Tdk Corporation

Tok Corporation

Takaaki Morita

Kenichi Kawabata

Kenichi Yoshida

Masashi Katsumata

Mitsuhiro Tomikawa

Toshikazu Endo

Seiichi Tajima

Yasuyuki Hattori

Takashi Kariya

Seiko Komatsu

Wakiko Sato

Yoshikazu Kanemaru

A multilayer board insulating sheet contains a reducing agent.

Multilayer board insulating sheet, multilayer board, and method of manufacturing multilayer board

A printed wiring board and the like in which local deviations of characteristics of a bamse member using a liquid crystal polymer are reduced. A printed wiring board uses a liquid crystal polymer having wiring formed on at least one surface as a bamse member, in which the bamse member has a degree of crystal orientation of the liquid crystal polymer of 0.3 or less in a plane direction.

Printed wiring board, multilayer printed wiring board and method for manufacturing printed wiring board

A device-embedded board includes a board main body, conductor wiring layers formed inside or on a surface of the board main body, and device formation layers formed inside the board main body so as to be in contact with a portion of the conductor wiring layers. The device formation layer is configured in an insulating region in which functional filler for forming a devices is dispersed.

Device-embedded board and method of manufacturing the same

In a printed wiring board, when a plurality of wiring base bodies are collectively stacked, a constituent material of a first layer of an insulating resin film has a low melting point, so that the first layer is easily melted. Therefore, thermal welding on an upper surface of the wiring base body is reliably performed, and the wiring base bodies are bonded to each other with high reliability.

Printed wiring board and method for manufacturing the same

In an electric component embedded structure, a first electrode terminal provided on a first main surface includes an intra-area terminal, and the intra-area terminal is electrically connected to an overlap portion of an overlap wiring in a formation area of an electric component. Accordingly, a decrease in mounting area of the electric component embedded structure is achieved. The intra-area terminal can be electrically connected to a second electrode terminal provided on a second main surface via a first via-conductor, the overlap wiring, and a second via-conductor. The intra-area terminal is connected to a wiring (an overlap wiring) of a first insulating layer without additionally providing a rewiring layer causing an increase in thickness, and the increase in thickness is curbed, whereby a decrease in size of the electric component embedded structure is achieved.

Electric component embedded structure

In a wiring base body of a printed wiring board, a conductive post including a wiring portion and a wiring are embedded in an insulating resin film. Therefore, even in a region in which a wiring portion is formed, the wiring base body is not increased in thickness. In addition, even in a region in which a wiring is formed, the wiring base body is not increased in thickness. Therefore, it is possible to obtain a printed wiring board having high flatness by stacking a plurality of wiring base bodies and constituting a printed wiring board.

There is disclosed a collective mounting method of electronic components in which a plurality of electronic components can uniformly be pressed to an insulating layer in a short time in a case where the electronic components and a resin layer are fixed. To manufacture a semiconductor-embedded substratein which a plurality of semiconductor devicesare embedded, after disposing the plurality of semiconductor deviceson an unhardened resin layer, this is stored in a containerof a pressurizing and heating unit, the plurality of semiconductor devicesare simultaneously, collectively and isotropically pressurized by use of an internal gas in the containeras a pressure medium to simultaneously press the plurality of semiconductor devicesto the unhardened resin layer, and the resin layeris heated and hardened. In consequence, the plurality of semiconductor devicesare collectively and uniformly fixed and mounted onto the resin layerwithout being influenced by a state change of the resin layer

Collective mounting method of electronic components and manufacturing method of electronic component-embedded substrate

A multilayer circuit board comprises core layersandmade of a core material impregnated with resin, resin layersandinterposed between the core layersand, a wiring patternembedded in the resin layersand. The core layersandhave a thickness of 100 &#x3bc;m or smaller, whereby the entire board can significantly be thinned. Furthermore, the less strong resin layersandare interposed between the hard core layersand, whereby the entire board has increased strength.

Multilayer circuit board and method for manufacturing the same

A method of manufacturing an electronic component-embedded board is provided which is capable of suppressing warpage without requiring complicated processes at low cost and which offers high productivity and economic efficiency. A worksheetincludes insulating layersandon one surface of an approximately rectangular substrate, and an electronic componentand a plate-like frame member (member)embedded inside the insulating layer, wherein the plate-like frame membersatisfying the relationship represented by the following formula (1): &#x3b1;and &#x3b1;. . . (1), is mounted on an unmounted portion of the electronic componenton the substrate. In the formula, &#x3b1;and &#x3b1;respectively denote the linear coefficients of thermal expansion (ppm/K) of the electronic component, the plate-like frame member, and the substrate, the respective wiring layers or the respective insulating layers.

Electronic component-embedded board and method of manufacturing the same

A semiconductor IC-embedded substrate suitable for embedding a semiconductor IC in which the electrode pitch is extremely narrow. The substrate comprises a semiconductor ICin which stud bumpsare provided to the principal surface, a first resin layerfor covering the principal surfaceof the semiconductor IC, and a second resin layerfor covering the back surfaceof the semiconductor IC. The stud bumpsof the semiconductor ICprotrude from the surface of the first resin layer. The method for causing the stud bumpsto protrude from the surface of the first resin layermay involve using a wet blasting method to cause an overall reduction of the thickness of the first resin layer. The stud bumpscan thereby be properly uncovered even when the electrode pitch of the semiconductor ICis narrow.

Semiconductor IC-embedded substrate and method for manufacturing same

There is disclosed a fixing method of an electronic component or the like in which when the electronic component and a resin layer are fixed, warp and bend of the electronic component can be inhibited. During manufacturing of a semiconductor-embedded substratein which a semiconductor deviceis embedded, after the semiconductor deviceis disposed on an unhardened resin layer, this device is stored in a containerof a pressurizing and heating unit, and the semiconductor deviceis isotropically pressurized using an internal gas in the containeras a pressure medium, whereby the semiconductor deviceis pressed to the unhardened resin layer, and the resin layeris heated to harden. In consequence, the semiconductor deviceis fixed and mounted on the resin layerwithout being warped or bent.

Mounting method of electronic components, manufacturing method of electronic component-embedded substrate, and electronic component-embedded substrate

A semiconductor IC-embedded substrate suitable for embedding a semiconductor IC in which the electrode pitch is extremely narrow. The substrate comprises a semiconductor ICin which stud bumpsare provided to the principal surfacea first resin layerfor covering the principal surfaceof the semiconductor ICand a second resin layerfor covering the back surfaceof the semiconductor ICThe stud bumpsof the semiconductor ICprotrude from the surface of the first resin layerThe method for causing the stud bumpsto protrude from the surface of the first resin layermay involve using a wet blasting method to cause an overall reduction of the thickness of the first resin layerThe stud bumpscan thereby be properly uncovered even when the electrode pitch of the semiconductor ICis narrow.

The composite dielectric of the present invention contains an aromatic liquid crystal polyester and a dielectric ceramic powder arranged in the aromatic liquid crystal polyester, wherein the dielectric ceramic powder exhibits a Q value greater than 650 at a frequency of 1 GHz by perturbation. A wiring board comprising a composite dielectric sheet made of a composite dielectric having such a characteristic exhibits a high dielectric constant and a low dielectric dissipation factor, thereby yielding less transmission loss, and thus can favorably be used in electronic instruments driven in high-frequency regions.

Composite dielectric, composite dielectric sheet, composite dielectric paste, metal-layered composite dielectric, wiring board and multilayer wiring board

Growing community of inventors

Tokyo, Japan

Takaaki Morita