Kyocera Corporation

Takafumi Turumaru

Kiyoshi Yokoyama

Masatoshi Ikeda

Hironori Inoue

Hiroyuki Arima

Zenpei Tachibana

Hideaki Shimozuru

There is provided a bonding heater used to package a semiconductor chip on a multilayer substrate, which has adaptability to various chip sizes, with an excellent maintenance characteristics, with undesirable displacement of the chip at the time of mounting a semiconductor chip being made as small as possible and also with a temperature rise time to a desired temperature being shortened. This bonding heater is constituted by a ceramic tool for pressing an object to be heated, a ceramic heater for heating the tool, a heat insulating member for transferring heat generated by the ceramic heater mainly to the tool side and a holder for integrating these members and connecting these members to another member, and the tool, ceramic heater, heat insulating member and holder are detachably bonded.

Contact heating device

A rotor for an open-end spinning machine. A spinning portion of a bottomed cylindrical body has a hollow portion where twisted yarn is formed by a continuous twisting operation while gathering short fiber groups in the maximum diameter portion of the spinning chamber. A rotary shaft is joined to the spinning portion. The spinning portion is made of a silicon nitride sintered body which includes no less than 60% silicon nitride grain having an aspect ratio not less than 3, and an average grain size of from 0.1 to 10 .mu.m. The rotor is hardly damaged at a high speed rotation of 100,000 r.p.m. or more, and the yarn strength and the yarn quality are not reduced even after an extended use of the rotor for a long time.

Rotor for open-end spinning machine

Growing community of inventors

Kokubu, Japan

Takafumi Turumaru