Panasonic Intellectual Property Management Co., Ltd.

Panasonic Corporation

Matsushita Electric Industrial Co., Ltd.

Invensas LLC

Takafumi Okuma

Hisao Nagai

Takeshi Koiwasaki

Daisuke Suetsugu

Tomohiro Okumura

Mitsuo Saitoh

Masaharu Terauchi

Junko Asayama

Hitoshi Yamanishi

Masashi Morita

Masaaki Tanabe

Takahide Hirasaki

Kenichi Sato

Takaaki Higashida

Kenichi Yamamoto

Tadashi Kimura

Hiroshi Hayata

Hirokazu Nakaue

Kazuto Fukuda

Munekazu Nishihara

Takayuki Kai

Yoshie Takahashi

Hideki Yamashita

Seiji Nakashima

Daishiro Saito

A displacement sensor includes a first emission particles layer provided to be contactable with a measurement object, and in which first emission particles that emit light at a first wavelength by excitation energy are distributed over at least a one-dimensional extent, a second emission particles layer in which second emission particles that emit light at a second wavelength different from the first wavelength by the excitation energy are distributed over the above one-dimensional extent, and a spacer layer that separates the first emission particles layer and the second emission particles layer in a direction intersecting the above one-dimensional extent, and which includes an excitation energy absorbent that absorbs the excitation energy.

Displacement sensor, and displacement measurement system using displacement sensor

A composite nitride-based film structure includes a bulk single crystal, a plurality of nitride microcrystals, and an amorphous nitride thin film. The plurality of nitride microcrystals is provided on the bulk single crystal, and has a specific orientation relationship with a crystal structure of the bulk single crystal. The nitride thin film is provided on the bulk single crystal, surrounds the nitride microcrystal, and covers a surface of the bulk single crystal.

Composite nitride-based film structure and method for manufacturing same

A sputtering method of forming a thin film by allowing a target material to react with a gas includes narrowing down film deposition conditions from an existing period of nitrogen radicals by focusing on a nitriding process in thin-film forming processes when the thin film is formed by pulsing a waveform of electric current from a DC power supply at the time of generating plasma and applying the electric current to the target material.

Sputtering method

A fine particle producing apparatus includes a reaction chamber extending vertically from the lower side to the upper side; a material supply device which is connected to a central part on one end side of the vertically lower side inside the reaction chamber and supplies a material particle into the reaction chamber of a vertically upper side from a material supply port; a first electrode arrangement region which protrudes in an inward radial direction to be disposed on an inner peripheral wall in the reaction chamber which is vertically above the material supply device, and includes a plurality of lower electrodes to which AC power is applied; a second electrode arrangement region which protrudes in an inward radial direction to be disposed on an inner peripheral wall in the reaction chamber which is vertically above the first electrode arrangement region, and includes a plurality of upper electrodes to which AC power is applied; a collector which is connected to the other end side in the reaction chamber of the vertically upper side so as to collect fine particles; a power source which is capable of changing a frequency of AC power applied to at least one of the lower electrode included in the first electrode arrangement region and the upper electrode included in the second electrode arrangement region; and a controller which sets the frequency of AC power applied to the lower electrode as a frequency equal to or higher than a frequency of AC power applied to the upper electrode, in which a fine particle is generated from the material particle by generating arc discharge by the lower electrode and the upper electrode, and generating plasma in the reaction chamber.

Fine particle producing apparatus and fine particle producing method

A production apparatus and method for fine particles are capable of increasing a production amount and producing fine particles at low cost by efficiently inputting a large amount of material to plasma. The production apparatus includes a material supply device, which includes a plurality of material supply ports that supply a material gas containing material particles and are arranged below a plurality of electrodes in a vertical direction inside a vacuum chamber. The material supply device further includes a first gas supply port that supplies a first shield gas arranged in an inner periphery of the plural material supply ports and plural second gas supply ports that supply a second shield gas arranged in an outer periphery of the plural material supply ports.

Production apparatus and production method for fine particles

An apparatus and a method for producing fine particles includes a vacuum chamber, a material feeding device connected to the vacuum chamber and feeding material particles into the vacuum chamber from material feeing ports, and a plurality of electrodes connected to the vacuum chamber. Tip ends of the electrodes protrude into the vacuum chamber to generate plasma, and a collecting device is connected to the vacuum chamber and collects fine particles. The electrodes generate discharge inside the vacuum chamber and produce the fine particles from the material. The material feeding ports of the material feeding device are arranged in a lower side than (below) the plural electrodes in the vertical direction in the vacuum chamber.

Apparatus for producing fine particles and method for producing fine particles

A production apparatus for fine particles includes a vacuum chamber, a material feeding device connected to the vacuum chamber and feeding material particles from a material feeding port into the vacuum chamber, electrodes arranged in the vacuum chamber for generating plasma and a fine particle collection device connected to the vacuum chamber and collecting fine particles. The fine particles are produced from the material by generating electric discharge inside the vacuum chamber. The apparatus includes an inner chamber which forms an outside space with respect to the vacuum chamber installed between a wall of the vacuum chamber and a plasma generation region and gas supply pipes which supply a gas to the outside space between the wall of the vacuum chamber and a wall of the inner chamber.

To provide an apparatus and a method of producing fine particles capable of increasing evaporation efficiency of a material, increasing the production of fine particles and reducing costs by heating the inputted material by a gas heated by thermal plasma. A fine particle production apparatus includes a vacuum chamber, a material feeding device connected to the vacuum chamber and feeding material particles from a material feeding port into the vacuum chamber, electrodes arranged in the vacuum chamber for generating plasma and a collection device connected to the vacuum chamber and collecting fine particles, which produces the fine particles from the material by generating electric discharge inside the vacuum chamber, in which the collection device and the material feeding device are connected by piping, and a material heating and circulation device which heats the material by heat of a gas inside the chamber heated by the plasma through the piping is provided.

Fine particle production apparatus and fine particle production method

An apparatus and a method for producing fine particles capable of increasing the production and producing fine particles at low costs by feeding a large quantity of material efficiently into the plasma. The apparatus includes a vacuum chamber, a material feeding device connected to the vacuum chamber and feeding material particles into the vacuum chamber from material feeing ports, a plurality of electrodes connected to the vacuum chamber, tip ends of which protrude into the vacuum chamber to generate plasma and a collecting device connected to the vacuum chamber and collecting fine particles, which generates discharge inside the vacuum chamber and produces the fine particles from the material, in which the material feeding ports of the material feeding device are arranged in a lower side than the plural electrodes in the vertical direction in the vacuum chamber.

A production apparatus for fine particles includes a vacuum chamber, a material supply device, a plurality of electrodes arranged and a collection device connecting to the other end of the vacuum chamber and collecting fine particles, which generates plasma and produces fine particles from the material particles, in which a first electrode arrangement region on the material supply port's side and a second electrode arrangement region apart from the first electrode arrangement region to the collection device's side which respectively cross a direction in which the material flows between the vicinity of the material supply port and the collection device are provided in the intermediate part of the vacuum chamber, and both the first electrode arrangement region and the second electrode arrangement region are provided with a plurality of electrodes respectively to form the electrodes in multi-stages.

A semiconductor device includes a second oxide film and a pad electrode on a first oxide film that is formed on a front surface of a semiconductor substrate, a contact electrode and a first barrier layer formed in the second oxide film and connected to the pad electrode, a silicide portion formed between the contact electrode and a through-hole electrode layer and connected to the contact electrode and the first barrier layer, a via hole extending from a back surface of the semiconductor substrate to reach the silicide portion and the second oxide film, a third oxide film formed on a sidewall of the via hole and on the back surface of the semiconductor substrate, and a second barrier layer (H) and a rewiring layer formed inside the via hole and on the back surface of the semiconductor substrate and connected to the silicide portion.

Semiconductor device and method for manufacturing semiconductor device

A deposition apparatus includes a processing chamber internally having a reduced-pressure space for deposition process to be carried out therein, a base material holding member for holding a base material to be subjected to the deposition process, a target support member for supporting a target thereon, and a power supply unit for applying electric power to the target support member to generate a plasma in the reduced-pressure space. In the deposition apparatus, deposition process is carried out by using the target, which has a recess portion in its surface and in which a powder target formed of a powder material is placed in an inner surface of the recess portion. Thus, the in-plane uniformity of deposition rate is improved and a stable film deposition is fulfilled.

Deposition method by physical vapor deposition and target for deposition processing by physical vapor deposition

A fluorine-containing precoating is formed to cover a phosphor particle by, for example, a physical vapor deposition of a fluoride. Then, a fluorine-containing coating covering the phosphor particle is formed by supplying fluorine into the precoating. This obtained phosphor particle with the coating is applied in the form of a paste to a substrate on each electrode between two adjacent ribs to form a phosphor layer including phosphor particles between the ribs on the substrate. The substrate is positioned with respect to another substrate having electrodes thereon to form discharge spaces between the substrates. The discharge spaces are filled with a discharge gas to produce a plasma display panel.

Plasma display panel and process for producing the plasma display panel

A circuit substrate has a flexible thin film, electric wires supported on the film, and an electronic component supported on the film and positioned between the wires so that the wires and the component are electrically connected serially. Also, a thickness of the component is less than that of the electric wires.

Growing community of inventors

Osaka, Japan

Takafumi Okuma