Nisshinbo Industries, Inc.

Mitsubishi Electric Corporation

Nec Tokin Corporation

Tokin Corporation

Asahi Kasei Pharma Corporation

Vernalis Limited

Takahiko Ito

Hideshi Tomita

Norimasa Nakamura

Yasuo Imashiro

Satoshi Amano

Yoshiaki Hirata

Nobuaki Konno

Tomoki Nakamura

Yoshitaka Kajiyama

Sumiko Seki

Takashi Ohsawa

Wataru Tsujita

Toshiyuki Yamashita

Kozo Ishida

Yukihisa Yoshida

Stuart Christopher Ray

Nicolas Foloppe

Mitsuaki Akaza

Masakazu Atobe

Yu Yoshii

Akio Hasebe

Kazuya Mori

Misato Takashima

Kikuo Tsuruga

Koichiro Arai

Tomohisa Toyama

A MEMS mirror device includes a frame body (an outer movable frame body), an inner movable member, a first beam, a reflective mirror member, and a coupling member. The inner movable member is disposed inside the frame body. The first beam couples the inner movable member rotatably to the frame body. The reflective mirror member has a reflective surface and a rear surface. The coupling member couples the reflective mirror member and the inner movable member. The first beam is coupled to the inner movable member at the rear surface of the reflective mirror member. The MEMS mirror device may be reduced in size.

MEMS mirror device and method of manufacturing the same

An optical scanning device comprises a scanning structure, an anchor, and a drive unit. The drive unit includes a first drive unit and a second drive unit. The first drive unit includes a first drive beam, an electrode interconnect, paired supports, and a thin film magnet. The first drive beam has a first fixed end connected to the support and a first drive end connected to the scanning structure. The electrode interconnect is formed on the first drive beam. The supports are connected to the anchor and disposed to sandwich the first drive beam. The thin film magnet is disposed on each of the supports. The thin film magnet is disposed in such a manner that a magnetic line of force is generated in a direction intersecting a direction in which the electrode interconnect extends.

Optical scanning device and method for manufacturing the same

An optical scanning device includes a mirror and a drive beam. The drive beam includes a piezoelectric portion. The piezoelectric portion is partitioned by a plurality of first grooves into a plurality of piezoelectric bodies. The piezoelectric bodies are reduced in length in an X-axis direction as the piezoelectric bodies approach one end side connected to an anchor. The piezoelectric bodies are reduced in length in the X-axis direction as the piezoelectric bodies approach the other end side connected to a link beam.

Optical scanning device and method of manufacturing the same

An optical scanning apparatus includes a light source, a substrate, a reflection member, a drive unit, and a controller. A scanning mirror and an attitude detector are integrated with substrate. An attitude detector outputs a first signal according to an attitude angle of substrate. A reflection member reflects a light beam reflected by scanning mirror. A drive unit can adjust an inclination of reflection member with respect to a main surface of substrate. A controller controls drive unit based on first signal. For this reason, an outgoing angle of light beam from optical scanning apparatus with respect to a horizontal surface can stably be maintained regardless of the inclination of optical scanning apparatus with respect to horizontal surface.

Optical scanning apparatus, method for controlling same, and vehicle

An optical scanning device includes a mirror part having a mirror surface configured to reflect light, N support cantilevers supporting the mirror part swingably, N drive cantilevers, and a plurality of driving piezoelectric elements secured on N drive cantilevers. The mirror part precesses by setting the frequency of AC voltage applied to each of a plurality of piezoelectric elements to a determined common value and setting the phase of AC voltage applied to each of a plurality of piezoelectric elements to a value determined according to the position of each piezoelectric element.

Optical scanning device and method of adjusting optical scanning device

In a mirror driving apparatus, a pair of beam portions includes: a pair of first beams directly adjacent to a reflector to sandwich the reflector between the first beams; and a pair of second beams each coupled to one side of a corresponding one of the first beams, the one side being opposite to the reflector with respect to the corresponding one of the first beams. A plurality of electrodes are spaced from each other on a main surface of each of the first beams, a piezoelectric material being interposed between the main surface and the plurality of electrodes. The first beams are displaceable crosswise to the main surface in respective directions opposite to each other. The pair of second beams is displaceable in a direction connecting the first beams and the second beams, along the main surface of the second beams.

Mirror driving apparatus and method for manufacturing thereof

In a headlight optical-axis control device, a controlleris configured to: calculate vehicle angles indicating tilt angles of a vehicle relative to a road surface, on the basis of ratios, each being a ratio of a difference between a reference acceleration in a longitudinal direction and a signal indicating an acceleration in the longitudinal direction detected during traveling of the vehicle, to a difference between a reference acceleration in a perpendicular direction and a signal indicating an acceleration in the perpendicular direction detected during traveling of the vehicle by an acceleration sensor; calculate a plot of the calculated vehicle angles thereby to derive a vehicle angle corresponding to a case where a change of the acceleration in the longitudinal direction is zero; and generate a signal for controlling the optical axes of headlightsL andR on the basis of the derived vehicle angle.

Headlight optical-axis control device

A symmetrical DC/DC converter selects an energy transferring direction and a step-up or a step-down operation as well as a desired step-up or a step-down ratio. The converter includes a single inductor with a pair of switching devices connected to its terminals in a symmetrical arrangement with respect to the inductor. The converter is operable as a step-up converter and a step-down converter in a manner such that one and the other of the switching devices are used as an input switch and an output switch, respectively, and that one and the other of the switching devices are conversely used as an output switch and an input switch, respectively.

Symmetrical DC/DC converter

An energy adjusting device is provided which transfers energy charged in an arbitrary cell to the input/output terminals of a unit energy storage device. The energy adjusting device includes a transformer having a plurality of primary coils and a secondary coil mutually coupled magnetically but electrically insulated, switching circuits which open and close the circuits of the primary coils of the transformer connected to the arbitrary cell, a circuit connecting the secondary coil of the transformer via a rectifying circuit to the input/output terminals of the unit energy storage device, and a control circuit which, by operating the switching circuits, adjusts the amount of energy stored in the cells to a specific ratio with respect to the amount of energy stored by the unit energy storage device.

Electric energy storage device with cell energy control, and method of controlling cell energy

Thermosetting resin composition, and resin-covered metal foil, prepreg and film-shaped adhesive all using the composition

Resin-coated metal foil

The present invention provides an adhesive film for semiconductor package, which comprises a polycarbodiimide resin, an epoxy resin and an inorganic filler, wherein the polycarbodiimide resin has a polystyrene-reduced number-average molecular weight of 3,000 to 50,000 as measured by gel permeation chromatography, the epoxy resin is contained in an amount of 20 to 150 parts by weight per 100 parts by weight of the polycarbodiimide resin, and the inorganic filler is contained in an amount of 30 to 70% by weight based on the total resin content.

Adhesive film for semiconductor package

The present invention provides a prepreg which is composed of a mixture of a polycarbodiimide resin and an epoxy resin and which has a film shape; a prepreg composed of (1) a mixture of a polycarbodiimide resin and an epoxy resin and (2) a base material; a multilayer printed wiring board obtained by alternately laminating an internal substrate and an insulating adhesive layer and adhering them to each other, wherein the above prepreg is used as the insulating adhesive; and a process for producing a multilayer printed wiring board, which comprises alternately laminating an internal substrate and the above prepreg, adhering them to each other, and allowing all the internal substrates to communicate with each other at the required portions. The above prepreg has high flexibility at room temperature, causes neither chipping nor peeling of resin, and is superior in heat resistance and electrical insulation after press molding.

Prepreg, multilayer printed wiring board and process for production of said multilayer printed wiring board

The present invention provides a film-shaped encapsulating agent for electronic parts which is composed essentially of a polycarbodiimide resin and an epoxy resin or of a polycarbodiimide resin, an epoxy resin and colorant, wherein the polycarbodiimide resin has a polystyrene-reduced number-average molecular weight of 3,000 to 50,000 as determined by gel permeation chromatography and the epoxy resin is contained in a proportion of 20 to 150 parts by weight per 100 parts by weight of the polycarbodiimide resin. The film-shaped encapsulating agent enables, for its good processability, the continuous encapsulation of electronic parts without requiring any expensive apparatus (therefore, no cost increase is incurred) and is excellent in heat resistance and electrical insulation after the encapsulation.

Film-shaped encapsulating agent for electronic parts

The present invention provides a one-pack type epoxy resin composition comprising an epoxy resin having at least two epoxy groups in the molecule and a polyguanidine. The one-pack type epoxy resin composition has high storage stability, can be made into a film, is curable at relatively low temperatures, and has high adhesivity.

Growing community of inventors

Tokyo, Japan

Takahiko Ito