Showa Denko Materials Co., Ltd.

Kyb Corporation

Resonac Corporation

Nec Corporation

Kayaba Industry Company, Ltd.

Takahiro Fukui

Tetsuyuki Shirakawa

Tatsuya Kumada

Satoru Matsumoto

Yusuke Asakawa

Masahiro Miwa

Shinnosuke Iwamoto

Hiroyuki Izawa

Shuji Kamo

One aspect of the present invention relates to an adhesive composition used for connecting electronic members, the adhesive composition comprising: a first conductive particle that is a conductive particle having a projection capable of penetrating an oxide film formed on a surface of an electrode of the electronic member; and second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle having a nonconductive core body and a conductive layer provided on the core body.

Connected electronic members

One aspect of the present invention is an adhesive film comprising: a first adhesive layer; a metal layer; and a second adhesive layer in this order, wherein each of the first adhesive layer and the second adhesive layer comprises: a first conductive particle being a dendritic conductive particle; and a second conductive particle being a conductive particle other than the first conductive particle and the second conductive particle comprising a non-conductive core and a conductive layer provided on the core.

Adhesive film

Adhesive composition

One aspect of the invention is a method of manufacturing a connection structure, including disposing an adhesive layer between a first electronic member including a first substrate and a first electrode formed on the first substrate and a second electronic member including a second substrate and a second electrode formed on the second substrate, and pressure-bonding the first electronic member and the second electronic member via the adhesive layer such that the first electrode and the second electrode are electrically connected to each other, wherein the first electronic member further including an insulating layer formed on a side of the first electrode opposite to the first substrate, and the adhesive layer including: a first conductive particle being a dendritic conductive particle; and a second conductive particle being a conductive particle other than the first conductive particle and having a non-conductive core and a conductive layer provided on the core.

Connection structure and method for producing same

One aspect of the present invention is an adhesive film comprising a first adhesive layer comprising a first conductive particle that is a dendritic conductive particle; and a second adhesive layer containing a second conductive particle that is a conductive particle other than the first conductive particle, the second conductive particle comprising a nonconductive core body and a conductive layer provided on the core body.

A damping valve includes an annular valve disc, the valve disc having an annular outer peripheral sheet that projects toward an axial direction of the valve disc, an inner peripheral sheet that is provided on an inside of the outer peripheral sheet and projects toward the axial direction, an annular window formed between the outer peripheral sheet and the inner peripheral sheet, and a port that communicates with the annular window. The damping valve comprises an annular leaf valve that is laminated on the valve disc and is seated/unseated on the outer peripheral sheet, an annular spacer that is interposed between the leaf valve and the inner peripheral sheet and sets an initial deflection amount of the leaf valve, and a positioning part that restricts positional deviation of the spacer in a radial direction relative to the valve disc.

Damping valve

A shock absorber includes: a metal cylindrical outer tube; a rod inserted into the outer tube, the rod being capable of moving in the axial direction; a bump cushion attached to an outer periphery of the rod that protrudes from the outer tube; a synthetic resin bump stopper formed in a cap shape and fitted to one end in the axial direction of the outer tube, the bump stopper being configured to be abutted by the bump cushion during maximum compression; and a sacrificial corrosion part disposed between the outer tube and the bump stopper, the sacrificial corrosion part being configured to contact a metal surface of the outer tube. The sacrificial corrosion part is made of a metal having a higher ionization tendency than the outer tube, and thereby corrosion of members is suppressed.

Shock absorber

In a rotary valve comprising a tubular housing () having, at the side part, a port () for communicating the inside and the outside thereof, and a tubular valve body () which is contained within the housing rotatably and has, at the side part, an orifice hole () capable of opposing to the port (), the rotary valve of which the flow channel area formed by communicating the port () and the orifice hole () is changed by rotating the tubular valve body, at least one rotation stopping position with which the angle between the rotation stopping position at which the flow channel area is minimized and the rotation stopping position at which the flow channel area is maximized is equally divided, and the pressure loss differences between the adjacent rotation stopping positions are the same on condition that the passing flowing rate remains constant is provided.

Rotary valve

In a cache memory, a flag register stores flag bits for showing whether or not regions of a tag memory are faulty. The flag register is accessed by a part of a first cache address generated from a data processing unit. A cache address generating circuit combines the above-mentioned part with outputs of the flag register to generate a second cache address for accessing a tag memory. A comparator compares the first cache address with an address read from the tag memory. A data memory accessing circuit accesses the data memory by the first cache address in accordance with whether or not the first cache address coincides with the address read from the tag memory. A determining circuit determines whether the regions of the tag memory are faulty, so that one of the flag bits accessed by the second cache address is adjusted in accordance with whether or not a corresponding one of the regions of the tag memory is faulty.

Growing community of inventors

Tokyo, Japan

Takahiro Fukui