transistor; and the output circuit receives inputs from the collector of the second transistor and the base of the fourth transistor.

Growing community of inventors

Tochigi, Japan

Takahiro Hattori