Rohm Co., Ltd.

Takaaki Masaki

Satohiro Kigoshi

Shinsei Mizuta

Yuya Hasegawa

Yuji Makimura

An optical sensor includes a substrate including a substrate main surface intersecting a thickness-wise direction, a light emitting element disposed on the substrate main surface, a light receiving element disposed on the substrate main surface, a transparent first cover disposed on the substrate main surface to cover the light emitting element, and a transparent second cover disposed on the substrate main surface to cover the light receiving element. The first cover and the second cover are spaced apart by a gap.

Optical sensor, and method for manufacturing optical sensor

The present disclosure provides a semiconductor device. The semiconductor device includes a semiconductor element, a plurality of terminals, and a sealing resin. The semiconductor element has a front surface and a back surface. The front surface and the back surface face in opposite directions to each other in a thickness direction of the semiconductor element. The plurality of terminals are disposed at a distance from the semiconductor element and are electrically connected to the front surface. The sealing resin has a first surface facing in a same direction as the direction in which the front surface faces. Each of the plurality of terminals has a main surface exposed from the first surface.

Semiconductor device and mounting structure of semiconductor device

A semiconductor device includes a Hall element, a sealing resin and at least one mount surface. The Hall element includes a functional surface and at least one electrode provided on the functional surface. The sealing resin includes a resin obverse surface and a resin reverse surface spaced apart from each other in a thickness direction, and covers at least a portion of the Hall element. The mount surface is electrically connected to the electrode of the Hall element and exposed from the resin reverse surface. The Hall element includes an exposed surface opposite to the functional surface. The exposed surface is flush with either one of the resin obverse surface and the resin reverse surface.

Growing community of inventors

Kyoto, Japan

Takaaki Masaki