Mitsubishi Denki Kabushiki Kaisha

Takaaki Okidono

Shigeo Onoda

Seiji Takemura

Takashi Arita

Kiyotaka Nishino

Masataka Kawai

Tomomi Hamada

A semiconductor element such as an encapsulated or non-encapsulated semiconductor chip having a multitude of terminals is mounted on one surface of a quadrate substrate. A multitude of connector pins extend from the other surface of the substrate. A plurality of connector lands are formed on a surface of the substrate and electrically connected to the corresponding terminals of the semiconductor element. The connector lands are electrically connected to the connector pins through wiring. The connector pins have a pitch that is larger near the connector lands than at locations farther away from the lands. The pitch between adjacent connector pins is made larger as necessary or desired so as to allow the passage of an increased number of connecting wires between the adjacent connector pins, thus ensuring high density wiring with improved efficiency.

Packaged semiconductor device

An IC card includes a main substrate and a plurality of sub-substrates. Each sub-substrate has two surfaces on which electronic components are installed. The sub-substrates are mounted on both surfaces of the main substrate within the IC card. Openings in the main substrate receive electronic components installed on the sub-substrates. Such an arrangement makes it possible to provide four layers of electronic components within an IC card.

IC card including multiple substrates bearing electronic components

Growing community of inventors

Kawanishi, Japan

Takaaki Okidono