Tokyo Electron Limited

Tokyo Electron Kyushu Limited

Takahide Fukuda

Hidetami Yaegashi

Akihiro Fujimoto

Takashi Takekuma

Hiroyuki Matsukawa

Naruaki Iida

Akira Yonemizu

Michiaki Matsushita

Masanori Tateyama

Yasunori Kawakami

Yuji Yoshimoto

Hideaki Gotou

Mitsuhiro Nanbu

Tomoko Ishimoto

Yoshio Kimura

Satoshi Morita

Yuuji Matsuyama

Kunie Tsunematsu

Shinichiro Izumi

A method of subjecting a plurality of wafers to coating and beating treatments where a first boat is placed on a stage arranged in an interface section. The first boat is capable of containing the wafers stacked at intervals in a vertical direction. The stage is capable of moving in a horizontal direction, and has a plurality of positions for respectively placing a plurality of boats. The wafers are conveyed from a supply section to a coating section, and are subjected to a coating treatment one by one. The wafers, which have undergone the coating treatment, are conveyed to the interface section. The wafers, which have undergone the coating treatment, are loaded into the first boat placed on the stage, in the interface section. The first boat containing the wafers, which have undergone the coating treatment, is located at a transfer position by moving the stage. The first boat, located at a transfer position by moving the stage. The first boat, located at the transfer position, is conveyed from the stage into a heating section, and the wafers, which have undergone the coating treatment, are subjected to a heating treatment simultaneously and all together.

Method of substrate processing to form a film on multiple target objects

There is provided a double-sided substrate cleaning apparatus including a carrier station for loading/unloading a carrier in which objects to be processed are stored, a convey mechanism for conveying an object taken out from the carrier station, at least one cleaning mechanism, arranged along a convey path on which the convey mechanism conveys the object, for cleaning the object, and an object reversing mechanism, arranged along the convey path, for reversing the object.

Double-sided substrate cleaning apparatus and cleaning method using the

An apparatus for supplying a treating material to a treating device has a tank containing a liquid treating material and a heat exchanger formed by a spiral pipe and provided in the tank. A nitrogen gas (N.sub.2 gas) is introduced into the tank and evaporates the liquid treating material. Water is supplied from a fluid inlet pipe connected to the lower portion of the exchanger to a fluid outlet pipe connected to the upper portion of the exchanger through the spiral pipe of the exchanger. In the heat exchange, heat exchange between the water and the liquid treating material is performed very efficiently. No use of electric power provides high safety. The temperature of the liquid treating material which is changed into a gas state by a bubbling process is controlled efficiently and the density of the vaporized treating material in the tank is made stable.

Apparatus for supplying a treatment material

An apparatus for subjecting a plurality of wafers to coating and heating treatments, including a coating section for subjecting the wafers to a coating treatment one by one, a heating section for subjecting wafers which have undergone the coating treatment to a heating treatment all together, and an interface section arranged between the coating section and the heating section. The wafers are heat-treated in the heat treatment section while the wafers are stacked at intervals in a vertical direction in a boat. The wafers which have undergone the coating treatment are loaded into the boat by a conveying member in the interface section. The conveying member and the boat are surrounded by a surrounding space formed by a casing at the interface section. A circulation line is combined with an air supply and exhaust system, for circulating air in the surrounding space. A dehumidifier is arranged on the circulation line for dehumidifying air in the circulation line to provide localized dehumidification of the surrounding space formed by the casing.

Semiconductor wafer processing apparatus including localized

Resist treating method

A substrate processing apparatus according to this invention includes an interface section having a first transfer member for transferring an object from a coating process section for applying a process solution to the object in accordance with a single sheet process to an object holding member, and a moving member for detachably supplying a plurality of object holding member and simultaneously moving the plurality of object holding member, and a heat-treatment section having a second transfer member for transferring the object placed on the object holding member to a heat-treatment section for heat-treating the plurality of objects, which have undergone the coating process, in accordance with a batch process.

Apparatus for processing substrates having a film formed on a surface of

Double-sided substrate cleaning apparatus

Growing community of inventors

Kumamoto, Japan

Takahide Fukuda