Panasonic Corporation

Matsushita Electric Industrial Co., Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Takaari Uemoto

Satoshi Shida

Keiji Nishimoto

Hideo Nagai

Yasuharu Ueno

Yuji Omata

Masahiro Miki

Nobuyoshi Takeuchi

Tsugihiro Matsuda

Hiroyuki Naito

Yasushige Tomiyoshi

Kenzi Takahasi

Mamoru Takeda

Tatsumi Setomoto

Yoshio Manabe

Atsushi Motoya

Yasuyuki Ueda

Yasuhisa Ueda

Kenji Takahashi

Makoto Horiuchi

Kazushige Sugita

Toshio Mori

Kazuyuki Okano

Akira Taniuchi

Toshiaki Isogai

Mitsuko Shuto

Makoto Inoue

Yoshinori Kakuno

Naotaka Hashimoto

Takeshi Saito

Shinya Kawagoe

Hiroshi Nohara

Taku Ikeda

Makoto Morikawa

Toshiyasu Kojima

Naoki Tagami

Ikuko Aoki

Kazuhiro Kawabata

Yurika Goto

Minako Akai

A light-emitting module includes a substrate, an LED chip arranged on a main surface of the substrate, a sealing member covering the LED chip on the main surface of the substrate and converting a wavelength of the light produced by the LED chip, and a heat transfer member thermally connecting the sides of the LED chip to the main surface of the substrate and dissipating heat produced by the LED chip to the substrate. The heat transfer member is made up of a silicone resin having particles dispersed therein, the particles being nanoparticles of ZrOand microparticles of MgO, which have higher thermal conductivity than the silicone resin.

Light-emitting module and lamp using same

A light bulb shaped lamp according to the present invention includes: a hollow globe; an LED module including a base platform and an LED chip mounted on the base platform, the LED module being provided in the globe; a lead wire for supplying power to the LED module; and a stem extending toward the interior of the globe, in which the base platform is directly fixed to the stem.

Light bulb shaped lamp and lighting apparatus

An LED lamp has an envelope that includes a globe and a case, an interior space of the envelope being divided in two by a mount closing an opening of the globe, the lamp containing, in a globe side of the interior space, an LED and, in a case side of the interior space, a circuit unit for causing the LED to emit light. The LED is thermally connected to the mount, and the mount and the case are joined to the globe such that, during light emission, at least as much heat from the LED is propagated from the mount to the globe as from the mount to the case.

LED lamp and lighting device

A lamp includes an LED module, a drive unit supplying power to the LED module, and a base via which power is fed from an external power supply to the drive unit. The drive unit is located between the LED module and the base. The drive unit includes a circuit board having a main surface on which lead-type electronic components are mounted, lead wires (first lead wires) extending from the main surface of the circuit board and connected to the LED module, and lead wires (second lead wires) extending from the main surface of the circuit board and connected to the base. The circuit board has a through-hole extending from the main surface to an opposite surface thereof. The lead wires pass through the through-hole.

Light

A bulb-type lamp having both heat dissipation and size/weight reduction properties with a lower thermal load on a lighting circuit. An LED module is mounted in a case with a base member to allow dissipation of heat. An LED mount member closes another end of the case and allows conduction of heat to the case. A lighting circuit receives power via the base member. The lighting circuit is disposed inside a circuit holder. An air space exists between the circuit holder and both the case and the mount member. The lighting circuit is isolated from the air space by the circuit holder. A relationship 0.5&#x2266;S/S&#x2266;3.0, is satisfied where Sdenotes an area of a portion of the mount member in contact with the case and Sdenotes an area of the portion of the mount member in contact with a substrate of the LED module.

Bulb-shaped lamp and lighting device

In a lamp: an LED module and a circuit unit for lighting are housed within an envelope composed of a globe and a case; the LED module is attached to an end of an extension member that extends from a mount, which closes an opening at one end of the case, into the globe; the circuit unit is mounted inside the case; an insulation member disposed inside the case ensures insulation between the mount, which is made of metal, and the circuit unit; the insulation member has a bottomed cylinder portion inserted into the mount, and a protrusion portion formed on an outer circumference of the based cylinder portion that protrudes toward an inner surface of the mount; and the insulation member is attached to the mount by the protrusion portion pressing against the inner surface of the mount.

Lamp having improved insulation of the circuit unit

A light bulb shaped lamp includes: a hollow globe having an opening; an LED module having a base platform and an LED chip mounted on the base platform, the LED module being housed in the globe; a stem extending from the opening of the globe to the vicinity of the LED module; and a regulating component which regulates movement of the LED module with respect to the stem.

Provided is a lighting device which can be dimmed and subjected to change in color temperature of the lighting color in accordance with a dimming level. To the lighting device, AC power under phase-controlled is supplied. The lighting device is provided with a light emitting elements array and a switching unit. The light emitting elements array includes a plurality of light emitting elements, which are two or more types of light emitting elements having different lighting colors. The switching unit switches an electrical connections between the light emitting elements included in the light emitting elements array so as to change the number of light emitting elements inserted in series to a power supply path and the proportion of numbers of light emitting elements per lighting color among the number of the inserted light emitting elements in accordance with a voltage supplied to the light emitting elements array.

Lighting device and lighting system

A light-emitting device which emits light omnidirectionally is provided. A light-emitting device according to the present invention includes: a package which is translucent; an LED provided in a recess in the package; and a sealing member for sealing the LED and packaging the recess; and the recess includes a bottom surface on which the LED is mounted and a side surface surrounding a bottom surface, and light emitted by the LED is transmitted inside the package through the bottom surface and the side surface of the recess and is emitted to outside of the package from the back surface and the side surface of the package.

Light-emitting device, light-emitting module, and lamp

An object of the present invention is to provide a mounting substrate, a manufacturing method, a light-emitting module and an illumination device that can sufficiently improve the luminous efficiency of an LED lamp. A mounting substrate according to the present invention includes a substrate and a reflective film that is formed on a front surface of the substrate and has a front surface on which LED chips are to be mounted, and the reflective film is made of metal oxide microparticles and a glass frit, and reflects light from the LED chips.

Mounting substrate and manufacturing method thereof, light-emitting module and illumination device

A mount member () has a contact surface () touching the bottom surface of an LED module () and protrusions () protruding from the periphery of the contact surface () in the thickness direction of the LED module () and regulating sliding motions thereof. A fixing member () made of a resilient, plate-like member comprises an opposing pair of flat portions () near the contact surface () of the mount member () and flat tabs () projecting from the flat portions () toward the contact surface () touching the upper surface of a substrate (). The flat portions () of the fixing member () are fastened to be lower than the top surface of the substrate () of the LED module (). Thus, elastically deformed areas extending from the fastened parts of the flat portions () through the flat tabs () press the substrate () into the mount member ().

Illumination device including a light-emitting module fastened to mount member with a constant orientation

Provided is a bulb-type lamp including a lightweight housing with great handleability. An LED light bulb comprises: an LED module on which LEDs are mounted; a cylindrically-shaped case having openings at both ends, which are first and second ends; a mount member on a front surface of which the LED module is mounted, the mount member closing a corresponding one of the openings of the case by being in contact with an inner circumferential surface of the first end of the case; a base member attached to the second end of the case; and a lighting circuit that is disposed inside the case. A wall thickness of the case is in a range of 200 &#x3bc;m to 500 &#x3bc;m inclusive, and the wall thickness of at least one portion of the case decreases from the first end toward the second end of the case.

Bulb-type lamp and lighting device

A lamp includes a semiconductor light-emitting element, a light guiding element, a wavelength converter, a reflecting mirror, and a circuit unit axially disposed within a central section of the outer tube of an envelope. Light emitted by the semiconductor light-emitting element is guided by the light guiding element to be incident on and be converted by the wavelength converter. At least one component of the circuit unit is disposed at a side of the wavelength converter opposite the semiconductor light-emitting element. The reflecting mirror is disposed between the at least one component of the circuit unit and the wavelength converter, and reflects at least part of light received from the wavelength converter back toward the wavelength converter.

Semiconductor lamp with wavelength converter and circuit component axially opposed from light source

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Osaka, Japan

Takaari Uemoto