Kabushiki Kaisha Toshiba

Renesas Electronics Corporation

Renesas Technology Corp.

Takafumi Kikuchi

Takahiro Naito

Toshihiko Sato

Yoshiyuki Kado

Hikaru Ikegami

Kenichiro Aoki

Yasutaka Sasaki

Noriaki Sakamoto

Hiroshi Kuroda

Naotaka Tanaka

Fujio Ito

Takashi Kikuchi

Takashi Akazawa

Norihiko Sugita

Takuma Kido

Masaya Kudo

Hirofumi Nesori

Tomoru Sato

Takehisa Yokohama

Makoto Suzuki

Kenji Kanemitsu

Seiichi Shirakawa

According to one embodiment, a suspension assembly includes a support plate, a trace member on the support plate and a drive element mounted on the trace member. The trace member includes a metal plate, and a multilayered member on the metal plate. The multilayered member includes a first insulating layer, a conductive layer stacked on the first insulating layer, a second insulating layer stacked on the conductive layer. The multilayered member includes a mount portion on which the drive element is mounted, and a branching portion arranged along the mount portion with a gap therebetween. At least one portion of the branching portion is formed into a thin portion having a thickness less than other portions of the multilayered member.

Suspension assembly, head suspension assembly and disk device with the same

A magnetic head suspension assembly includes a support plate coupled to a magnetic head, and a flexible wiring member disposed on the support plate. The flexible wiring member includes a metal plate fixed to the support plate, an insulating layer disposed on the metal plate, a conductive layer disposed on the insulating layer and forming a plurality of conductive lines and connection terminals, and a cover layer on the conductive layer. The connection end portion includes a plurality of the connection terminals, and each of the connection terminals includes a center hole, a first terminal surface that is a surface of the conductive layer and is covered with the cover layer so that the first terminal surface is not exposed during a solder-joining process performed on the connection terminals, and a second terminal surface that is a surface of the conductive layer and faces away from the first terminal surface.

Magnetic head suspension assembly having flexible wiring member with connection terminal including center hole and cover layer and disk device provided with the same

Of three chips (A), (B), and (C) mounted on a main surface of a package substrate () in a multi-chip module (MCM), a chip (A) with a DRAM formed thereon and a chip (B) with a flash memory formed thereon are electrically connected to wiring lines () of the package substrate () through Au bumps (), and a gap formed between main surfaces (lower surfaces) of the chips (A), (B) and a main surface of the package substrate () is filled with an under-fill resin (). A chip (C) with a high-speed microprocessor formed thereon is mounted over the two chips (A) and (B) and is electrically connected to bonding pads () of the package substrate () through Au wires ().

Semiconductor device and manufacturing method thereof

A semiconductor device in which a plurality of semiconductor chips having different planar sizes are stacked with a degree of freedom in design of each of the semiconductor chips is provided. A logic chip, a redistribution chip, and a memory chip having a larger planar size than the logic chip are mounted over a wiring board. The logic chip and the memory chip are electrically connected via the redistribution chip. The redistribution chip includes a plurality of front surface electrodes formed to a front surface facing the wiring board, and a plurality of back surface electrodes formed to a back surface opposite to the surface. The redistribution chip has a plurality of through silicon vias, and a plurality of lead wirings formed to the front surface or the back surface and electrically connecting the plurality of through silicon vias and the front surface electrodes or the back surface electrodes.

Semiconductor device with chip having a different number of front surface electrodes and back surface electrodes

According to one embodiment, a suspension assembly includes a support plate including a distal end portion, a trace member attached to the support plate, an elastic supporting member made from a distal end portion of the trace member and configured to support a head, and an actuation element expandable/contractible in the longitudinal direction of the trace member, at least a part of a bottom of which is adhered to a seating surface formed from a cover insulating layer of the trace member.

A head gimbal assembly includes a base plate, a load beam, a first end of which is supported by the base plate, a magnetic head supported at a second end of the load beam, a flexure including a plurality of wirings electrically connected to the magnetic head, the flexure extending from a surface of the base plate to an edge of the base plate, an adhesive applied in a space formed between the surface of the base plate and a surface of the flexure facing the surface of the base plate to bond the flexure to the base plate and to the edge of the base plate.

Head gimbal assembly in which flexure swing is suppressed and disk device including the same

According to one embodiment, a head gimbal assembly includes a suspension, a head, and a conductor trace on the suspension, including one end portion electrically connected to the head and the other end portion includes a terminal area. The conductor trace includes a thin metal plate, a base insulating layer on the thin metal plate, a trace pattern on the base insulating layer, including a plurality of conductors and a plurality of first and second connection terminals continuous with the conductors, and a cover insulating layer on the base insulating layer, configured to cover the trace pattern. The terminal area includes an opening including two opposite side edges, the first connection terminals extend into the opening from one of the side edges thereof, and the second connection terminals extend into the opening from the other side edge thereof.

Head gimbal assembly having plurality of terminals and disk drive with the same

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Yokohoma Kanagawa, Japan

Takafumi Kikuchi