Texas Instruments Corporation

Takafumi Ando

Yuki Sato

Jeffrey Anthony Morroni

Kenji Otake

Zhemin Zhang

Yi Yan

Kristen Nguyen Parrish

Charles Allen DeVries

In examples, a method of manufacturing a transformer device comprises providing a first magnetic member and providing a laminate member containing primary and secondary transformer windings wound around an orifice extending through the laminate member. The method further comprises positioning a build up film abutting the laminate member. The method also comprises positioning at least a portion of a second magnetic member in the orifice. The method further comprises heat pressing at least one of the first and second magnetic members such that a distance between the first and second magnetic members decreases and such that the build-up film melts, thereby producing a transformer device.

Method of manufacturing transformers with laminate windings and build-up films

Transformers with build-up films

An integrated circuit and method of making an integrated circuit is provided. The integrated circuit includes a substrate having an electronic component. A substrate-based coil is on the substrate and the substrate-based coil is electrically coupled to the electronic component. A magnetic mold compound encapsulates the substrate-based coil and the electronic component.

Integrated circuit

Growing community of inventors

Oita, Japan

Takafumi Ando