Disco Corporation

Konami Corporation

Takaaki Inoue

Kazuma Sekiya

Shigenori Harada

Shinichi Namioka

Satoshi Ohkawara

Motoki Ishikawa

So Takeyama

A wafer processing method includes: a holding step of holding a wafer on a chuck table through a dicing tape; and a dividing step of cutting the wafer along division lines by a cutting blade. In the dividing step, cleaning water including pure water mixed with carbon dioxide is supplied to the front surface of the wafer, and cutting water including pure water alone or pure water mixed with carbon dioxide in a concentration lower than that of the cleaning water is supplied to the cutting blade. During cutting, therefore, the cleaning water and the cutting water are always shielded by each other. Consequently, the cutting blade can be prevented from being corroded or excessively worn due to the cleaning water, and the cutting water can be prevented from contacting the front surface of the wafer to cause electrostatic discharge damage to the devices.

Wafer processing method

An accommodation cassette including: a plurality of rear accommodating grooves that are formed at least in the laterally central area of the inner surface of a rear wall connecting the rear edges of right and left side walls and extend laterally and parallel to each other at vertical spacings in such a manner as to be associated with right and left accommodating grooves.

Accommodation cassette

A semiconductor wafer processing machine comprising a cassette-placing mechanism having a cassette-placing table for placing a cassette storing a semiconductor wafer, a workpiece take-in/take-out mechanism for taking out the semiconductor wafer stored in the cassette placed on the cassette-placing table and taking the semiconductor wafer into the cassette, a workpiece conveying mechanism for conveying the semiconductor wafer taken out by the workpiece take-in/take-out mechanism, a chuck table mechanism having a chuck table for holding the semiconductor wafer conveyed by the workpiece conveying mechanism, and a processing mechanism for processing the semiconductor wafer held on the chuck table, wherein the cassette-placing mechanism comprises an aligning mechanism for aligning the crystal orientation of the semiconductor wafer, which is situated below the cassette-placing table.

Semiconductor wafer processing machine

A conveying device for a plate-like workpiece, comprising a suction-holding device for suction-holding the plate-like workpiece and a moving device for moving the suction-holding device between a first predetermined position and a second predetermined position, wherein the suction-holding device comprises a plate-like workpiece holding member, non-contact suction-holders disposed on the under surface of the center area of the plate-like workpiece holding member, a restricting device which is mounted on the under surface of the peripheral area of the plate-like workpiece holding member and restricts the movement in the horizontal direction of the plate-like workpiece, and a plurality of falling prevention devices which are mounted in the peripheral area of the plate-like workpiece holding member at predetermined intervals in the circumferential direction and prevent the falling of the plate-like workpiece adsorbed by the non-contact suction-holders.

Convey device for a plate-like workpiece

In a game system having a monitor, an input unit for supplying a signal corresponding to a player's operation, and a game controller for executing a predetermined card game on a game screen of the monitor with reference to the signal supplied from the input unit, the game controller decides a plurality of cards displayed on the game screen in a matrix. The game controller sets the number of lines of a plurality of lines formed by the cards on the game screen, each as an effective line and all of which are in a single, common direction, depending on the value of a play a player sets by operating the input device, and controls a dividend for the player according to a combination of the cards on any of the effective line and a combination of the cards in a direction different from the direction of the effective lines.

Game system, game control method, and computer-readable storage medium

A cutting machine equipped with a cassette placing unit having a cassette table for placing a cassette storing a workpiece supported to an annular support frame via an adhesive tape. The cassette placing unit comprises an ultraviolet light irradiation unit which is disposed below the cassette table, stores a workpiece supported to the support frame by the adhesive tape and irradiates the adhesive tape with ultraviolet rays and an ascending and descending mechanism which positions the cassette placed on the cassette table at a first workpiece carrying-in/carrying-out position which is located in the carrying-in/carrying-out area for the workpiece carrying-in/carrying-out means and the ultraviolet light irradiation unit at a second workpiece carrying-in/carrying-out position which is located in the carrying-in/carrying-out area for the workpiece carrying-in/carrying-out means.

Cutting device

A chuck table includes a pedestal having a circular depression formed in an upper surface thereof, and a disk-like chuck plate positioned in the depression of the pedestal. The chuck plate is fixed in the depression of the pedestal by means of an adhesive interposed between a bottom surface of the depression of the pedestal and a lower surface of the chuck plate. A recess for accepting a surplus of the adhesive is formed in a lower end portion of a side surface of the depression of the pedestal.

Growing community of inventors

Tokyo, Japan

Takaaki Inoue