Seiko Epson Corporation

Takahiro Amano

Tomo Ikebe

Kiyofumi Kitawada

A first substrate that includes pressure sensors which are disposed in plural around a reference point; an approximately hemispherical elastic protrusion that is positioned so that the center of the elastic protrusion is approximately disposed in a position which is overlapped with the reference point, and is elastically deformed by an external force; and a second substrate that is separated from the elastic protrusion and installed on a side which is opposite to the first substrate are provided. When the external force is applied, a predetermined calculation is performed by using a pressure value which is detected through each pressure sensor, and the direction and the intensity of the applied external force are obtained.

Detection device, electronic apparatus, and robot

The invention provides a thin-film semiconductor device, which reduces or prevents an undercut from being produced below a thin film when a pattern including an intersection is formed in the thin film. The invention also provides a method of manufacturing the same. A semiconductor film has a pattern including a bent shape or a projected shape. One line segment and another line segment, which define an intersection of the bent shape or the projected shape and which are consecutive, have an additional line segment interposed between ends of the one line segment and the other line segment form a smooth intersection in which each of the angles formed between the additional line segment and the one line segment and between the additional line segment and the other line segment is greater than 90&#xb0; and less than 180&#xb0;.

Growing community of inventors

Suwa-gun, Japan

Takahiro Amano