Renesas Electronics Corporation

Takahiro Hara

Kenichi Ito

Shien Cho

First, a product to be inspected is prepared. The product to be inspected includes a substrate and a first film formed on the substrate. TDS is performed while the temperature of the product to be inspected is raised to 1,000&#xb0; C. or higher, and the quality of the product to be inspected is determined by checking for the presence or absence of a peak at 1,000&#xb0; C. or higher. Meanwhile, the substrate is, for example, a semiconductor substrate such as a silicon substrate. In addition, the rate of temperature rise is, for example, equal to or higher than 40&#xb0; C./min and equal to or lower than 80&#xb0; C./min. The upper limit of the temperature of TDS is, for example, 1,300&#xb0; C.

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Ibaraki, Japan

Takahiro Hara