Hitachi, Ltd.

Olympus Corporation

Hitachi Metals, Ltd.

Renesas Electronics Corporation

Hitachi Chemical Company, Ltd.

Hitachi Plasma Display Limited

Takahiko Kato

Yasuhisa Aono

Jiro Kuniya

Takashi Naito

Hiroki Yamamoto

Takuya Aoyagi

Hideyo Kodama

Yoshiteru Chiba

Kinya Aota

Tadashi Fujieda

Mitsuo Chigasaki

Yoshihisa Kiyotoki

Toshimi Matsumoto

Shizuo Matsushita

Masato Yoshida

Hiroshi Satoh

Takeshi Nojiri

Akira Yoshinari

Junya Kaneda

Kousuke Kuwabara

Yasuo Kondo

Shigeo Hattori

Masakiyo Izumiya

Yoshimi Yanai

Hiroshi Nakano

Tetsuya Nagata

Haruo Akahoshi

Seiichi Watanabe

Michiya Okada

Hajime Murakami

Hiroyuki Satake

Hisanori Okamura

Toshikazu Nishino

Kenji Yamaga

Yutaka Misawa

Masahiko Arai

Katsuzo Aihara

Kazuhide Tanaka

Akihiko Chiba

Toshiya Doi

Isamu Takahashi

Mitsunori Iwamuro

Shinzo Ikeda

Shuichiro Adachi

Akira Okayama

Tetsuo Fujiwara

Keiko Kizawa

Itaru Kanno

Kenta Yamanaka

Tadaoki Morimoto

Yuichiro Koizumi

Yuuji Takada

Yoshimi Sudo

Tomoryo Shono

Yukinori Hirose

Shinzoo Ikeda

Heishichiro Takahashi

Mamoru Hirota

Jun'ya Kaneda

Shoji Shukuri

Seiji Miura

Ushio Kawabe

Yasuo Wada

Hideo Sunami

Kazumasa Takagi

Takao Imagawa

Chikayoshi Meguro

Kunihiko Suzuki

Tokuumi Fukazawa

Kunio Miyazaki

Kosuke Kuwabara

Takeshi Tsukamoto

Yoshihide Wadayama

Katsuki Miyauchi

Haruhiro Hasegawa

Isao Masaoka

Fumio Iida

Takanobu Mori

Keiichi Uraki

Akira Onuma

Kimihiko Akahori

Tsutomu Onuma

Mitsuo Nakamura

Kiyotomo Nakata

Masato Koshiishi

Masahiro Ogihara

Hisashi Sato

Tomohiro Murakami

Yuuichi Sawai

Takeshi Obana

Michiyoshi Yamamoto

Takeshi Terasaki

Hideaki Yanagita

Shuuichirou Adachi

Toshitaka Satsuta

Masato Nakamura

Yoshiaki Kurihara

Norihito Sakaguchi

Kazuki Aoshima

Kenji Ohkubo

An object of the invention is to provide: an alloy article that has excellent homogeneity in the alloy composition and microstructure as well as significant shape controllability, using an HEA with significant mechanical strength and high corrosion resistance; a method for manufacturing the alloy article; and a product using the alloy article. There is provided an alloy article comprising: Co, Cr, Fe, Ni, and Ti elements, each element in content of 5 to 35 atomic %; more than 0 atomic % to 8 atomic % of Mo %; and remainder substances of unavoidable impurities. And, ultrafine particles with an average diameter of 40 nm or less are dispersedly precipitated in matrix phase crystals of the alloy article.

Alloy article, method for manufacturing same, and product using same

An adapter for an endoscope, the adapter including: a cylindrical body having an internal portion formed on the cylindrical body, the internal portion configured to matingly engage with each of distal and proximal external portions provided on a tip of the endoscope, the distal and proximal external portions being separated in a longitudinal direction of the cylindrical body by a portion of the tip that does not engage the internal portion; and wherein the cylindrical body further having an anti-slip portion formed on an exterior of the cylindrical body, the anti-slip portion having a plurality of recesses arranged circumferentially on the exterior, a position of the anti-slip portion in the longitudinal direction being set such that a position of the proximal external portion in the longitudinal direction does not overlap with the longitudinal position of the anti slip portion where the proximal external portion is engaged with the internal portion.

Optical adapter for endoscope and endoscope apparatus

An object of the invention is to provide: an HEA article that has excellent homogeneity in the alloy composition and microstructure as well as significant shape controllability, using an HEA with significant mechanical strength and high corrosion resistance; a method for manufacturing the HEA article; and a product using the HEA article. There is provided an HEA article comprising: Co, Cr, Fe, Ni, and Ti elements, each element in content of 5 to 35 atomic %; more than 0 atomic % to 8 atomic % of Mo %; and remainder substances of unavoidable impurities.

High entropy alloy article, method for manufacturing same, and product using same

An endoscope apparatus includes: an image pickup device; a glass lid that is provided on a distal end side ahead of a light receiving surface of the image pickup device and is fixed to a front face of the image pickup device in an integrated manner; and a frame body that covers at least a part of the image pickup device and the glass lid. The frame body includes a fixing region for fixing an image pickup circuit portion provided on a proximal end side opposite to the front face of the image pickup device, and a non-fixing region that keeps the distal end side relative to the light receiving surface of the image pickup device and the glass lid fixed to the light receiving surface of the image pickup device in a non-fixed state.

Endoscope apparatus

An alloy structure has an arbitrary shape dimension which has high uniformity in the distribution of the element composition. The alloy structure contains Fe and at least four elements, which are selected from the group consisting of elements from atomic number 13 to atomic number 79 included in Group 3 to Group 16 of the periodic table of the elements and have a ratio of the atomic radius to an Fe atom of 0.83 or more but 1.17 or less, each of Fe and the four elements is contained in an atomic concentration range of 5 at % or more but 30 at % or less, a difference in atomic concentration between at least four elements among the at least four elements and Fe is in a range of less than 3 at %, and the alloy structure has, a column crystal in which the at least four elements and Fe are solid-dissolved.

Alloy structure and method for producing alloy structure

An alloy structure which has high uniformity in the distribution of the element composition and the mechanical strength and excellent high-temperature strength and corrosion resistance, contains Fe and at least four elements, which are selected from the group consisting of elements from atomic number 13 to atomic number 79, included in Group 3 to Group 16 of the periodic table of the elements, and have a ratio of the atomic radius to an Fe atom of 0.83 or more but 1.17 or less, each of the elements in an atomic concentration range of 5 at % or more but 30 at % or less, a difference in atomic concentration among the at least four elements and Fe is in a range of less than 3 at %, and the alloy structure has, as a main crystal, a column crystal in which the at least four elements and Fe are solid-dissolved.

An endoscope optical adapter includes an objective lens for observation, a lens frame configured to hold the objective lens, and a cover member fixed to an outer circumference of the lens frame and extended to an inner side to surround the objective lens. A path for discharging a droplet adhering to the objective lens is provided at a distal end portion of the lens frame or a distal end portion of the cover member.

Endoscope optical adapter and endoscope

The paste composition for an electrode are constituted with copper-containing particles having a peak temperature of an exothermic peak showing a maximum area in the simultaneous ThermoGravimetry/Differential Thermal Analysis of 280&#xb0; C. or higher, glass particles, a solvent, and a resin. Further, the photovoltaic cell has an electrode formed by using the paste composition for a photovoltaic cell electrode.

Paste composition for electrode and photovoltaic cell

A semiconductor device having Cu wiring including a basic crystal structure which can reduce surface voids, and an inspecting technique for the semiconductor device. In the semiconductor device, surface voids can be reduced down to 1/10 or less of a current practical level by specifying a barrier layer and a seed layer and setting a proportion (frequency) of occupation of a coincidence site lattice (CSL) boundary having a grain boundary Sigma value 27 or less to all crystal grain boundaries of a Cu wiring to 60% or higher. Alternatively, a similar effect of surface void reduction can be obtained by specifying a barrier layer and a seed layer and setting a proportion (frequency) of occupation of a coincidence site lattice (CSL) boundary having a grain boundary Sigma value 3 to all crystal grain boundaries of a Cu wiring to 40% or higher.

Semiconductor device, manufacturing method of semiconductor device, semiconductor manufacturing and inspecting apparatus, and inspecting apparatus

The invention provides an element including a semiconductor substrate and an electrode disposed on the semiconductor substrate, the electrode being a sintered product of a composition for an electrode that includes phosphorus-containing copper alloy particles, glass particles and a dispersing medium, and the electrode includes a line-shaped electrode having an aspect ratio, which is defined as electrode short length:electrode height, of from 2:1 to 250:1.

Element and photovoltaic cell

A paste composition for an electrode, the paste composition comprising: phosphorous-containing copper alloy particles in which the content of phosphorous is from 6% by mass to 8% by mass; glass particles; a solvent; and a resin.

An endoscope includes: an objective optical section including a first barrel; an image pickup optical section including a solid image pickup device, an optical member forming an optical image through the objective optical section on an image pickup surface of the solid image pickup device, and a second barrel housing the optical member and the solid image pickup device, the second barrel fixed to the first barrel after positional adjustment in an axial direction relative to the first barrel; a holding member formed of material having a linear expansion coefficient lower than linear expansion coefficients of the first and second barrels, and fixed to outer surfaces of the first and second barrels; a first adhesive that bonds the first barrel and the second barrel; and a second adhesive having a bonding strength higher than that of the first adhesive, which bonds the holding member to the first and second barrels.

Endoscope having adhesives with different bonding strengths

Provided is a conductive paste which contains an inexpensive metal, such as copper or aluminum, as an electrode wiring material and has oxidation resistance that enables the paste to withstand a high-temperature process performed in an oxidizing atmosphere and an electronic part equipped with electrode wiring formed from the paste. The electronic part in accordance with the present invention is equipped with electrode wiring that comprises a conductive glass phase containing transition metals and phosphorus, metal particles, and none of the substances prohibited by the RoHS directive. The electronic part is characterized in that each of the transition metals contained in the conductive glass phase is present in the state of having a plurality of oxidation numbers and that the proportion of the atoms which have the largest oxidation number for each transition metal satisfies a given relationship.

Conductive paste and electronic part equipped with electrode wiring formed from same

An object of the present invention is to provide an electronic component using a Cu-based conductive material that can suppress oxidization even in a heat treatment in an oxidizing atmosphere and that can suppress an increase in an electrical resistance. In an electronic component having an electrode or a wiring, a ternary alloy made from three elements consisting of Cu, Al, and Co is used as a Cu-based wiring material that can prevent oxidization of the electrode or the wiring. Specifically, part or the whole of the electrode or the wiring has a chemical composition in which an Al content is 10 at % to 25 at %, a Co content is 5 at % to 20 at %, and the balance is composed of Cu and unavoidable impurities, and the chemical composition represents a ternary alloy in which two phases of a Cu solid solution formed by Al and Co being dissolved into Cu and a CoAl intermetallic compound coexist together.

Electronic component provided with Cu&#x2014;Al&#x2014;Co-based alloy electrode or wiring

Growing community of inventors

Hitachinaka, Japan

Takahiko Kato