Screen Holdings Co., Ltd.

Takaaki Ishizu

Hiroshi Abe

Manabu Okutani

Kenji Kobayashi

Takashi Ota

Ryo Muramoto

Sei Negoro

Wataru Sakai

Yuta Nakano

A substrate processing method includes a step of supplying a dry processing liquid onto the upper surface of the substrate, to thereby form a liquid film of the dry processing liquid on the upper surface of the substrate (Step S), a step of heating the substrate from the side of a lower surface thereof in a state where the liquid film of the dry processing liquid is formed on the upper surface thereof (Step S), and a step of drying the substrate (Step S). The surface tension of the dry processing liquid is lower than that of the rinse liquid. The boiling point of the dry processing liquid is higher than that of the rinse liquid. The heating temperature of the substrate in Step Sis not lower than the boiling point of the rinse liquid and lower than that of the dry processing liquid.

Substrate processing method and substrate processing apparatus

A substrate processing method includes a liquid film forming step of forming a liquid film, a liquid film heat retaining step of keeping the liquid film warm, a gas phase layer forming step of forming a gas phase layer which holds the processing liquid on a center portion of the liquid film, an opening forming step of forming an opening in the center portion of the liquid film by excluding the processing liquid held by the gas phase layer, a substrate rotating step of rotating the substrate around a rotation axis, and an opening expanding step of expanding the opening, while a state in which the gas phase layer is formed on an inner circumferential edge of the liquid film is maintained, by moving the irradiation region toward a circumferential edge portion of the substrate while the liquid film heat retaining step and the substrate rotating step are performed.

In a second liquid supply step, a second liquid film and a first liquid film surrounding a side of the second liquid film are formed on an upper surface of a substrate. Then, in a vapor layer formation step, by heating the substrate, a second vapor layer is formed by evaporating the second liquid contacting the upper surface of the substrate, and the second liquid film is held on the second vapor layer. Since the second liquid included in the second liquid film has a high vapor pressure, a height position of a lower surface of the floating second liquid film may be kept high. By blowing a gas to the floating second liquid film, a hole is formed in the second liquid film, and by expanding the hole toward an outer periphery of the substrate, the first liquid and the second liquid are removed outside the substrate.

Substrate processing method and substrate processing device

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Kyoto, Japan

Takaaki Ishizu