Fuji Jukogyo Kabushiki Kaisha

Subaru Corporation

Fuji Jukogyo Kabushiki Kaisha Subaru Corporation

Fuji Jukogyo Kabushiki Kaisha Toshiba Corporation

Toshiba Energy Systems & Solutions Corporation

Takafumi Adachi

Toshimichi Ogisu

Hideki Soejima

Mayu Nakano

Itaru Chida

Yuji Sano

Atsuhiko Sakabe

Hiroyuki Takehisa

Yasuhiro Tsukamoto

According to one implementation, a laser peening processing apparatus includes a laser oscillator and an irradiation system. The laser oscillator oscillates a laser light. The irradiation system condenses the laser light with a lens and irradiates a workpiece with the condensed laser light. The irradiation system irradiates the workpiece with the laser light in a state where the workpiece has been exposed in an atmosphere without interposed liquid. Furthermore, according to one implementation, a laser peening processing method includes producing a product or a semi-product by laser peening processing of the workpiece using the above-mentioned laser peening processing apparatus.

Laser peening processing apparatus

According to one implementation, a laser peening processing device includes a laser peening processing device includes a laser oscillator, a nozzle and an inclining structure. The laser oscillator emits laser light. The nozzle condenses and irradiates the laser light toward a surface to be processed of a workpiece, with injecting liquid toward the surface to be processed. The inclining structure inclines at least one of the nozzle and the workpiece to make an injection direction of the liquid be different from a normal direction of the surface to be processed. The air bubbles arising by at least one of collision between the liquid and the surface to be processed and shock by irradiation of the laser light on the surface to be processed are flowed in a direction depending on an inclined direction of the surface to the injection direction of the liquid.

Laser peening processing device and laser peening processing method

Disclosed is a laser peening apparatus, including: a liquid holding head to shape and hold liquid to trap plasma on a local surface of a workpiece; and a laser irradiation head to irradiate the surface with laser through the liquid held in the liquid holding head.

Laser peening apparatus

Disclosed is a coating method using a plasma shock wave, the method including the steps of: irradiating a pulse laser to a first surface of a mixed layer obtained by mixing powders and resin to generate a plasma, the mixed layer being formed on a second surface of a substance to be coated; striking the powders on the second surface by using a shock wave of the plasma; and forming a coat of the powders on the second surface.

Coating method using plasma shock wave and method for manufacturing coated substance

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Tokyo, Japan

Takafumi Adachi