Asahi Kasei Chemicals Corporation

Asahi Kasei Kabushiki Kaisha

Takaaki Miyoshi

Kazuya Noda

Kazuhiko Hashimoto

Yosuke Takahashi

Junichi Tsuzuki

Makoto Doki

Matsuyoshi Nakagawa

Kazunori Terada

Naoaki Yamasaki

Mitsuhiro Horio

Hiroaki Furukawa

Yasukazu Shikano

Shunichiro I

Yuuji Yoshinaga

Junichi Nakahashi

Kouji Satou

Nozomi Inagaki

Koichi Ueno

Kazuya Nagata

Koichiro Yoshida

Kazuaki Sanada

Shu Keat Ooi

Shigeki Katayama

Takashi Sanda

The present disclosure relates to a resin composition that exhibits satisfactory flow properties and mechanical properties, to a cellulose formulation that is used to produce the resin composition, and to resin pellets and a molded resin formed by the resin composition.

Cellulose-containing resin composition and cellulosic ingredient

An object of the invention is to provide a resin composition, from which a molded article having high durability, sliding property and wear resistance can be produced with a high productivity. The present invention provides a polyacetal resin composition containing 100 parts by mass of a polyacetal resin (A) and 10 parts by mass or more and 100 parts by mass or less of a glass filler (B), in which when a molded article formed of the polyacetal resin composition by molding is fractured by application of tensile force, the surface of the glass filler (B) protruding from a fractured surface of a fractured molded article is covered with a component containing the polyacetal resin (A) having an average thickness of 0.2 &#x3bc;m or more and 3.0 &#x3bc;m or less.

Polyacetal resin composition and molded article thereof

The resin composition according to the present invention contains a polyacetal resin having a specific molecular weight distribution, a specific carbon black, and an alkaline metal wherein the contents of the carbon black and the alkaline metal are in specific ranges. The molded article according to the present invention contains the resin composition.

Polyacetal resin composition and molded article of the same

The resin molded article of the present invention comprises (B) 0.1 to 5 parts by mass of a sliding agent having a weight average molecular weight of 10,000 or less, and (C) 0.01 to 3 parts by mass of a coloring agent, based on (A) 100 parts by mass of a polyacetal resin, wherein a relative element concentration ratio between carbon and oxygen on a surface thereof [C/O] (atomic %) is 1.01 to 2.50.

Polyacetal resin molded article

A resin composition having a high thermal aging property and molding stability in mass production of molded articles while keeping molding fluidity and thermal creep resistance is provided. A resin composition, containing 100 parts by mass in total of a polypropylene resin (a) and a polyphenylene ether resin (b), and 1 to 20 parts by mass of a compatibilizer (c), wherein in the component (a), the proportion of the component having a molecular weight of 30,000 or less is from 3.0 to 5.1% of the entire component (a), and the proportion of the component having a molecular weight of 10,000,000 or more is from 1.0 to 1.6% of the entire component (a).

Resin composition and method of producing the same

The present invention provides a polyamide-polyphenylene ether resin composition comprising a polyamide having an alicyclic structure and composed of dicarboxylic acid units comprising from 20 to 100 mol % of cyclohexanedicarboxylic acid units and diamine units comprising aliphatic diamine units with from 6 to 12 carbon atoms, a polyphenylene ether, and a compatibilizer for a polyamide and a polyphenylene ether.

Polyamide-polyphenylene ether resin composition and film

Disclosed is a resin composition comprising an aromatic polyamide having a terminal amino group concentration of 5 to 45 &#x3bc;moles/g inclusive, polyphenylene ether, a compatibilizing agent for the polyamide and the polyphenylene ether, and a crystal nucleating agent. The composition is extremely useful in an automotive body panel (e.g., an automotive fender), an SMT-compliant component or the like.

Heat-resistant resin composition

The present invention relates to a method for producing a conductive masterbatch containing a polyamide resin and a carbonaceous filler. The present invention provides a method for producing a conductive masterbatch which can suppress an increase in resin temperature during extrusion, formation of die drips, and strand breakage and can also significantly increase the output of extruding. The method is achieved by the steps of feeding the carbonaceous filler to a molten first polyamide to melt-knead them together and then feeding a second polyamide to the resulting melt-kneaded product to further melt-knead the second polyamide, the carbonaceous filler, and the first polyamide.

Method for producing conductive masterbatch

A shaped resin article comprising a polyamide (A) (comprising at least two different polyamide components), a polyphenylene ether (B) and a partially hydrogenated block copolymer (C) (obtained by partially hydrogenating a block copolymer comprising an aromatic vinyl polymer block and a conjugated diene polymer block) including a block copolymer (C-1) having a number average molecular weight of from 200,000 to 300,000, wherein (A) is present as a continuous phase in which (B) is dispersed to form a dispersed phase, and (C) is present in the continuous phase of (A) and/or the dispersed phase of (B), wherein the surface area of the polyamide (A) exposed on the overall surface of the shaped resin article is at least 80%, based on the surface area of the shaped resin article. A conductive resin composition comprising a polyamide (A), a polyphenylene ether (B), a partially hydrogenated block copolymer (C) comprising an aromatic vinyl polymer block and a conjugated diene polymer block, a conductive carbonaceous material (D) and wollastonite particles (E).

Resin moldings and conductive resin composition

The present invention provides a thermoplastic resin composition obtained by feeding to an extruder and melt-kneading a polyamide; a polyphenylene ether; and a hydrogenated block copolymer (having a packed bulk density of from 0.15 to 0.25 g/cm) prepared by hydrogenating a block copolymer comprising at least one polymer block mainly composed of an aromatic vinyl compound and at least one polymer block mainly composed of a conjugated diene compound.

Polyamide/polyphenylene ether resin composition

A thermoplastic resin composition comprising:

Thermoplastic resin composition

Disclosed is a conductive resin composition containing a polyamide, a polyphenylene ether, a polyester and a conductive carbon filler. The resin composition has attained excellent conductivity by being added with a small amount of the conductive carbon filler, while being excellent in fluidity and surface luster. Also disclosed is a molded body formed from such a resin composition.

Conductive resin composition

A polyamide-polyphenylene ether based resin composition containing 1 to 20 mass ppm of copper and 0.1 to 2 mass % of titanium dioxide and/or carbon black, wherein a dispersed phase containing polyphenylene ether or polyphenylene ether and a partially hydrogenated block copolymer dispersed in the polyamide has a ratio of a volume average particle diameter to a number average particle diameter of the range of 2.0 to 5.0, and the polyphenylene ether in the resin composition has a weight average molecular weight of the range of 45,000 to 65,000.

Resin composition excellent in stability to face impact

The present invention provides a relay block inhibited from occurrence of melt wrinkles and considerably inhibited from deformation of thin wall portions. That is, the present invention provides a relay block obtained by molding a resin composition which contains a polyamide, a polyphenylene ether and a block copolymer comprising at least one polymer block mainly composed of an aromatic vinyl compound and at least one polymer block mainly composed of a conjugated diene compound and which has a melt volume rate of not less than 60 cm/10 min. and a dimensional change after water absorption of not more than 1.0%.

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Tokyo, Japan

Takaaki Miyoshi