Hitachi, Ltd.

Hitachi Cable, Inc.

Other

Hitachi Chemical Company, Ltd.

Hitachi Information Technology Co., Ltd.

Hitachi, Ltd. & Hitachi Cable, Ltd.

Takahiro Daikoku

Wataru Nakayama

Noriyuki Ashiwake

Shizuo Zushi

Kenichi Kasai

Tadakatsu Nakajima

Fumiyuki Kobayashi

Toshio Hatada

Heikichi Kuwahara

Takayuki Atarashi

Taisei Uede

Nobuo Kawasaki

Tetsuya Tanaka

Atsuo Nishihara

Takayuki Uda

Kimio Kakizaki

Keizou Kawamura

Hiromichi Yoshida

Masahiro Ikegawa

Toshio Hatsuda

Akio Idei

Tamotsu Tsukaguchi

Kunio Fujie

Toshiki Iino

Toshitada Netsu

Isao Nakajima

Motohiro Sato

Hiroshi Inouye

Mitsuo Miyamoto

Hisanao Ogata

Hideyuki Kimura

Shigeyuki Sasaki

Kazumasa Fujioka

Shigekazu Kieda

Yoshinori Hakuraku

Yutaka Ito

Asao Nishimura

Hideo Miura

Junichi Kobayashi

Makoto Kitano

Hiroyuki Kojima

Akihiro Yaguchi

Hitoshi Yokono

Kenji Miyata

Masahide Harada

Yutaka Watanabe

Shinichi Tachi

Masanori Watanabe

Shigeo Ohashi

Akira Saito

Sueo Kawai

Ichio Shimizu

Toshihiro Yamada

Tasao Soga

Kenji Takahashi

Shigeki Hirasawa

Kazunori Tsujimoto

Tetsuya Hayashida

Akira Masaki

Masahiro Okamura

Kaoru Katayama

Yoshihiro Takada

Tomokatsu Oguro

Kiichiro Mukai

Minoru Yamada

Yukiji Iwase

Takashi Nishida

Hiroaki Hachino

Kuninori Imai

Takeo Nemoto

Atsushi Morihara

Keiichirou Nakanishi

Yasutoshi Kurihara

Masakazu Yamamoto

Hiromu Yasuda

Osamu Sekiguchi

Akihiko Yamamoto

Takeshi Yamaguchi

Shigeyasu Tsubaki

Akihiro Takanashi

Susumu Iwai

Takao Terabayashi

Masafumi Kanetomo

Kazuaki Yokoi

Toru Nishikawa

Shinichi Shimode

Kouichi Takahashi

Kazuo Yamazaki

Tetsuji Yamashita

Tomio Yoshikawa

Takeshi Miitsu

Takao Uematsu

Toshi Sasaki

Hideo Nakae

Kiyoshi Oizumi

Yoshihiko Nakayama

Katsuhiko Kasuya

Keiji Taguchi

Michihito Watarai

Shigeru Koizumi

A sealing structure for multi-chip modules stable in cooling performance and excelling in sealing reliability is to be provided. The under face of a framecompatible with a wiring boardin thermal expansion rate is fixed with solderto the face of the wiring boardfor mounting semiconductor devices; a rubber O-ringis placed between the upper face of the frameand the under face of the circumference of an air-cooled: heat sink; the plastic membermaking possible relative sliding is placed between the upper face of the circumference of the heat sinkand the upper frame; the upper face of a plastic memberis restrained with the inside middle stage of an upper frame; and the lower part of the upper frameand the frameare fastened together with bolts

Sealing structure for multi-chip module

According to the invention, a sealing top plate in a multi-chip module is formed from a ceramic with high thermal conductivity having a thermal expansion coefficient consistent with that of a multi-layer circuit substrate. A cooling flow path cover covering the entirety of cooling flow path grooves is formed as a separate metallic member. The back surface of the sealing top plate, on which are formed the cooling flow path grooves, is bonded directly to the back surface of a semiconductor device using solder. A thermal-conductive jacket with low thermal resistance is provided. A multi-chip module sealing frame is soldered to the edge of the sealing top plate. Furthermore, a sealing material such as an O-ring is simply interposed between the edge of the sealing top plate and the cooling water path cover, and tightening means is used to tighten the metallic cooling flow path cover and the multi-chip module sealing frame to each other.

Device for sealing and cooling multi-chip modules

Provided is a cooling apparatus for feeding liquid coolant to electronic elements as heat generating elements in an electronic system through a cooling pipe. The cooling pipe is in part flattened so as to form flattened portion which is made into contact with the electronic parts for cooling the latter. With this arrangement, the pipe line working is simplified while the number of joint parts in the pipe line is decreased so as to prevent leakage of the liquid coolant. Further, the heat-exchange capacity of a heat-exchanger unit is controlled in accordance with an atmospheric temperature, a temperature in the electronic system and a temperature of the liquid coolant in order to aim at preventing occurrence of freezing or dewing while enhancing the operating efficiency. Further, in an electronic apparatus having two electronic systems, a liquid coolant tank is commonly used for two electronic systems in order to prevent occurrence of dewing or freezing in a cooling system for the electronic system on resting.

Cooling apparatus for electronic unit

There are provided a highly thermal conductive grease composition having both a thermal conductivity and a satisfactory dispense property, and a cooling device applied with same. The grease composition comprises from 70 to 90% by volume of an inorganic powder which is a mixture containing at least two kinds of inorganic powders different from each other in each average particle size, and from 10 to 30% by volume of a base oil containing a mineral oil or a synthetic oil, the base oil further containing a surfactant in an amount of from 0.2 to 2.0% by weight based on the weight of the inorganic powder.

Highly thermal conductive grease composition and cooling device using the same

A multi-chip module cooling device is provided which equally and efficiently reduces the rises in temperature of LSI chips, and which is superior in the productivity of multi-chip modules, such as their capability to be assembled and disassembled. A multi-chip module includes semiconductor devices and a sealing top plate for removing the heat generated by them. The sealing top plate has a number of parallel cooling channels and a number of cross grooves extending partially across the cooling channels. The cooling channels arc covered with a cooling channel cover, which is provided with turbulent promoters on an inner wall thereof. When the cooling channel cover is placed over the sealing top plate, the turbulent promoters engage with the cross grooves. The turbulent promoters are positioned midway between adjacent semiconductor devices.

Device and method for cooling multi-chip modules

A multi-chip module is provided with a structure for disposing of a large amount of surplus solder at soldered portions. In this multi-chip module, a cooling member (structure) is soldered directly at the back side of heat generating member such as a semiconductor integrated circuit element. In order to dispose of the surplus solder, the present invention has a first metallized part formed at a cooling member which is larger than a second metallized part formed at the back side of semiconductor integrated circuit element which is solder with the first metallized part.

Multi-chip module

A highly reliable electronic apparatus free from condensation in the cabinet of the apparatus. The electronic apparatus has printed circuit boards on which heat emitting semiconductor devices are mounted and a fan. The electronic apparatus further comprises a hygrometer for measuring the relative humidity and dew-point temperature of the cooling air that is introduced into the cabinet through an opening, a surface temperature sensor for sensing the temperature of the surface of the semiconductor devices, an internal temperature sensor for sensing the internal temperature of the semiconductor device, dehumidifier and heater means made up of a heat pump and an outdoor unit, and a controller for controlling the dehumidifier means and the heater means so that the relative humidity is less than 100% and the dew-point temperature is less than the surface temperature of the semiconductor devices.

Air-cooled electronic apparatus with condensation prevention

The cooling apparatus has cooling fins attached to heat generating units of electronic devices and provided with a plurality of elemental fins. According to one embodiment, the cooling apparatus has a first cooling fin composed of elemental fins that are uniform in fin density in the height direction of the cooling fin from a fin base. The cooling apparatus also has a second cooling fin composed of elemental fins with a zero or small fin density at the lower portion close to a fin base of the cooling fin as compared with the fin density at the upper portion of the cooling fin. The first and second cooling fins are positioned adjacent to one another. Various different embodiments of cooling fins are disclosed.

Cooling apparatus for electronic devices

Semiconductor devices are fixed on a substrate by solder and a semiconductor module having an enclosed structure is formed by the substrate, flanges and a housing. Two groups of heat conducting members, each having fins respectively in contract with the semiconductor devices and an inner wall of the housing are attached to the semiconductors. A fin thickness of each fin of the two groups of heat conducting members is comparatively thick, a fin height is low and the respective fins of the respective opposed heat conducting members have with very small clearances therebetween. A liquid as a heat conducting medium is enclosed in the semiconductor module. The liquid level of the semiconductor module is controlled such that it contacts a uppermost semiconductor device in the semiconductor module in a vertical arrangement. Further, valve mechanisms for introducing and removing a cooling fluid are provided at a top face and a bottom face of a space formed in the semiconductor module. The mass production capability of the heat conducting members is improved by providing such highly rigid fins, and improved cooling function is provided by firmly introducing the cooling medium to the respective fins while permitting the module to be reduced in size.

Low thermal resistant, fluid-cooled semiconductor module

A cooling device of a multi-chip module has micropackages that are independent of thermal deformation and easy to assembly and disassembly. The multi-chip module includes a multi-layer substrate on which the micropackages, each encasing an LSI chip, are mounted, and a housing formed integrally with a cooler. Each of the micropackages includes a first heat conduction member, having a cap portion for receiving the LSI chip and a first fin made of the same material as the cap portion to be integral therewith, and a substrate fixed to the cap portion of the first heat conduction member, the LSI chip being mounted on the substrate which is securely fixed to the cap portion of the heat conduction member while being fixedly joined at the back surface thereof to an inner surface of the cap portion of the first heat conduction member. Second heat conduction members, each including a base portion and a second fin, are disposed to engage with the first fins and be pressed against the cooler by a spring, respectively.

Cooling device of multi-chip module

A cooling apparatus for electronic devices which is capable of reducing the flow resistance in an exhaust air flow passage to lessen noises and to improve the cooling performance of heat sinks when heat-generating semiconductor parts are very tightly mounted in a plane or when the calorific value of the heat-generating semiconductor parts is extremely large. In addition, the cooling apparatus realizes uniform air quantity distribution and uniform temperature distribution to the heat-generating semiconductor parts. Heat sinks 13 are respectively attached onto a plurality of heat-generating semiconductor parts 12a, 12b and 12c on a board 11. Further, nozzles 14 are respectively provided on the opposite side surfaces of heat-generating semiconductor part fitted surfaces of the heat sinks 13. The nozzles 14 have a substantially rectangular cross section parallel to the board, and are designed such that, when the ratio of the distance between the adjacent heat sinks to the pitch of the plurality of mounted heat sinks is not less than 0.00 but below 0.02, the ratio of the width of the nozzles 14 in the direction (X direction) that a refrigerant flows within the heat sinks 13 to the width of the heat sinks 13 is not less than 0.16 and not more than 0.35.

Cooling apparatus for electronic device

The disclosed invention aims at providing a semiconductor module structure which has a high ability of absorbing thermal deformation, is excellent in radiating ability and enables an easy maintenance operation. To this end, in the semiconductor module of the invention thermal conductor members are provided, each of which has an area of contact with a semiconductor device or an inner surface of a housing and has opposed heat transfer surfaces. A radiator is formed integrally on the housing. With this structure, large thermal deformation resulting from a high heat production density design can be absorbed, and at the same time heat from semiconductor devices can be efficiently radiated.

Semiconductor module

In an active noise-reduction controlling apparatus, there are provided a reference sensor for outputting a reference signal corresponding to information about a noise source, a noise-reduction error sensor for detecting a noise-reduction condition, an adding acoustic wave source controlled to produce an acoustic wave having the same amplitude as that of an acoustic wave received at the noise-reduction error sensor and having a phase opposite to that of the acoustic wave received as the noise-reduction error sensor; a first adaptive digital filter for processing the reference signal to output a control signal of the adding acoustic wave source, a second adaptive digital filter for setting a predicted value of a transfer function between an input signal of the adding acoustic wave source and an output signal of said noise-reduction error sensor, a filter coefficient controlling unit for optimizing a coefficient of the first adaptive digital filter with employment of the predicted value of the transfer function and the output of the noise-reduction error sensor, and a control unit for correcting the predicted value of the transfer function in accordance with an environmental change.

Method of actively controlling noise, and apparatus thereof

A cooling apparatus of electronic devices including thermal conductive members each of which is positioned with one side thereof being in contact with a surface of each electronic device, the other side thereof being fitted to a housing with a small clearance provided therebetween, so as to diffuse and remove heat generated in the electronic devices. In order to press each thermal conductive member onto the associated electronic device, a resilient member is provided between the housing and the thermal conductive member, and is arranged to have a width larger than a width of grooves between fins formed on the housing and also larger than a width of grooves between fins formed on the thermal conductive member. A setting space to receive each resilient member therein is formed in a region where the fins are fitted to each other, so that the resilient member and the thermal conductive member can be fitted and positioned with respect to the housing when the resilient member is provided in this setting space.

Cooling apparatus of electronic devices

Growing community of inventors

Ushiku, Japan

Takahiro Daikoku