Canon Anelva Corporation

International Business Machines Corporation

Takaaki Tsunoda

Juntao Li

Vamsi Krishna Paruchuri

Paul Charles Jamison

Naoki Yamada

Naomu Kitano

Tuan Anh Vo

Nobuo Yamaguchi

Motomu Kosuda

Sanjay Shinde

Embodiments include methods of forming dielectric layers. According to an exemplary embodiment, a dielectric layer may be formed by determining a desired thickness of the dielectric layer, forming a first dielectric sub-layer having a thickness less than the desired thickness by depositing a first metal layer above a substrate and oxidizing the first metal layer, and forming n (where n is greater than 1) additional dielectric sub-layers having a thickness less than the desired thickness above the first dielectric sub-layer by the same method of the first dielectric sub-layer so that a combined thickness of all dielectric sub-layers is approximately equal to the desired thickness.

Cyclical physical vapor deposition of dielectric layers

A sputtering film forming method. which positions a targetandat an incline to a surface of a substratewhereupon a film is to be formed, and forms the film upon the surface of the substratewhereupon the film is to be formed in an incline direction while the substrateis rotated about a normal axis, terminates the forming of the film at a predetermined timing from the commencement of the forming of the film, wherein the forming of the film is terminated, when the substrate has rotated by 360 degrees&#xd7;n+180 degrees+&#x3b1;, where n is a natural number, including 0, and &#x2212;10 degrees&#x3c;&#x3b1;&#x3c;10 degrees.

Sputtering film forming method, electronic device manufacturing method, and sputtering system

Growing community of inventors

Albany, NY, United States of America

Takaaki Tsunoda