Hitachi-high-technologies Corporation

Sumco Corporation

Hirose Electric Company, Ltd.

Hitachi, Ltd.

Ebara Corporation

Mitsubishi Chemical Corporation

Konami Digital Entertainment Co., Ltd.

Nikken Chemicals Co., Ltd.

Takahiro Abe

Makoto Suyama

Takeshi Shimada

Kentaro Yamada

Hiroshi Kishi

Yohei Hasegawa

Hideki Fujiwara

Kouta Hasebe

Daisuke Fujita

Naohiro Yamamoto

Masato Ishimaru

Tomonori Hirao

Ken Yoshioka

Motohiko Yoshigai

Toshio Yokoyama

Atsushi Sutoh

Takashi Noda

Eriko Kitahara

Ran Ogata

Go Saito

Takuya Tsushima

Hiroaki Ishimura

Gaku Yamasaki

Satoshi Morioka

Daichi Yagi

Atsushi Yoshida

Kensuke Narita

Toshihiro Maeda

Arihiro Taki

Katsuhiko Sawada

Hiroaki Ishitsuka

A quartz glass crucibleincludes: a quartz glass crucible bodyhaving a cylindrical side wall portion, a curved bottom portion, and a corner portionwhich has a larger curvature than that of the bottom portionand connects the side wall portionand the bottom portionto each other; and an inner-surface coating filmA which contains a crystallization accelerator and is formed on an inner surfaceof the quartz glass crucible body, in which the inner surfaceof the quartz glass crucible bodyis under compressive stress. The quartz glass crucible has high durability even at a high temperature during a single crystal pull-up step and is capable of reducing a generation ratio of pinholes in a silicon single crystal.

Quartz glass crucible

Provided is a substrate holding apparatus capable of appropriately holding a substrate. The substrate holding apparatus is suggested to hold a substrate including a portion to be plated that is exposed to a plating solution and an edge portion that is an area outside the portion to be plated. The substrate holding apparatus comprises a grasp module to come in contact with the edge portion of the substrate and thereby grasp the substrate, a suction module to attract the portion to be plated of the substrate by suction to hold the portion to be plated, and a protrusion provided at a position corresponding to the portion to be plated in the substrate, and protruding toward the substrate to be held by the substrate holding apparatus more than the suction module.

Substrate holding apparatus

In an exemplary embodiment, a quartz glass crucibleincludes: a cylindrical crucible bodywhich has a bottom and is made of quartz glass; and crystallization-accelerator-containing coating filmsA andB which are formed on surfaces of the crucible bodyso as to cause crystallization-accelerator-enriched layers to be formed in the vicinity of the surfaces of the crucible bodyby heating during a step of pulling up a silicon single crystal by a Czochralski method. The quartz glass crucible is capable of withstanding a single crystal pull-up step undertaken for a very long period of time, such as multi-pulling, and a manufacturing method thereof.

Quartz glass crucible and manufacturing method thereof

To provide a plating apparatus that prevents or reduces a diversion of an electric field. According to one embodiment, a plating apparatus for performing a plating process on a substrate held onto a substrate holder is provided. The plating apparatus includes a plating tank configured to receive the substrate holder holding the substrate, a block member that extends to an inside of the plating tank from a wall surface of the inside of the plating tank, and is movable inside the plating tank, and a moving mechanism configured to move the block member toward the substrate holder disposed inside the plating tank.

Plating apparatus

A memory management method of a computer including a memory and a processor connected to the memory, the method includes, by the processor, executing an OS and executing a plurality of processes on the OS. The plurality of processes include a virtual storage device and an application. The processor provides the application with a physical area of the memory, which is managed by the OS, controls the virtual storage device to use a physical area of the memory, which is mounted on the computer, but is not managed by the OS, secures continuous physical areas from the physical area of the memory, which is managed by the OS, to be used by the virtual storage device, and performs DMA transfer between the virtual storage device and the application by using the secured continuous physical areas.

Computer system and memory management method

Provided is a method for pulling up and growing, by the Czochralski method, a silicon monocrystal from a melt obtained by fusing a silicon raw material for crystals within a quartz crucible. When the inner wall of the quartz crucible is made of a synthetic quartz layer, a gel-like liquid including a devitrification accelerator, a thickening agent, and a solvent is applied to the bottom surface of the quartz crucible inner wall or to both the bottom surface and the lateral surface thereof prior to filling the silicon raw material for crystals into the quartz crucible, whereas when the inner wall of the quartz crucible is made of a natural quartz layer, the gel-like liquid is applied to both the bottom surface and the lateral surface of the inner wall of the quartz crucible prior to filling the silicon raw material for crystals into the quartz crucible.

Method for pulling up silicon monocrystal

In an exemplary embodiment, a quartz glass crucibleincludes: a cylindrical crucible bodywhich has a bottom and is made of quartz glass; and a first crystallization-accelerator-containing coating filmA which is formed on an inner surfaceso as to cause an inner crystal layer composed of an aggregate of dome-shaped or columnar crystal grains to be formed on a surface-layer portion of the inner surfaceof the crucible bodyby heating during a step of pulling up the silicon single crystal by a Czochralski method. The quartz glass crucible is capable of withstanding a single crystal pull-up step undertaken for a very long period of time.

Quartz glass crucible, manufacturing method thereof, and manufacturing method of silicon single crystal using quartz glass crucible

Terminalsinvolving stationary-side retained portionsare held in place by stationary housings, movable-side retained portionsare held in place by a movable housing, and resilient portionsare provided between said stationary-side retained portionsand movable-side retained portions. In the above-mentioned housing, in the terminal array direction, retaining fittingsare attached at locations outside said terminal array range, the above-mentioned retaining fittingsinclude mounting portionsfixedly attached to the housing and retaining portionsthat clamp and hold the counterpart connector component. The retaining portionsof said retaining fittingsclamp and hold the above-mentioned counterpart connector component, thereby maintaining the locations of contact between the contact portions of the above-mentioned terminalsand the above-mentioned counterpart connector component.

Assembly including electrical connector for circuit boards and counterpart connector component

An operation system includes a detector, an area designator, a selection item designator, and a display controller. The detector may be configured to detect an operation of touching a touch panel at a touch-position on the touch panel. The area designator may be configured to designate an area, which includes the touch-position at which the operation of touching the touch panel is detected, from a plurality of areas of the touch panel. The selection item designator may be configured to designate an associated set of selection items which is associated with the area designated by the area designator. The display controller may be configured to control the touch panel to display an operator which includes the associated set of selection items at or in the vicinity of the touch-position, at which the operation of touching the touch panel is detected by the detector.

Operation system having touch operation enabling use of large screen area, operation control method, and operation control program

A storage apparatus and method of controlling same which, while preventing depletion of a storage area due to the generation of garbage, also prevent a drop in response performance from the perspective of the host, are proposed. One or more storage devices which constitute a pool, and a controller which manages a log-structured write space which is a virtual logical space, compresses data of a compression target among the data which has been written to the virtual volume by the host and logs the data in the log-structured write space, and writes the post-compression data which has been logged in the log-structured write space to the storage device, are provided in a storage apparatus, the controller restricting reception of a write request from the host when a used capacity of the pool is at or above a threshold; when the data logged in the log-structured write space has been updated, the controller determines whether a predetermined condition is satisfied and, when the predetermined condition is satisfied, the controller overwrites the compressed data of the pre-update data which has been logged in the log-structured write space with the compressed data of the post-update data.

Storage apparatus and method of controlling same

Electrical connector for circuit boards provided with terminals having connecting portions configured to be connected to a circuit board at one end in the longitudinal direction of said terminals and contact portions configured to be placed in contact with a counterpart connector component at the other end, and a housing holding a plurality of said terminals in place in array form. Said housing having disposed therein the contact portions of the terminals, and formed such that it is divided into a receiving-side housing, which accommodates the contact portions and receives a counterpart connector component such that it is placed in contact with the contact portions, and a board-side housing, which holds the terminals in place in sections more proximal to the connecting portions than to the contact portions and which is mounted to a circuit board, and the receiving-side housing and the board-side housing are molded as a single unit.

Electrical connector for circuit boards and method of manufacture thereof

Terminalsincluding stationary-side retained portions are held in place by stationary housings, movable-side retained portions are held in place by a movable housing, and resilient portions are provided between said stationary-side retained portions and movable-side retained portions, and, in the movable housing, abutment portionsof abutment fittings are provided on the bottom face that faces the circuit board, thereby facilitating the above-mentioned abutment portionsto abut the surface of the circuit board when the movable housingmoves towards the circuit board.

Stationary housingsinvolve stationary-side reinforcing fittingssecured in place in said stationary housingsvia integral molding with said stationary housingsand, moreover, a movable housing involves movable-side reinforcing fittingssecured in place in said movable housingvia integral molding with said movable housing. The stationary-side reinforcing fittingsinvolve exposed portionsexposed from the stationary housingsat locations outside the terminal array range of said terminals in the terminal array direction, and the movable-side reinforcing fittingsinvolve expanded portionsprotruding from the movable housingat locations outside the above-mentioned array range.

Casting polycrystalline silicon includes placing a bottomless cooling crucible divided at least partially in the axis direction into a plurality of parts in the peripheral direction and having an inner surface coated with a release agent containing nitrogen, in an induction coil of a chamber charged with an inert gas; melting a raw material of polycrystalline silicon in the bottomless cooling crucible by electromagnetic induction heating using the induction coil; and pulling out the molten silicon downward while cooling and solidifying it. Pullout of the solidified molten silicon is performed through adjusting the carbon concentration of the molten silicon to 4.0&#xd7;10atoms/cmor more to 6.0&#xd7;10atoms/cmor less, the oxygen concentration thereof to 0.3&#xd7;10atoms/cmor more to 5.0&#xd7;10atoms/cmor less, and the nitrogen concentration to 8.0&#xd7;10atoms/cmor more to 1.0&#xd7;10atoms/cmor less.

Growing community of inventors

Tokyo, Japan

Takahiro Abe