Omron Corporation

Takaaki Sanda

Yuki Ushiro

Daisuke Inoue

Yusuke Nakayama

Kazuyoshi Nishikawa

Hiroto Katsura

Makoto Sugimoto

Yusuke Hayashi

Naomi Uehara

Ryota Hasegawa

Masaki Nakamura

Eiji Teramoto

Takamasa Kameda

Takashi Yuri

Toyohiro Imaizumi

Kenta Yamakawa

Makoto Kasuya

Tomonari Imabayashi

Shinjiro Kotani

Takuya Honjo

Koichi Hirao

Mikio Hiratsuka

Provided is a method of manufacturing a sensor. The sensor has a casing having an opening portion, a clamp having a recessed part on its outer periphery and having one end inserted into the opening portion, and a sealing ring attached to the recessed part and disposed between the casing and the clamp. The method includes using a first divided mold to form a first component of the clamp, the first component including a main body portion and a first part located at one end side of the main body portion and forming a part of the recessed part. The first divided mold is divided so that a dividing surface intersects the main body portion and separates in an axial direction of the main body portion.

Method of manufacturing sensor

A sensor is provided with a cylindrical-shaped housing which has an opening formed at one end, an electronic component which is housed in the housing, a cylindrical-shaped clamp of which one end is inserted into the housing from the opening, and a sealing resin which seals the gap between the inner wall of the housing and the outer wall of the clamp. On the outer wall, the clamp has a rib which rises towards the inner wall of the housing. The rib includes an apex and a sloped surface which extends from the apex towards another end of the clamp and which intersects the outer wall of the clamp. The sealing resin, which exudes from between the inner wall of the housing and the apex and which is positioned on the sloped surface, has a recess resulting from surface tension.

Sensor and manufacturing method thereof

This proximity sensor includes: a cylindrical housing having an opening at one end in the axial direction; a detection part housed at the other end of the housing and detecting the presence or absence of a detection target contactlessly; a substrate housed in the housing and mounted with a control circuit for controlling the detection part; a detection part shield preventing external noise from entering the detection part and including a first face part adhered to the front surface on the other side of the detection part, and a side face part configured from multiple side pieces connected to the outer periphery of the first face part and bent from the first face part to cover the side surface of the detection part; and a resin provided around the detection part and the detection part shield.

Proximity sensor, and assembly method of proximity sensor

A proximity sensor in which generation of voids in a resin sealing portion sealing an inside of a housing can be suppressed and thus a yield is improved. The proximity sensor includes a housing, a detection coil, a circuit board and a resin sealing portion. The circuit board is accommodated in the housing to partition an internal space of the housing, and the resin sealing portion covers at least a part of the circuit board by filling the internal space of the housing and thus seals a covered portion of the circuit board. A resin injection port configured to inject a liquid resin forming the resin sealing portion by curing the liquid resin is provided in the housing, and a cutout portion having a notch shape or an opening shape is provided in the circuit board to include at least a part of a portion facing the resin injection port.

Proximity sensor

To ensure omnidirectional visibility of a proximity sensor with high luminance using a single light emitting element. A proximity sensor () includes a substrate () on which a control unit () is formed and in which a normal direction of the substrate is perpendicular to an axial direction of a coil section (), a light emitting element () which emits light in the axial direction on the substrate, a light diffusion section () which diffuses emitted light in a direction other than the axial direction, and a light guide section () which guides diffused light to a display section () on a side surface.

The proximity sensor () includes a core () configured to hold a coil (), a board () on which a proximity detection circuit is mounted, and an intermediate component which is a fixing member () formed of a resin to fix the board to the core and has a conductive pattern configured to electrically connect the coil and a wiring provided on the board.

To provide an electronic apparatus which enables manufacturing costs to be reduced and a range of selection of materials for resin components to be widened. An electronic apparatus includes a case, a cable drawn out from the case, a bonding intermediating member that is made of a resin and joined to the cable, a cylindrical clamp holding the cable, and a sealing resin part filling an internal space defined by the case and the clamp. The cable has a core wire and a sheath that is made of a resin covering the core wire and the core wire is exposed not to be covered by the sheath at an end of the cable. The bonding intermediating member has a cylindrical base covering an outer circumferential face of the sheath and an extension part extending from the base and bonding to the sealing resin part. The bonding intermediating part is fixed to the cable by welding the base onto the sheath.

Electronic apparatus and method of manufacturing same

To provide an electronic apparatus having particularly excellent environmental resistance. An electronic apparatus includes a case, a cable drawn out from the case, a bonding intermediating member that is made of a resin and joined to the cable, a cylindrical clamp holding the cable, and a sealing resin part filling an internal space defined by the case and the clamp. The cable has a core wire and a sheath that is made of a resin covering the core wire and the core wire is exposed not to be covered by the sheath at an end of the cable. The bonding intermediating member has a cylindrical base covering an outer circumferential face of the sheath and a cylindrical protrusion protruding toward a tip side of the cable. All of an inner circumferential face and an outer circumferential face of the protrusion and an end face at a tip side of the protrusion in an axial direction are covered by the sealing resin part.

Electronic apparatus and electric cable sealed therein

An electronic apparatus includes a case, a cable drawn out from the case, a bonding intermediating member, a cylindrical clamp holding the cable, and a sealing part filling an internal space defined by the case and the clamp. The cable has a core wire and a sheath covering the core wire, and the core wire is exposed at an end of the cable without being covered by the sheath. The bonding intermediating member is bonded to the sheath and the sealing part. The sealing part is formed of an epoxy resin, the bonding intermediating part is formed of a resin having a bending elastic modulus in the range of 80 MPa to 210 MPa, and the cable is formed of a material having a suspending flattening ratio in the range of 0.30 to 0.71.

Growing community of inventors

Fukuchiyama, Japan

Takaaki Sanda