Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Takafumi Tsujisawa

Shuichi Hirata

Satoshi Shida

Yasuharu Ueno

Shoriki Narita

Makoto Morikawa

Shingo Yamada

Shinya Marumo

Hirokuni Miyazaki

A component mounting apparatus is configured to mount a component on a substrate. The substrate includes a lower side substrate member, an upper side substrate member provided on an upper surface of the lower side substrate member, a lower side mark provided on the lower side substrate member, and an upper side mark provided on an upper surface of the upper side substrate member. The apparatus includes an upward facing camera configured to image the lower side mark from below the lower side substrate member, a data storage configured to store relative positional relationship data indicating a predetermined relative positional relationship between the lower side mark and the upper side mark, and a component mounting unit configured to mount the component on the upper surface of the upper side substrate member based on the data and information obtained through imaging the lower side mark imaged by the upward facing camera.

Component mounting method

A component mounting apparatus has a stagewith a fixed height position for holding a substrate, and a mounting headthat releasably holds a component, is moved downward toward the stagefrom a first reference height position HBfixedly positioned above the stage, and mounts the held componenton the substrateor an already mounted component. A controllerhas a mounting reference height calculation unitfor calculating a mounting reference height Hcorresponding to a distance from the first reference height position HB, and a first target movement height calculation unitfor calculating a first target movement height ZTAGbased on at least the mounting reference height Hand a thickness PTof the componentheld by the mounting head. The controllermoves the mounting headholding the componentdownward from the first reference height position HBto the first target movement height ZTAGto mount the held componenton the substrateor the already mounted component

Component mounting apparatus and component mounting method

In slack removal processing for removing slack generated on a wafer sheet by heating blow, a wafer feeding plate is positioned at a height position between a first height position and a second height position. This makes it possible to decrease a gap between an upper end portion of an expanding ring and a lower face of the wafer sheet and allows efficient and uniform processing. Moreover, setting the height position so as to avoid the contact between the wafer sheet and the upper end portion of the expanding ring at least when the slack removal processing is completed reliably prevents shrinking operation of the wafer sheet from being disturbed by the contact between the wafer sheet and the upper end portion.

Wafer expanding device, component feeder, and expanding method for wafer sheet

Growing community of inventors

Osaka, Japan

Takafumi Tsujisawa