Nichia Corporation

Aoi Electronics Co., Ltd.

Takaaki Kato

Mitsuhiro Isono

Toshiyuki Hashimoto

Takao Ishihara

Hironao Oku

Kazuya Matsuda

Kensuke Maehara

Takashi Yamaji

A light-emitting device includes: a resin package including: a lead part including a first lead and a second lead, each including a main body portion and a raised portion connected to the main body portion, wherein an upper surface of each of the first lead and the second lead includes a first primary surface portion in the main body portion and a curved portion in the raised portion in a cross-sectional view taken in a direction perpendicular to an upper surface of the lead part, and wherein the curved portion is continuous with and curved upward from an end portion of the first primary surface portion, a resin portion, and a recess defined by a portion of the upper surface of the lead part and the resin portion; and a light-emitting element mounted in the resin package. The curved portion is buried in the resin portion.

Light-emitting device

A light emitting device includes: a resin package including: a first lead including: at least one notch extending from an upper surface of the first lead to a lower surface of the first lead, a first groove formed in the upper surface of the first lead, and at least one second groove connecting the first groove with the at least one notch, and a second lead, and a resin body including: a first resin portion, a second resin portion, a part of the second resin portion being disposed in the first groove, a third resin portion disposed between the first lead and the second lead, and a first resin connecting portion connecting the first resin portion with the second resin portion, at least a part of the first resin connecting portion being disposed in the at least one second groove; a light emitting element; and a light reflecting member.

Light emitting device having leads in resin package

A lead frame includes: a plurality of units each including a first lead portion and a second lead portion arranged in a first direction, wherein the units are arranged in the first direction and in a second direction perpendicular to the first direction, and the first lead portion and the second lead portion of each unit are adjacent, in the second direction, to the first lead portion and the second lead portion of an adjacent one of the units that is adjacent in the second direction; a plurality of first suspension portions; and a plurality of connecting portions. Each of the first suspension portions connects, in the second direction, the first lead portions of units that are adjacent to each other in the second direction.

Lead frame

A semiconductor device includes: a semiconductor chip with a plurality of electrode pads disposed at a top surface thereof; a plurality of thin film terminals set apart from one another via respective separator portions, which are located below a bottom surface of the semiconductor chip; an insulating layer disposed between the semiconductor chip and the thin-film terminals; connecting members that connect the electrode pads at the semiconductor chip with the thin-film terminals respectively and a resin layer disposed so as to cover the semiconductor chip, the plurality of thin-film terminals exposed at the semiconductor chip, the separator portions and the connecting members.

Growing community of inventors

Takamatsu, Japan

Takaaki Kato