Renesas Electronics Corporation

Renesas Technology Corp.

Takahiko Arakawa

Makoto Hatakenaka

Hideo Nagano

Masayuki Koyama

Motoki Higashida

Kikuo Muramatsu

Tomoko Ando

An information device packaged in one package includes a main function unit and an interface function unit. The main function unit includes a main processing circuit for executing signal processing related to a main function in the information device and a first microcomputer for controlling the main processing circuit by executing a first firmware program. The interface function unit includes an interface function unit including a first interface circuit for receiving data from an exterior device located outside of the information device to provide to the main function unit, a second interface circuit for performing an authentication operation with the exterior device, a second microcomputer for controlling the first interface circuit, and a memory for storing a second firmware program for controlling the first interface circuit.

Information device including main processing circuit, interface circuit, and microcomputer

An information device includes a main processing circuit for executing signal processing related to a main function in the information device, a main microcomputer for controlling the main processing circuit, a receiver circuit for interfacing with the outside of the information device, and an interface microcomputer for controlling the receiver circuit, the interface microcomputer being provided separately from the main microcomputer.

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Tokyo, Japan

Takahiko Arakawa