Hitachi Cable, Inc.

Hitachi Metals, Ltd.

Takaaki Ichikawa

Seigi Aoyama

Hakaru Matsui

Osamu Seya

Koichi Tamura

Ryohei Okada

Katsuo Endo

Masato Ito

Hiromitsu Kuroda

Hideki Saito

Hiroshi Yamanobe

Hiroyoshi Hiruta

Tsutomu Komori

Hajime Kimura

Masashi Kunii

Takashi Nemoto

Yuju Endo

Hiroshi Komuro

Toshiyuki Horikoshi

Fumitaka Nakahigashi

Hideo Matsuo

Noboru Nakakuki

Shigetoshi Goto

Hidenori Kobayashi

Atsushi Ohtake

A method of manufacturing a Cu alloy conductor includes the steps of:

Cu alloy material, method of manufacturing Cu alloy conductor using the same, Cu alloy conductor obtained by the method, and cable or trolley wire using the Cu alloy conductor

A straight angle conductoris provided with a cladding material including a core-sheet metaland conductor-sheet metalsthat sandwich both surfaces of the core-sheet metal. The conductor-sheet metalshaving a volume resistivity equal to or less than 5.0 (&#x3bc;&#x3a9;&#xb7;cm) wraps both sides of the core-sheet metalhaving a thermal expansion coefficient equal to or less than 10 (&#xd7;10/C. &#xb0;) to prevent the core-sheet metalfrom being exposed to an outside of the conductor-sheet metals. As a result, it prevents occurrence of an electrical potential difference in a boundary side face between the core-sheet metaland the conductor-sheet metalsto improve corrosion resistance. Especially even when the straight angle conductoris used on a silicon crystal wafer for a solar cell, damage of the silicon crystal wafer caused by heat occurring in soldering process of the conductoror a change in temperature on use thereof for a solar cell is avoided.

Straight angle conductor and method of manufacturing the same

A flat cable conductor has: a conductor made of copper or a copper alloy; a first plating film made of tin and/or a tin-copper alloy, the first plating film being formed around the conductor; and a second plating film made of an alloy of tin and a third element selected from Au, Ag, Ni, Ge, Zn and Bi, the second plating film being formed around the first plating film. The third element has a concentration of 0.01 or more and 80 or less wt % at an outer surface of the second plating film.

Flat cable conductor, method of making the same and flat cable using the same

In a lead-free solder comprising an alloy composition composed mainly of tin, the alloy composition further contains 0.002 to 0.015% by mass of phosphorus. This lead-free solder can be used as a plating in a connection lead comprising: a copper strip or other strip conductor; and the plating provided on at least one side of the strip constructor, the plating having a shape such that the plating in the widthwise direction of the strip conductor has a bulge as viewed in section with the apex being located at a proper position in the widthwise direction of the strip conductor. By virtue of this constitution, the lead-free solder on its surface is less likely to be oxidized, and the connection lead has excellent bond strength owing to the property of the lead-free solder and, in addition, has the function of breaking the formed oxide layer and the function of removing included gas bubbles and can eliminate the need to form the plating in very large thickness. Further, the lead-free solder can be used as a connection element in an electrical component that is less likely to cause oxidation of the connection element on its surface and, thus, can have a strong connection structure by the connection element.

Lead-free solder, and connection lead and electrical component using said lead-free solder

A process for forming an ultrafine copper alloy wire is provided. The alloy includes a copper matrix of high purity copper having a total unavoidable impurity content of not more than 10 mass ppm. The matrix contains 0.05 to 0.9 mass % of at least one metallic element of the group of tin, indium, silver, antimony, magnesium, aluminum, and boron. The alloy is melted in a carbon crucible. The molten alloy is cast into a wire rod utilizing a carbon mold. The wire rod is then subjected to a primary wire drawing, an annealing, and a secondary wire drawing. The produced ultrafine copper alloy wire has excellent tensile strength, electrical conductivity, and drawability.

Process for forming an ultrafine copper alloy wire

This invention provides a composite conductor having excellent strength, flexing resistance and corrosion resistance, a production method thereof and a cable employing the same composite conductor. A corrosion resistant layer is formed of Au, Ag, Sn, Ni, solder, Zn, Pd, Sn&mdash;Ni alloy, Ni&mdash;Co alloy, Ni&mdash;P alloy, Ni&mdash;Co&mdash;P alloy, Cu&mdash;Zn alloy, Sn&mdash;Bi alloy, Sn&mdash;Ag&mdash;cu alloy, Sn&mdash;Cu alloy or Sn&mdash;Zn alloy in the thickness of 0.5 &mgr;m or more on an external periphery of a core made of copper-metal fiber conductor. A wire material made of the copper-metal fiber conductor is subjected to area reduction processing. In the middle of the area reduction processing or after the area reduction processing is completed, corrosion resistant layer is formed on the periphery of the wire material in the thickness of 0.5 &mgr;m or more by plating with Au, Ag, Sn, Ni, solder, Zn, Pd, Sn&mdash;Ni alloy, Ni&mdash;Co alloy, Ni&mdash;P alloy, Ni&mdash;Co&mdash;P alloy, Cu&mdash;Zn alloy, Sn&mdash;Bi alloy, Sn&mdash;Ag&mdash;Cu alloy, Sn&mdash;Cu alloy or Sn&mdash;Zn alloy.

Composite conductor, production method thereof and cable using the same

In an extrafine or ultrafine copper alloy wire having an outer diameter of not more than 0.1 mm, the copper alloy wire is formed of a heat treated copper alloy comprising 0.05 to 0.9% by weight in total of at least one metallic element selected from the group consisting of tin, indium, silver, antimony, magnesium, aluminum, and boron and not more than 50 ppm of oxygen with the balance consisting of copper. By virtue of this constitution, the extrafine or ultrafine copper alloy wire has a combination of excellent bending fatigue lifetime based on high tensile strength and excellent torsional strength based on high elongation or a combination of excellent tensile strength, electrical conductivity, and drawability and good elongation. The invention has been described in detail with particular reference to preferred embodiments, but it will be understood that variations and modifications can be effected within the scope of the invention as set forth in the appended claims.

Extrafine copper alloy wire, ultrafine copper alloy wire, and process for producing the same

A flexible flat cable has a single conductor or a plurality of conductors, juxtaposed to each other or one another, which are sandwiched between a pair of plastic films with an adhesive to form an integral structure. The plastic films with an adhesive have a modulus of longitudinal elasticity of not less than 300 kg/mm and an elongation of not less than 20%. The plastic films are formed of a polyimide. The adhesive is formed of an epoxy having a glass transition temperature Tg of 80&deg; C. or above, and the 180&deg; peel strength between the adhesive and the single conductor or the plurality of conductors is not less than 0.5 kg/cm.

Heat-resistant, flex-resistant flexible flat cable and process for producing the same

In FFC1 integrated by sandwiching flat type conductors between plastic films with adhesives, wherein the conductors are formed of pure copper or a copper alloy having a wiredrawing draught of at least 95% and an elongation of at least 5%, and the plastic films with adhesives are formed of one having a modulus of longitudinal elasticity of at least 280 kg/mm and an elongation of at least 80%, and the 180&deg; peel strength between the adhesives and the conductors is made to be at least 0.8 kg/cm. As a result, even if the number of conductors is increased than the conventional FFC, bending-resistant characteristic equal to or higher than the conventional FFC can be exhibited.

Bending-resistant flexible flat cable and production process thereof

An ultrafine copper alloy wire drawn to a diameter of not more than 0.08 mm is provided which is formed of an alloy having a copper matrix of high purity copper with a total unavoidable impurity content of not more than 10 mass ppm. Contained in the matrix is 0.05 to 0.9 mass % of at least one metallic element selected from the group including tin, indium, silver, antimony, magnesium, aluminum, and boron. By virtue of this constitution, the ultrafine copper alloy wire has excellent tensile strength, electrical conductivity, and drawability.

Ultrafine copper alloy wire and process for producing the same

A method for processing a terminal of a cable including a plurality of fine coaxial cables arranged in parallel and a terminal-processed tape-shaped cable are provided. After sheaths closer to the terminal of a plurality of fine coaxial cables are removed to expose outer conductors, the outer conductors thus exposed are removed in such a way that the entirety of the outer conductors thus exposed are covered with a solder layer, then the solder layer and the outer conductors are separated at a processing groove formed at a predetermined position on this solder layer, and respective portions of the outer conductors closer to the end of the cable relative to the position of the separation are removed in a lump.

Terminal-processed structure of tape-shaped cable including plurality of coaxial cables arranged in parallel and method for processing terminal of the same

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Ibaraki, Japan

Takaaki Ichikawa