Panasonic Intellectual Property Management Co., Ltd.

Takafumi Okudo

Yoichi Nishijima

Yukihiro Shimasaki

Hiroki Takeoka

Yuji Suzuki

Takanori Aketa

Masao Kirihara

Yoshiharu Sanagawa

Yosuke Hagihara

Katsumi Kakimoto

Takahiro Miyatake

Ryo Tomoida

Koji Sakai

Koichi Nishimura

Toru Baba

Akira Matsuura

Hisakazu Miyajima

Yoshiyuki Takegawa

Ryo Osabe

Hiroki Yoshino

Shinichi Kishimoto

Masahiko Ohbayashi

Naoki Ushiyama

Masaaki Saito

Sumio Akai

Yasufumi Shibata

Kazushi Kataoka

Ritsuo Masaoka

Hiromasa Ozaki

Kouji Gotou

Takashi Saijo

A capacitor includes: a capacitor element; a pair of external electrodes provided at opposite ends of the capacitor element; and a pair of metal caps and or a metal foil, the pair of metal caps each covering a corresponding one of the pair of external electrodes, the metal foil covering at least part of the capacitor element.

Capacitor

A component sensor detects a fluid component with improved accuracy. The component sensor includes tube () including tube side () that permits inflow of fluid (), substrate () provided to tube (), first protrusion () provided at one end of substrate (), second protrusion () provided at another end of substrate (), light emitter () that emits infrared light () toward first protrusion (), and light receiver () that receives infrared light (). Infrared light () entering substrate () through first protrusion () experiences total reflection inside substrate () and exits through second protrusion () to head for light receiver (). Tube side () includes two through holes () that each extend between an interior and an exterior of tube (). Substrate () is inserted into through holes () with a central part of substrate () being inside tube () and with the one end and the other end of substrate () that are respectively provided with first protrusion () and second protrusion () being outside tube ().

Component sensor

The disclosure has a configuration including: a supporting substrate having a cavity; at least one bridge section extending directly above the cavity and having at least one end supported by the supporting substrate and an other end; and a thermopile wiring formed in the bridge section and including hot junctions in the bridge section and cold junctions directly above the supporting substrate, the hot junctions being connected to the cold junctions. The bridge section is provided with: at least one breakage detection wiring for detecting breakage of the bridge section; and at least one heater wiring. The breakage detection wiring is wired along the thermopile wiring. The heater wiring is wired such that part of the heater wiring is in an area between the other end of the bridge section and the hot junctions.

Infrared sensor chip, and infrared sensor employing same

An infrared sensor, which achieves a low manufacturing cost, or has high sensitivity, or in which an increase in heat capacity is reduced, is provided. The infrared sensor includes a first infrared absorbing portion, an infrared sensing portion for sensing infrared rays based on infrared rays absorbed by the first infrared absorbing portion, and a plurality of protrusions including metal and disposed apart from each other on a surface of the first infrared absorbing portion. Since an absorption rate of infrared rays is improved, sensitivity can be improved, or an increase in heat capacity can be reduced.

Infrared sensor having improved sensitivity and reduced heat generation

An infrared sensor includes an infrared detecting device, a lens, a member, a gap and a spacer. The lens is disposed above the infrared detecting device. The member forms an external surface and includes a first opening having a maximum internal diameter. The gap is disposed between the member and the lens. The spacer is disposed between the member and the lens so as to form the gap, and that is directly contact with lens. The spacer has a circular inner periphery, in planar view, which has a larger internal diameter than the maximum internal diameter of the first opening of the member.

Infrared sensor

An infrared sensor includes: an infrared detecting device; a lens disposed above the infrared detecting device; an member that is disposed at a side of an upper surface of the lens and includes an opening; and a gap that intervenes between the member and the lens and has a wider range than the opening.

Growing community of inventors

Osaka, Japan

Takafumi Okudo