Koito Manufacturing Company, Ltd.

Takaaki Komatsu

Yasuaki Tsutsumi

Hisayoshi Daicho

Ippei Yamamoto

Yuji Yasuda

Masanobu Mizuno

Shogo Sugimori

Yuji Higashi

A lamp includes a substrate, a heat-dissipation member, an optical member, and a heat-transfer member. The optical member, the substrate and the heat-dissipation member are arranged in this order. In two members of the heat-dissipation member and the optical member or two members of the heat-dissipation member and the substrate, one end sides thereof are fixed to each other by a fixing mechanism, and the other end sides thereof are hooked and fixed such that the two members are prevented from being displaced in a direction away from each other with the heat-transfer member located between the one end side and the other end side being a support point and the one end side being a force point.

Vehicle lamp having a hooking structure

In a light emitting module, a light wavelength conversation ceramicconverts the wavelength of the light emitted by a semiconductor light emitting elementthen emits the light. An optical filtertransmits the blue light Lb mainly emitted by the semiconductor light emitting elementand reflects the yellow light Ly whose wavelength has been mainly converted by the light wavelength conversion ceramic. The optical filteris provided on the surface of the light wavelength conversion ceramic. The light emitting moduleis manufactured by: the process where the optical filteris provided on at least one surface of the light wavelength conversion ceramic; and the process where the semiconductor light emitting elementand the light wavelength conversion ceramicare arranged such that the light emitted by the semiconductor light emitting elementis incident into the light wavelength conversion ceramic

Light emitting module, method of manufacturing the light emitting module, and lamp unit

A light emitting module includes: an LED chip; a plate-shaped phosphor layer that is provided so as to face the light emitting surface of the LED chip and is configured to convert the wavelength of the light emitted by the LED chip; and a filter layer that is formed, of the surfaces of the phosphor layer, on at least one of the surface that faces the LED chip and the side surface, and that is configured to transmit the light emitted from the LED chip and to reflect the light whose wavelength has been converted by the phosphor layer. The filter layer is formed such that a ratio of the energy of the emitted light within a range of &#xb1;60&#xb0; with respect to the front direction to the total energy of emitted light is 80% or more.

Light emitting module

In a light emitting module, light wavelength conversion ceramicconverts the wavelength of the light emitted by a semiconductor light emitting element. The light wavelength conversion ceramicis made so transparent that the light wavelength conversion ceramichaspercent or more of the total light transmittance of the light with a wavelength within the conversion wavelength range. A reflective filmis provided on the surface of the light wavelength conversion ceramicand narrows down the emission area of the light that has transmitted the light wavelength conversion ceramicto an area smaller than the light emitting area of the semiconductor light emitting element. In the case, the reflective filmguides the light such that the light is emitted in the direction approximately parallel to the light emitting surface of the light emitting element

A light emitting module includes: a plurality of semiconductor light emitting elements; a substrate by which the arranged plurality of semiconductor light emitting elements are supported; and a plate-shaped light wavelength conversion component that is provided so as to face the light emitting surfaces of the plurality of semiconductor light emitting elements and that converts the wavelength of the light emitted by the semiconductor light emitting element. A phosphor layer has a shielding portion formed in the boundary between respective areas facing the respective light emitting surfaces of the adjacent semiconductor light emitting elements.

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Shizuoka, Japan

Takaaki Komatsu