Kabushiki Kaisha Kobe Seiko Sho

Takaaki Ito

Hiroyuki Shimizu

Tsuyoshi Kurokawa

Fusaki Koshiishi

Kazuhiko Ito

Yasuyuki Yokota

A plating-free solid wire for arc welding has pits opening on its circumference, and wider inside than at each opening, and/or pits having a portion non-irradiated with an externally incoming light. A sulfide and a polyisobutene-containing oil are present in the pits and/or on the wire surface, the latter being present in an amount of 0.1-2 g/10 kg of wire. Twenty or more pits are present in total per and along wire circumference. The effective pit length ratio is 0.5% inclusive-50% exclusive. 0.1-2 g of the oil is present per 10 kg of wire. 0.01-0.5 g/10 kg of 0.1-10-&mgr;m-particle-dia MoS is present in &ldquo;bottleneck-like and/or cave-like pits&rdquo;, on the wire surface or immediately under the wire surface. A 2-10 mass ppm/total wire mass of K compound in K is present in the pits and/or on the wire surface. These ensure good feedability and lubricating properties, and less spatters.

Plating-free solid wire for MAG welding

Described is a solid wire for MAG welding which has no copper plating on the wire surface and which has good welding workabilities such as a reduced amount of generated spatters and good arc stability in the MAG welding of steel sheets. A solid wire for MAG welding comprises, as chemical components for the wire, 0.01 to 0.15 wt % of C, 0.20 to 1.00 wt % of Si, 0.70 to 1.70 wt % of Mn, 0.30 wt % or below of Ti, 0.025 wt % or below of S, 0.020 wt % or below of O, and the balance being Fe and inevitable impurities, wherein said wire is applied on the surface thereof with at least one compound serving as an arc stabilizer and selected from the group consisting of a K compound and a Cs compound in such a way that when an amount of the K compound to be applied to (calculated as K) is taken as Appm relative to the weight of said wire and an amount of the Cs compound (calculated as Cs) is taken as Bppm, a value of (A+3B) is in the range of 2 to 15 ppm. The wire has such a structure as not to be plated with copper on the surface thereof.

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Fujisawa, Japan

Takaaki Ito