Showa Denko K.k.

Takaharu Hoshina

Takashi Udagawa

Ryouichi Takeuchi

Wataru Nabekura

Kazuhiro Mitani

Kenzo Hanawa

Tomoyuki Takei

A light emitting unit () is provided with a resin container () in which a recessed portion () is formed, an anode lead portion () and a cathode lead portion () which are provided so as to be exposed on the bottom surface of the recessed portion (), a semiconductor light emitting element () attached to the cathode lead portion () on the bottom surface () of the recessed portion (), and a sealing resin () provided so as to cover the recessed portion (). The resin container () is produced from a white resin containing titania as a coloring agent. The anode lead portion () and the cathode lead portion () are each configured by forming a silver-plated layer with the gloss level set in the range of 0.3-1.0 inclusive on a metal plate based on a copper alloy or the like. Thus, the efficiency of extraction of light outputted from the light emitting unit is improved.

Light emitting unit, light emitting module, and display device

A light emitting device includes a board, a semiconductor light emitting element formed on the board optionally via a submount, a cap sealing the semiconductor light emitting element and a reflector provided surrounding the cap. The cap has top and bottom surfaces that are parallel to the top surface of the semiconductor light emitting element, and the spacing between the top and bottom surfaces is 1-3 times the longest diagonal or the diameter of the semiconductor light emitting element. Also disclosed is a process for producing the device.

Light emitting device

An object of the present invention is to provide a light-emitting apparatus reduced in the optical self-absorption of the light-emitting device and assured of excellent light extraction efficiency. The inventive light-emitting apparatus comprises a substrate, a semiconductor light-emitting device provided on the substrate with or without intervention of a submount, and an encapsulating structure for encapsulating the semiconductor light-emitting device, wherein the encapsulating structure has a bottom parallel to the bottom of the semiconductor light-emitting device and the side surface of the encapsulating structure is tilted with respect to the bottom.

Semiconductor light-emitting apparatus

A semiconductor light-emitting device includes a semiconductor substrate that has a rear surface formed with a first electrode, a semiconductor layer that includes a light-emitting portion and is formed on the semiconductor substrate, a plurality of dispersed electrodes that are individually formed on a part of the surface of the semiconductor layer to make ohmic contact with the semiconductor layer, a transparent conductive film that covers the surface of the semiconductor layer and the dispersed electrodes to electrically conduct with the dispersed electrodes, and a pad electrode that is formed on a part of the surface of the transparent conductive film to electrically conduct with the transparent conductive film.

Semiconductor light-emitting device, electrode for the device, method for fabricating the electrode, LED lamp using the device, and light source using the LED lamp

Growing community of inventors

Ichihara, Japan

Takaharu Hoshina