Sharp Kabushiki Kaisha Corporation

Takahide Ishiguro

Katsushige Masui

Mototaka Taneya

Shinzoh Murakami

Takeshi Horiguchi

Toshiya Nagahama

Kazuhiro Tsuchida

Osamu Hamaoka

Shigehiro Yamada

Satoru Fukumoto

Naotaka Ohtsuka

In a diffractive element, its grating pattern is so configured that a diffraction angle of a diffracted light beam of a light source that is subject to the first-order diffraction in a diffraction area is matched with an angle of a light beam passing through the diffractive area emitted from a light source and a light source position is matched with a light originating point of the light source that emits a light beam to be transmitted, and the center of light intensity distribution is matched with that of the light source passing through the diffractive element by inclining an optical axis of the light source. A position of the diffractive element is adjusted based on an electric current value generated when a reflected return path light beam of the light source is diffracted by the diffractive element and enters the light source.

Semiconductor laser device, optical pickup apparatus, and method of manufacturing semiconductor laser device

Not only a semiconductor laser element and a photodetector but also a capacitor connected to the photodetector is housed in a package to thereby reduce the distance from the capacitor to the photodetector so that power source noise is efficiently suppressed by the capacitor and a power source noise suppression effect is improved.

Semiconductor laser device and method for producing the same

A semiconductor laser package includes an island member formed of metal, including a base plane and a block member protruding in a direction substantially perpendicular to the base plane, a lead, a resin member molded integrally with the island member and the lead so as to fix the relative position relationship between the island member and the lead, a laser chip fixed at the block member, and a light receiving element functioning as a light receiving unit, directly fixed to the resin member.

Semiconductor laser package and fabrication method thereof

Growing community of inventors

Osaka, Japan

Takahide Ishiguro